JPS57167694A - Method of producing circuit board and circuit board obtained thereby - Google Patents
Method of producing circuit board and circuit board obtained therebyInfo
- Publication number
- JPS57167694A JPS57167694A JP57044409A JP4440982A JPS57167694A JP S57167694 A JPS57167694 A JP S57167694A JP 57044409 A JP57044409 A JP 57044409A JP 4440982 A JP4440982 A JP 4440982A JP S57167694 A JPS57167694 A JP S57167694A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- trains
- conductor
- producing
- additive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0753—Insulation
- H05K2201/0761—Insulation resistance, e.g. of the surface of the PCB between the conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1407—Applying catalyst before applying plating resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
- H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
Abstract
The present invention relates to a semi-additive or full-additive process for producing printed circuit or conductor boards having improved electrical resistance in which the coating of adhesive medium exposed between the trains of conductors is removed or partially removed without corroding the base material or copper of the conductor trains by a treatment with an alkaline permanganate or chromic acid solution and suitable washing steps carried out subsequently.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE3110415A DE3110415C2 (en) | 1981-03-18 | 1981-03-18 | Process for the manufacture of printed circuit boards |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57167694A true JPS57167694A (en) | 1982-10-15 |
Family
ID=6127563
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP57044409A Pending JPS57167694A (en) | 1981-03-18 | 1982-03-17 | Method of producing circuit board and circuit board obtained thereby |
Country Status (6)
Country | Link |
---|---|
US (1) | US4430154A (en) |
EP (1) | EP0060805B1 (en) |
JP (1) | JPS57167694A (en) |
AT (1) | ATE17815T1 (en) |
CA (1) | CA1177579A (en) |
DE (1) | DE3110415C2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02144987A (en) * | 1988-11-26 | 1990-06-04 | Sumitomo Metal Mining Co Ltd | Manufacture of printed wiring board |
JPH08186351A (en) * | 1994-12-27 | 1996-07-16 | Internatl Business Mach Corp <Ibm> | Circuit board and its preparation |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6074599A (en) * | 1983-09-30 | 1985-04-26 | 株式会社日立製作所 | Printed circuit board and method of producing same |
US4948630A (en) * | 1984-06-07 | 1990-08-14 | Enthone, Inc. | Three step process for treating plastics with alkaline permanganate solutions |
US4820548A (en) * | 1984-06-07 | 1989-04-11 | Enthone, Incorporated | Three step process for treating plastics with alkaline permanganate solutions |
US4654116A (en) * | 1984-11-09 | 1987-03-31 | American Electronic Laboratories, Inc. | Method for producing high resolution etched circuit patterns from clad laminates |
US4601783A (en) * | 1985-05-31 | 1986-07-22 | Morton Thiokol, Inc. | High concentration sodium permanganate etch batch and its use in desmearing and/or etching printed circuit boards |
US4601784A (en) * | 1985-05-31 | 1986-07-22 | Morton Thiokol, Inc. | Sodium permanganate etch baths containing a co-ion for permanganate and their use in desmearing and/or etching printed circuit boards |
US4718972A (en) * | 1986-01-24 | 1988-01-12 | International Business Machines Corporation | Method of removing seed particles from circuit board substrate surface |
US4812353A (en) * | 1986-12-27 | 1989-03-14 | Sankyo Kasei Kabushiki Kaisha | Process for the production of circuit board and the like |
US4940510A (en) * | 1987-06-01 | 1990-07-10 | Digital Equipment Corporation | Method of etching in the presence of positive photoresist |
US4874635A (en) * | 1988-04-04 | 1989-10-17 | General Electric Company | Method for removing residual precious metal catalyst from the surface of metal-plated plastics |
IT1232863B (en) * | 1989-06-27 | 1992-03-05 | Alfachimici Spa | REDUCED CYCLE PROCEDURE FOR THE MANUFACTURE OF PRINTED CIRCUITS, AND COMPOSITION FOR ITS IMPLEMENTATION |
US4978422A (en) * | 1990-03-20 | 1990-12-18 | Macdermid, Incorporated | Method for improving insulation resistance of printed circuits |
US5143592A (en) * | 1990-06-01 | 1992-09-01 | Olin Corporation | Process for preparing nonconductive substrates |
US5221418A (en) * | 1992-02-11 | 1993-06-22 | Macdermid, Incorporated | Method for improving the surface insulation resistance of printed circuits |
US5207867A (en) * | 1992-03-17 | 1993-05-04 | Macdermid, Incorporated | Composition and method for improving the surface insulation resistance of a printed circuit |
US6544584B1 (en) * | 1997-03-07 | 2003-04-08 | International Business Machines Corporation | Process for removal of undesirable conductive material on a circuitized substrate and resultant circuitized substrate |
US6454954B1 (en) * | 2000-05-22 | 2002-09-24 | Shipley Company, L.L.C. | Desmear etchant and use thereof |
US8172627B2 (en) * | 2008-12-03 | 2012-05-08 | Tyco Electronics Corporation | Electrical connector with plated plug and receptacle |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5515288A (en) * | 1978-07-20 | 1980-02-02 | Matsushita Electric Ind Co Ltd | Method of manufacturing printed circuit board |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1206976B (en) * | 1963-09-19 | 1965-12-16 | Siemens Ag | Process for producing printed circuits according to the build-up method |
JPS5748874B2 (en) * | 1972-07-11 | 1982-10-19 | ||
DE2240502C3 (en) * | 1972-08-17 | 1979-02-22 | Institut Poluprovodnikov Akademii Nauk Ukrainskoj Ssr, Kiew (Sowjetunion) | Process for the production of a relief image of objects with a given configuration by etching a metal or alloy layer |
ZA756783B (en) * | 1974-11-07 | 1976-10-27 | Kollmorgen Corp | Method for cleaning holes in resincontaining materials |
-
1981
- 1981-03-18 DE DE3110415A patent/DE3110415C2/en not_active Expired
-
1982
- 1982-03-15 EP EP82730034A patent/EP0060805B1/en not_active Expired
- 1982-03-15 AT AT82730034T patent/ATE17815T1/en not_active IP Right Cessation
- 1982-03-15 US US06/358,226 patent/US4430154A/en not_active Expired - Lifetime
- 1982-03-17 JP JP57044409A patent/JPS57167694A/en active Pending
- 1982-03-18 CA CA000398778A patent/CA1177579A/en not_active Expired
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5515288A (en) * | 1978-07-20 | 1980-02-02 | Matsushita Electric Ind Co Ltd | Method of manufacturing printed circuit board |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02144987A (en) * | 1988-11-26 | 1990-06-04 | Sumitomo Metal Mining Co Ltd | Manufacture of printed wiring board |
JPH08186351A (en) * | 1994-12-27 | 1996-07-16 | Internatl Business Mach Corp <Ibm> | Circuit board and its preparation |
Also Published As
Publication number | Publication date |
---|---|
ATE17815T1 (en) | 1986-02-15 |
US4430154A (en) | 1984-02-07 |
EP0060805B1 (en) | 1986-01-29 |
EP0060805A1 (en) | 1982-09-22 |
DE3110415A1 (en) | 1982-10-07 |
CA1177579A (en) | 1984-11-06 |
DE3110415C2 (en) | 1983-08-18 |
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