JPH03158B2 - - Google Patents
Info
- Publication number
- JPH03158B2 JPH03158B2 JP9876582A JP9876582A JPH03158B2 JP H03158 B2 JPH03158 B2 JP H03158B2 JP 9876582 A JP9876582 A JP 9876582A JP 9876582 A JP9876582 A JP 9876582A JP H03158 B2 JPH03158 B2 JP H03158B2
- Authority
- JP
- Japan
- Prior art keywords
- tin
- composition
- solder
- silver
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 37
- 239000000203 mixture Substances 0.000 claims description 32
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 28
- 239000010949 copper Substances 0.000 claims description 25
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 20
- 229910052709 silver Inorganic materials 0.000 claims description 20
- 239000004332 silver Substances 0.000 claims description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- 229910052802 copper Inorganic materials 0.000 claims description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 24
- 239000004065 semiconductor Substances 0.000 description 16
- 239000010931 gold Substances 0.000 description 11
- 238000011156 evaluation Methods 0.000 description 9
- 229910052759 nickel Inorganic materials 0.000 description 8
- 238000007747 plating Methods 0.000 description 8
- 229910017944 Ag—Cu Inorganic materials 0.000 description 7
- 229910020888 Sn-Cu Inorganic materials 0.000 description 7
- 229910019204 Sn—Cu Inorganic materials 0.000 description 7
- 230000017525 heat dissipation Effects 0.000 description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 229910020220 Pb—Sn Inorganic materials 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 229910018731 Sn—Au Inorganic materials 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229910020174 Pb-In Inorganic materials 0.000 description 1
- 229910020816 Sn Pb Inorganic materials 0.000 description 1
- 229910020836 Sn-Ag Inorganic materials 0.000 description 1
- 229910020922 Sn-Pb Inorganic materials 0.000 description 1
- 229910020935 Sn-Sb Inorganic materials 0.000 description 1
- 229910020988 Sn—Ag Inorganic materials 0.000 description 1
- 229910008783 Sn—Pb Inorganic materials 0.000 description 1
- 229910008757 Sn—Sb Inorganic materials 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/268—Pb as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9876582A JPS58215289A (ja) | 1982-06-09 | 1982-06-09 | ダイボンデイング用はんだ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9876582A JPS58215289A (ja) | 1982-06-09 | 1982-06-09 | ダイボンデイング用はんだ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58215289A JPS58215289A (ja) | 1983-12-14 |
| JPH03158B2 true JPH03158B2 (de) | 1991-01-07 |
Family
ID=14228490
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9876582A Granted JPS58215289A (ja) | 1982-06-09 | 1982-06-09 | ダイボンデイング用はんだ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58215289A (de) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2178683A (en) * | 1985-07-11 | 1987-02-18 | Nat Semiconductor Corp | Improved semiconductor die-attach method and product |
| JPS6272496A (ja) * | 1985-09-26 | 1987-04-03 | Matsuo Handa Kk | はんだ合金 |
-
1982
- 1982-06-09 JP JP9876582A patent/JPS58215289A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58215289A (ja) | 1983-12-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8125090B2 (en) | Semiconductor power module | |
| US4330329A (en) | Gold bonding wire for semiconductor elements and the semiconductor element | |
| JP6145164B2 (ja) | 鉛フリーはんだ、鉛フリーはんだボール、この鉛フリーはんだを使用したはんだ継手およびこのはんだ継手を有する半導体回路 | |
| KR20190132566A (ko) | 면 실장 부품의 솔더링 방법 및 면 실장 부품 | |
| US20040241039A1 (en) | High temperature lead-free solder compositions | |
| US4750029A (en) | Copper base lead material for leads of semiconductor devices | |
| JP4595877B2 (ja) | 半導体パワーモジュール | |
| JPH03158B2 (de) | ||
| JP6529632B1 (ja) | はんだ合金、ソルダペースト、成形はんだ、及びはんだ合金を用いた半導体装置 | |
| JP6083451B2 (ja) | 面実装部品のはんだ付け方法および面実装部品 | |
| JPH03185741A (ja) | 半導体装置及びその製造方法 | |
| US20090166876A1 (en) | Semiconductor device and die bonding material | |
| JP2000079494A (ja) | はんだ合金 | |
| JPS6335359B2 (de) | ||
| JP3184449B2 (ja) | 半導体素子用ダイボンド材 | |
| JP2910527B2 (ja) | 高温はんだ | |
| EP0507718A1 (de) | Bleiarme Pb-Sn-Ag-Sb-Weichlotlegierung zur Verwendung in metallisierten Verbindungsstrukturen | |
| JPS6244817B2 (de) | ||
| JP3147601B2 (ja) | 高温強度に優れた半導体装置組立用Ｐｂ合金はんだ材 | |
| JPS6155774B2 (de) | ||
| JPH03291340A (ja) | 半導体装置用銅合金極細線及び半導体装置 | |
| JPH01291435A (ja) | 半導体装置用銅合金極細線及び半導体装置 | |
| JPS6312385B2 (de) | ||
| JP3142912B2 (ja) | はんだ材料 | |
| JPS6197843A (ja) | 半導体装置 |