JPH0314914B2 - - Google Patents
Info
- Publication number
- JPH0314914B2 JPH0314914B2 JP8124986A JP8124986A JPH0314914B2 JP H0314914 B2 JPH0314914 B2 JP H0314914B2 JP 8124986 A JP8124986 A JP 8124986A JP 8124986 A JP8124986 A JP 8124986A JP H0314914 B2 JPH0314914 B2 JP H0314914B2
- Authority
- JP
- Japan
- Prior art keywords
- dispersion
- carbon black
- hydroxide
- conductive
- black particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 claims description 23
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 239000012811 non-conductive material Substances 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 238000009713 electroplating Methods 0.000 claims description 3
- 239000006229 carbon black Substances 0.000 claims 13
- 239000006185 dispersion Substances 0.000 claims 13
- 239000002245 particle Substances 0.000 claims 11
- 239000007788 liquid Substances 0.000 claims 5
- 229910001854 alkali hydroxide Inorganic materials 0.000 claims 4
- 150000008044 alkali metal hydroxides Chemical class 0.000 claims 4
- 239000002612 dispersion medium Substances 0.000 claims 4
- WMFOQBRAJBCJND-UHFFFAOYSA-M Lithium hydroxide Chemical compound [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 claims 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 2
- 229910052910 alkali metal silicate Inorganic materials 0.000 claims 2
- 229910021485 fumed silica Inorganic materials 0.000 claims 2
- 239000004094 surface-active agent Substances 0.000 claims 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 claims 1
- 229910019142 PO4 Inorganic materials 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 125000005233 alkylalcohol group Chemical group 0.000 claims 1
- 239000000908 ammonium hydroxide Substances 0.000 claims 1
- 239000003945 anionic surfactant Substances 0.000 claims 1
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 claims 1
- 239000000920 calcium hydroxide Substances 0.000 claims 1
- 229910001861 calcium hydroxide Inorganic materials 0.000 claims 1
- 125000004432 carbon atom Chemical group C* 0.000 claims 1
- 238000005530 etching Methods 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 239000010452 phosphate Substances 0.000 claims 1
- -1 phosphate ester Chemical class 0.000 claims 1
- 238000000926 separation method Methods 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- 238000005406 washing Methods 0.000 claims 1
- 238000007772 electroless plating Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US72196485A | 1985-04-11 | 1985-04-11 | |
| US721964 | 1985-04-11 | ||
| US802892 | 1991-12-06 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2131324A Division JPH0665755B2 (ja) | 1985-04-11 | 1990-05-23 | 金属メツキを増強するのに適する分散液 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62133099A JPS62133099A (ja) | 1987-06-16 |
| JPH0314914B2 true JPH0314914B2 (enrdf_load_stackoverflow) | 1991-02-27 |
Family
ID=24899982
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61081249A Granted JPS62133099A (ja) | 1985-04-11 | 1986-04-10 | 非導電性物質の表面に導電性金属層を電気メツキする方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62133099A (enrdf_load_stackoverflow) |
-
1986
- 1986-04-10 JP JP61081249A patent/JPS62133099A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62133099A (ja) | 1987-06-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |