JPH0315839B2 - - Google Patents
Info
- Publication number
- JPH0315839B2 JPH0315839B2 JP59162250A JP16225084A JPH0315839B2 JP H0315839 B2 JPH0315839 B2 JP H0315839B2 JP 59162250 A JP59162250 A JP 59162250A JP 16225084 A JP16225084 A JP 16225084A JP H0315839 B2 JPH0315839 B2 JP H0315839B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- printed circuit
- circuit board
- regulating means
- positioning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000001105 regulatory effect Effects 0.000 claims description 30
- 239000000758 substrate Substances 0.000 claims description 19
- 238000007650 screen-printing Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 238000007639 printing Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Description
【発明の詳細な説明】
(イ) 産業上の利用分野
本発明は、チツプ状の電子部品を、自動的にプ
リント基板の所定銅箔位置に仮固定するとき、接
着剤を前記プリント基板に塗布するためのプリン
ト基板の位置決め装置に関する。[Detailed Description of the Invention] (a) Industrial Application Field The present invention provides a method for automatically temporarily fixing a chip-shaped electronic component to a predetermined copper foil position on a printed circuit board by applying an adhesive to the printed circuit board. The present invention relates to a positioning device for a printed circuit board.
(ロ) 従来の技術
一般にチツプ状の電子部品（チツプ部品と呼ば
れている）が、小電力用のプリント基板、例えば
電子機器における高周波基板においては、近年非
常に多く使用され始め、これらを前記プリント基
板に装着する場合、チツプマウンタと称せられる
装置が用いられている。(b) Prior Art In recent years, chip-shaped electronic components (called chip components) have begun to be used in large numbers in low-power printed circuit boards, such as high-frequency circuit boards in electronic equipment. When mounting on a printed circuit board, a device called a chip mounter is used.
そこで前記チツプマウンタでは、実際にプリン
ト基板の所定銅箔に前記チツプ部品の各電極を半
田付する前に、その準備段階即ち前工程として、
前記プリント基板に接着剤またはクルームハンダ
をスクリーン印刷により塗布する方法がとられて
いる。その一例としてスクリーン印刷機用治具が
実公昭57−29346号公報に示されており、スクリ
ーン印刷時受台の高さを調節する技術が示されて
いる。 Therefore, in the chip mounter, before actually soldering each electrode of the chip component to a predetermined copper foil of a printed circuit board, as a preparatory step, that is, a pre-process,
A method is used in which adhesive or chrome solder is applied to the printed circuit board by screen printing. As an example, a jig for a screen printing machine is disclosed in Japanese Utility Model Publication No. 57-29346, which describes a technique for adjusting the height of a pedestal during screen printing.
ところが受台の高さのみを調節しただけでは、
スクリーン印刷するインク（接着剤）の塗布位置
が正確に規制できず、現在第５図イに示すように
固定ガイド１，２に対して、可動ガイド３，４を
矢印方向Ａ及びＢの方向に移動させ、第５図ロに
示すようにプリント基板５を位置決めしていた。 However, if you only adjust the height of the pedestal,
The application position of the ink (glue) for screen printing cannot be accurately regulated, and currently the movable guides 3 and 4 are moved in the directions of arrows A and B relative to the fixed guides 1 and 2, as shown in Figure 5A. Then, the printed circuit board 5 was positioned as shown in FIG. 5B.
(ハ) 発明が解決しようとする問題点
第５図イ，ロに示した従来例ではプリント基板
の外形縁による位置決め、所謂外形基準による位
置決めしか行うことができない。(C) Problems to be Solved by the Invention In the conventional example shown in FIGS. 5A and 5B, positioning can only be performed using the outer edge of the printed circuit board, or the so-called outer shape reference.
ところが現在用いられているプリント基板は、
外形基準によるものと、位置決め孔基準によるも
のとがあり、いずれにも適用できる位置決め装置
が要求されている。 However, the printed circuit boards currently in use are
There is a need for a positioning device that can be applied to both types, one based on external dimensions and the other based on positioning holes.
(ニ) 問題点を解決する手段
本発明において、第１及び第２の基板規制手段
を搬送用基台に対して上下移動できるように取付
けた構成である。(d) Means for Solving Problems In the present invention, the first and second substrate regulating means are attached so as to be movable up and down with respect to the transport base.
(ホ) 作用
本発明の前記構成において、前記第１の基板規
制手段又は第２の基板規制手段が搬送用基台に対
して上下移動できることから、先ず外形基準の場
合、前記第１及び第２の基板規制手段はプリント
基板の外形を規制し、一方位置決め孔基準の場合
は、前記第１及び第２の基板規制手段はプリント
基板の位置決め孔に挿入した際に位置決めが行え
る。(E) Effect In the above structure of the present invention, since the first substrate regulating means or the second substrate regulating means can be moved up and down with respect to the transport base, first, in the case of the external shape reference, the first and second substrate regulating means The board regulating means regulates the outer shape of the printed circuit board, while in the case of positioning hole reference, the first and second board regulating means can perform positioning when inserted into the positioning hole of the printed circuit board.
(ヘ) 実施例
第１図は、本発明のプリント基板の位置決め装
置の平面図、第２図は外形基準による場合の第１
図におけるＸ−X′断面図、第３図は位置決め孔
基準による場合の第１図におけるＸ−X′断面図、
第４図は第１図における印刷ステーシヨンのＹ−
Y′における断面図を示す。(F) Embodiment FIG. 1 is a plan view of the printed circuit board positioning device of the present invention, and FIG.
XX' sectional view in the figure, FIG. 3 is an XX' sectional view in FIG. 1 based on the positioning hole reference,
Figure 4 shows the printing station Y- in Figure 1.
A cross-sectional view at Y' is shown.
図面において、６，６は搬送用基台、７，７は
コンベアベルト、８はピン取付基台、９は第１の
基板規制手段、１０は第２の基板規制手段、１１
は第３の基板規制手段、１２は基板押え、１３は
前記第１の基板規制手段に設けた第１の規制ピ
ン、１４，１５は各々前記第２の基板規制手段と
して設けた第２の規制ピン及びプツシユレバー、
１６は真空吸着治具、１７は印刷ステーシヨン
で、前記基板吸着治具を上下させるシリンダ１８
及び１９、基板支持具２０，２１、スキージ２
２、スクリーン２３を備えている。 In the drawing, 6 and 6 are conveyor bases, 7 and 7 are conveyor belts, 8 is a pin mounting base, 9 is a first board regulating means, 10 is a second board regulating means, and 11
12 is a third board regulating means, 12 is a board presser, 13 is a first regulating pin provided on the first board regulating means, and 14 and 15 are second regulating means provided as the second board regulating means. pin and push lever,
16 is a vacuum suction jig; 17 is a printing station; and a cylinder 18 for raising and lowering the substrate suction jig.
and 19, substrate supports 20, 21, squeegee 2
2. It is equipped with a screen 23.
次に第１図により本発明装置を説明すると、プ
リント基板５は図面の左方向から右方向にコンベ
アベルト７，７に載置された後に移動し、第２の
基板規制手段１０にて右方向への移動を停止させ
る。 Next, the apparatus of the present invention will be explained with reference to FIG. Stop moving to.
ここで位置決めを外形基準による場合、第２図
に示すように、前記第２の基板規制手段１０のプ
ツシユレバー１５のテーパー部２４にて停止した
プリント基板５は実線の位置（レベルＣと称す
る）となり、この状態で真空吸着治具１６を二点
鎖線位置まで上昇させると、前記プリント基板５
は前記プツシユレバー１５に設けたスプリング２
５により左方向に付勢されて、前記プリント基板
５の左端は第１の基板規制手段９に設けた第１の
規制ピン１３にて左方向への移動が規制され、プ
リント基板５の位置決めが行われる。 If the positioning is based on the external shape, the printed circuit board 5 stopped at the tapered portion 24 of the push lever 15 of the second circuit board regulating means 10 will be at the position indicated by the solid line (referred to as level C), as shown in FIG. In this state, when the vacuum suction jig 16 is raised to the position shown by the two-dot chain line, the printed circuit board 5
is the spring 2 provided on the push lever 15.
5, the left end of the printed circuit board 5 is restricted from moving to the left by a first regulating pin 13 provided on the first board regulating means 9, and the positioning of the printed circuit board 5 is restricted. It will be done.
この状態で前記真空吸着治具１６により前記プ
リント基板５を吸着し、右方向に配設した印刷ス
テーシヨン１７にてインク又は接着剤がスクリー
ン印刷される。 In this state, the printed circuit board 5 is suctioned by the vacuum suction jig 16, and ink or adhesive is screen printed at the printing station 17 disposed on the right side.
一方位置決め孔基準によつて位置決めを行う場
合、第３図のコンベアベルト７により搬送された
プリント基板５は実線位置にて、第２の基板規制
手段１０の基板ストツパー１５′に当接し、真空
吸着手段１６を下方から上昇させて、レベルＣか
らレベルＤにプリント基板５を移動させる。 On the other hand, when positioning is performed using the positioning hole reference, the printed circuit board 5 conveyed by the conveyor belt 7 in FIG. The printed circuit board 5 is moved from the level C to the level D by raising the means 16 from below.
これによりプリント基板５に設けた位置決め孔
２６，２６に第１の規制ピン１３及び第２の規制
ピン１４が挿入され、２点鎖線の状態で真空吸着
治具１６によつてプリント基板５を吸着し、前述
と同様に右方向に配設した印刷ステーシヨン１７
にてインク又は接着剤がスクリーン印刷される。 As a result, the first regulating pin 13 and the second regulating pin 14 are inserted into the positioning holes 26 and 26 provided in the printed circuit board 5, and the printed circuit board 5 is sucked by the vacuum suction jig 16 in the state shown by the two-dot chain line. However, the printing station 17 is placed on the right side in the same way as described above.
The ink or adhesive is screen printed.
そこで前述のプリント基板５が真空吸着治具１
６に対して位置決め吸着され、レベルＤの状態で
スクリーン２３の下に入る。前記プリント基板５
は前記真空吸着治具１７に吸着されたままシリン
ダ１８によりレベルＥに向つて上方に移動され
る。 Therefore, the aforementioned printed circuit board 5 is attached to the vacuum suction jig 1.
6 and is positioned under the screen 23 at level D. The printed circuit board 5
is moved upward toward level E by the cylinder 18 while being sucked by the vacuum suction jig 17.
次に一対の基板支持台２０，２１の先端部２
７，２８が破線部分まで移動し、プリント基板５
は支えられる。 Next, the tip portions 2 of the pair of substrate support stands 20 and 21
7 and 28 move to the broken line area, and the printed circuit board 5
is supported.
この状態でスキージ２２からインク又は接着剤
がスクリーンを通してプリント基板５に供給さ
れ、スクリーン印刷が完了する。 In this state, ink or adhesive is supplied from the squeegee 22 to the printed circuit board 5 through the screen, and screen printing is completed.
次に基板支持台２０，２１が左右に移動し、プ
リント基板５は前記真空吸着治具１６に真空吸着
された該プリント基板５と真空吸着治具１６は下
方に移動し、再びレベルＤまで下がる。 Next, the substrate support stands 20 and 21 move left and right, and the printed circuit board 5 is vacuum-adsorbed by the vacuum suction jig 16, and the printed circuit board 5 and the vacuum suction jig 16 move downward and lower to level D again. .
このとき前記真空吸着治具１６の下部はシリン
ダ１９の先端に当る。（シリンダ１８は図示の状
態より下つている。）この状態で真空吸着治具１
６の真空を切つて、下降する（シリンダ１９の下
降に伴つて）と、前記プリント基板５はコンベア
ベルト７，７上り乗り、該コンベアベルト７，７
の移動でプリント基板５は搬送され、次の工程へ
送られる。 At this time, the lower part of the vacuum suction jig 16 hits the tip of the cylinder 19. (The cylinder 18 is lower than the state shown in the figure.) In this state, the vacuum suction jig 1
When the vacuum of 6 is turned off and the cylinder 19 descends (accompanying the descent of the cylinder 19), the printed circuit board 5 rides on the conveyor belts 7, 7,
The printed circuit board 5 is transported by this movement and sent to the next process.
前述の実施例で第２図及び第３図の各基準に対
して第１の規制手段は同一素子で事足り、第２の
規制手段は位置決め孔基準による場合、第２の規
制ピンを有した同規制手段に交換する構成となし
てある。又第１の基板規制手段９に設けた第１の
規制ピン１３はピン取付基台８に対してボルト２
９の調整により、図面左右位置の調整が行える。
同様に第２の規制手段１４，１５もピン取付基台
８に対してボルト２９，２９の調整により、図面
における左右位置の調整が行える。 In the above-mentioned embodiment, the same element is sufficient for the first regulating means for each of the standards shown in FIGS. It is configured to be replaced with a regulating means. Further, the first regulating pin 13 provided on the first substrate regulating means 9 is attached to the bolt 2 with respect to the pin mounting base 8.
By adjusting 9, the horizontal position of the drawing can be adjusted.
Similarly, the second regulating means 14 and 15 can also be adjusted in their left and right positions in the drawings by adjusting the bolts 29 and 29 with respect to the pin mounting base 8.
(ト) 発明の効果
本発明のプリント基板の位置決め装置によれ
ば、外形基準及び位置決め孔基準による場合のい
ずれにも対応でき、特にスクリーン印刷の前工程
として真空吸着治具による吸着前の位置決めが極
めて効率良く行われる。(G) Effects of the Invention According to the printed circuit board positioning device of the present invention, it is possible to deal with both the case based on the external shape reference and the positioning hole reference, and in particular, positioning before suction using a vacuum suction jig is possible as a pre-process of screen printing. This is done extremely efficiently.
第１図は本発明のプリント基板の位置決め装置
の平面図、第２図及び第３図は本発明の同装置の
実施例を示す側面図、第４図は同装置に用いる印
刷ステーシヨンの一例を示す正面図、第５図は従
来の同装置の概略平面図である。
主な図番の説明、５……プリント基板、６……
搬送用基台、７……コンベアベルト、８……ピン
取付台、９……第１の基板規制手段、１０……第
２の基板規制手段、１１……第３の基板規制手
段、１３……第１の規制ピン、１４……第２の規
制ピン、１６……真空吸着治具。
FIG. 1 is a plan view of a printed circuit board positioning device according to the present invention, FIGS. 2 and 3 are side views showing an embodiment of the same device according to the present invention, and FIG. 4 is an example of a printing station used in the device. The front view shown in FIG. 5 is a schematic plan view of the conventional device. Explanation of main drawing numbers, 5...Printed circuit board, 6...
Conveyance base, 7... Conveyor belt, 8... Pin mounting base, 9... First board regulating means, 10... Second board regulating means, 11... Third board regulating means, 13... ...First regulation pin, 14...Second regulation pin, 16...Vacuum suction jig.
Claims (1)
帯状体を有する搬送手段と、前記帯状体に平行し
て設けた搬送用基台と、前記帯状体の上方位置
で、前記搬送用基台に対して上下移動するように
取付けられ相対向する第１及び第２の基板規制手
段と、前記基板の90°異なる方向で押圧する第３
の基板規制手段と、前記基板の一面を押圧する基
板押えと、前記基板を上下移動させると共に前記
スクリーン印刷位置に基板を移動させる移動手段
とより成り、前記第１及び第２の基板規制手段に
より前記基板の外形基準による位置決め又は位置
決め孔基準による位置決めを行うことを特徴とし
たプリント基板の位置決め装置。1. A transport means having a pair of belt-like bodies for transporting the substrate to a screen printing position, a transport base provided in parallel to the belt-like bodies, and a transport means that is positioned above the belt-like bodies, relative to the transport base. first and second substrate regulating means that are mounted so as to move up and down and face each other; and a third substrate that presses the substrate in a direction 90° different from the substrate.
a substrate regulating means for pressing one surface of the substrate, and a moving means for moving the substrate up and down and moving the substrate to the screen printing position, and the first and second substrate regulating means A positioning device for a printed circuit board, characterized in that positioning is performed based on an external shape reference of the board or positioning hole reference.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16225084A JPS6140099A (en) | 1984-07-31 | 1984-07-31 | Device for positioning printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16225084A JPS6140099A (en) | 1984-07-31 | 1984-07-31 | Device for positioning printed board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6140099A JPS6140099A (en) | 1986-02-26 |
| JPH0315839B2 true JPH0315839B2 (en) | 1991-03-04 |
Family
ID=15750850
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16225084A Granted JPS6140099A (en) | 1984-07-31 | 1984-07-31 | Device for positioning printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6140099A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002239446A (en) * | 2001-02-14 | 2002-08-27 | Chugai Ro Co Ltd | Substrate coating apparatus |
| JP5084646B2 (en) * | 2008-07-14 | 2012-11-28 | Ｊｕｋｉ株式会社 | Substrate positioning mechanism and substrate transfer device |
-
1984
- 1984-07-31 JP JP16225084A patent/JPS6140099A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6140099A (en) | 1986-02-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7281472B2 (en) | Screen printing apparatus and screen printing method | |
| WO2018070016A1 (en) | Screen printer | |
| JP2006228774A (en) | Electronic component packaging system and electronic component packaging method | |
| US5493969A (en) | Screen printing apparatus and screen printing method | |
| US5964031A (en) | Method for supporting printed circuit board assemblies | |
| US7712432B2 (en) | Printing apparatus and method for bonding material | |
| JPH0315839B2 (en) | ||
| JP3829612B2 (en) | Solder bump forming apparatus, solder bump forming method, solder paste printing apparatus, and solder paste printing method | |
| JP4168973B2 (en) | Screen printing apparatus and screen printing method | |
| JPH07195657A (en) | Cream solder coating device | |
| JPH08279695A (en) | Printed board retaining equipment | |
| JPH02235400A (en) | Mounting device of electronic component | |
| JP2002134894A (en) | Solder bump forming apparatus and method therefor | |
| JPH0393543A (en) | Substrate supporting device for screen printing device | |
| JP2000151088A (en) | Apparatus for mountiing electronic component and method of mounting | |
| JPH0446868B2 (en) | ||
| JP2507698Y2 (en) | Electronic component mounting equipment | |
| JPH05110297A (en) | Board positioning equipment | |
| JP2001119133A (en) | Solder paste printing method, solder printing method, and method of manufacturing wiring board and electrical device | |
| JP4241497B2 (en) | Screen printing apparatus and screen printing method | |
| WO2020152735A1 (en) | Transporting device | |
| JP4288779B2 (en) | BGA device mounting method and BGA device mounting apparatus | |
| JPH04325000A (en) | Board positioning device | |
| JPH05211390A (en) | Mounting method of surface mounting part | |
| JPH07212015A (en) | Electronic part mounting method and electronic part mounting machine |