JPH0314914B2 - - Google Patents
Info
- Publication number
- JPH0314914B2 JPH0314914B2 JP8124986A JP8124986A JPH0314914B2 JP H0314914 B2 JPH0314914 B2 JP H0314914B2 JP 8124986 A JP8124986 A JP 8124986A JP 8124986 A JP8124986 A JP 8124986A JP H0314914 B2 JPH0314914 B2 JP H0314914B2
- Authority
- JP
- Japan
- Prior art keywords
- dispersion
- carbon black
- hydroxide
- conductive
- black particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 claims description 23
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 239000012811 non-conductive material Substances 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 238000009713 electroplating Methods 0.000 claims description 3
- 239000006229 carbon black Substances 0.000 claims 13
- 239000006185 dispersion Substances 0.000 claims 13
- 239000002245 particle Substances 0.000 claims 11
- 239000007788 liquid Substances 0.000 claims 5
- 229910001854 alkali hydroxide Inorganic materials 0.000 claims 4
- 150000008044 alkali metal hydroxides Chemical class 0.000 claims 4
- 239000002612 dispersion medium Substances 0.000 claims 4
- WMFOQBRAJBCJND-UHFFFAOYSA-M Lithium hydroxide Chemical compound [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 claims 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 2
- 229910052910 alkali metal silicate Inorganic materials 0.000 claims 2
- 229910021485 fumed silica Inorganic materials 0.000 claims 2
- 239000004094 surface-active agent Substances 0.000 claims 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 claims 1
- 229910019142 PO4 Inorganic materials 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 125000005233 alkylalcohol group Chemical group 0.000 claims 1
- 239000000908 ammonium hydroxide Substances 0.000 claims 1
- 239000003945 anionic surfactant Substances 0.000 claims 1
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 claims 1
- 239000000920 calcium hydroxide Substances 0.000 claims 1
- 229910001861 calcium hydroxide Inorganic materials 0.000 claims 1
- 125000004432 carbon atom Chemical group C* 0.000 claims 1
- 238000005530 etching Methods 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 239000010452 phosphate Substances 0.000 claims 1
- -1 phosphate ester Chemical class 0.000 claims 1
- 238000000926 separation method Methods 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- 238000005406 washing Methods 0.000 claims 1
- 238000007772 electroless plating Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
Description
発明の分野
本発明は非導電性物質の表面、特にプリント配
線板（PWB）の貫通孔壁へ導電性金属層を電気
メツキする方法に関する。
関連技術の説明
過去25年間プリント配線板工業はプリント配線
板中の貫通孔壁を電気メツキするのに無電解メツ
キによる銅の付着方法に依存してきた。貫通孔壁
のメツキはプリント配線板の両側又はこれに加え
て多層板の内層の、金属回路パターン間の接続を
行なうのに必要である。
貫通孔壁への無電解メツキによる銅の付着は典
型的にはPWBの予備クリーニングとそれに続く
次の工程図に従つて行なわれる。
FIELD OF THE INVENTION The present invention relates to a method for electroplating conductive metal layers onto the surfaces of non-conductive materials, particularly the walls of through holes in printed wiring boards (PWBs). Description of Related Art For the past 25 years, the printed wiring board industry has relied on electroless plating to deposit copper to electroplat the walls of through holes in printed wiring boards. Plating of the through-hole walls is necessary to make connections between metal circuit patterns on both sides of the printed wiring board or additionally on the inner layers of the multilayer board. Deposition of copper to the through-hole walls by electroless plating is typically accomplished by pre-cleaning the PWB followed by the following process diagram.
【表】
↓
[Table] ↓
Claims (1)
径を有するカーボンブラツク粒子、 前記カーボンブラツク用の界面活性剤の有
効分散量；及び 液体分散媒 からなるカーボンブラツク分散液（上記分散液
において、カーボンブラツクの量は非導電性物
質表面の実質的に全部を被覆するに充分な量で
あり、且つ分散液の４重量％よりも少ない量で
ある）を調製し、 (b) 前記分散液を非導電性物質の表面に適用し； (c) 前記カーボンブラツク粒子から実質的に全て
の液状分散媒を分離し、それによつてカーボン
ブラツク粒子を前記非導電性表面上に実質的に
連続した層状で付着させ；そして、 (d) 付着したカーボンブラツク層と前記非導電性
表面に実質的に連続した導電性金属層を電気メ
ツキする ことからなる非導電性物質表面に導電性金属層を
電気メツキする方法。 ２ 前記の分散液が更に分散液のPHを10〜14の範
囲で上昇させるに充分な量の少くとも１種の水酸
化アルカリを含有する特許請求の範囲第１項記載
の方法。 ３ 水酸化アルカリが水酸化カリウム、水酸化ナ
トリウム、水酸化リチウム、水酸化アンモニウム
及び水酸化カルシウムからなる群から選ばれる特
許請求の範囲第２項記載の方法。 ４ 分散液が更にヒユームドシリカ粒子と水酸化
アルカリとの反応によつて形成されるアルカリシ
リケートを含有する特許請求の範囲第２項記載の
方法。 ５ 分散液が更に50〜250ｇのヒユームドシリカ
と100〜350ｇの水酸化アルカリとの反応によつて
形成されるアルカリシリケートを含有する特許請
求の範囲第４項記載の方法。 ６ 液体分散媒が水である特許請求の範囲第１項
記載の方法。 ７ 液体分散媒が炭素数１〜15のアルキルアルコ
ールである特許請求の範囲第１項記載の方法。 ８ 分散液が10重量％より少ない固形分を含有す
る特許請求の範囲第１項記載の方法。 ９ カーボンブラツク粒子の初めのPHが１〜7.5
である特許請求の範囲第１項記載の方法。 １０ カーボンブラツク粒子の初めのPHが２〜４
である特許請求の範囲第９項記載の方法。 １１ カーボンブラツク粒子が多孔質の粒子であ
る特許請求の範囲第１項記載の方法。 １２ カーボンブラツク粒子が45〜1100m2／ｇの
表面積を有する特許請求の範囲第１１項記載の方
法。 １３ カーボンブラツク粒子が１〜10重量％の揮
発成分を含有する特許請求の範囲第１項記載の方
法。 １４ 界面活性剤がリン酸エステルアニオン系界
面活性剤である特許請求の範囲第１項記載の方
法。 １５ 導電性金属が、銅、ニツケル、金及び銀か
らなる群から選ばれる特許請求の範囲第１項記載
の方法。 １６ 導電性金属が銅である特許請求の範囲第１
５項記載の方法。 １７ 前記工程(b)が非導電性物質を分散液中に浸
漬することによつて行われる特許請求の範囲第１
項記載の方法。 １８ 前記分離工程(c)が、適用された分散液を加
熱することによつて行われる特許請求の範囲第１
項記載の方法。 １９ 上記非導電性物質が、少くとも２つの分離
した金属層に対して積層されている少くとも１つ
の非導電性層を有する積層プリント配線板の貫通
孔壁からなつている特許請求の範囲第１項記載の
方法。 ２０ 金属層上に付着した余分のカーボンブラツ
クを、該金属層をミクロエツチングすることによ
り除去する特許請求の範囲第１９項記載の方法。 ２１ ミクロエツチングの後に更に水洗を行う特
許請求の範囲第２０項記載の方法。[Claims] 1. The following steps: (a) carbon black particles having an average particle size of less than 3.0 microns in a dispersion; an effective dispersion amount of a surfactant for said carbon black; and a liquid dispersion medium. A carbon black dispersion (in the above dispersion, the amount of carbon black is sufficient to cover substantially the entire surface of the non-conductive material, and is less than 4% by weight of the dispersion). (b) applying said dispersion to the surface of a non-conductive material; (c) separating substantially all of the liquid dispersion medium from said carbon black particles, thereby converting said carbon black particles into said non-conductive material; and (d) electroplating a substantially continuous conductive metal layer on the deposited carbon black layer and said non-conductive surface. A method of electroplating a conductive metal layer onto the surface of a material. 2. The method of claim 1, wherein said dispersion further contains at least one alkali hydroxide in an amount sufficient to raise the pH of the dispersion in the range of 10-14. 3. The method of claim 2, wherein the alkali hydroxide is selected from the group consisting of potassium hydroxide, sodium hydroxide, lithium hydroxide, ammonium hydroxide, and calcium hydroxide. 4. The method of claim 2, wherein the dispersion further contains an alkali silicate formed by the reaction of fumed silica particles with an alkali hydroxide. 5. The method of claim 4, wherein the dispersion further contains an alkali silicate formed by the reaction of 50 to 250 g of fumed silica with 100 to 350 g of alkali hydroxide. 6. The method according to claim 1, wherein the liquid dispersion medium is water. 7. The method according to claim 1, wherein the liquid dispersion medium is an alkyl alcohol having 1 to 15 carbon atoms. 8. The method of claim 1, wherein the dispersion contains less than 10% solids by weight. 9 Initial pH of carbon black particles is 1 to 7.5
The method according to claim 1. 10 The initial pH of carbon black particles is 2-4
The method according to claim 9. 11. The method according to claim 1, wherein the carbon black particles are porous particles. 12. The method of claim 11, wherein the carbon black particles have a surface area of 45 to 1100 m 2 /g. 13. The method of claim 1, wherein the carbon black particles contain 1 to 10% by weight of volatile components. 14. The method according to claim 1, wherein the surfactant is a phosphate ester anionic surfactant. 15. The method of claim 1, wherein the conductive metal is selected from the group consisting of copper, nickel, gold and silver. 16 Claim 1 in which the conductive metal is copper
The method described in Section 5. 17 Claim 1, wherein the step (b) is carried out by immersing a non-conductive substance in a dispersion liquid.
The method described in section. 18 Claim 1, wherein the separation step (c) is carried out by heating the applied dispersion.
The method described in section. 19. Claim 19, wherein said non-conductive material comprises a through-hole wall of a laminated printed wiring board having at least one non-conductive layer laminated to at least two separate metal layers. The method described in Section 1. 20. The method of claim 19, wherein excess carbon black deposited on the metal layer is removed by micro-etching the metal layer. 21. The method according to claim 20, further comprising washing with water after microetching.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US72196485A | 1985-04-11 | 1985-04-11 | |
| US721964 | 1985-04-11 | ||
| US802892 | 1985-11-29 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2131324A Division JPH0665755B2 (en) | 1985-04-11 | 1990-05-23 | Dispersions suitable for enhancing metal plating |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62133099A JPS62133099A (en) | 1987-06-16 |
| JPH0314914B2 true JPH0314914B2 (en) | 1991-02-27 |
Family
ID=24899982
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61081249A Granted JPS62133099A (en) | 1985-04-11 | 1986-04-10 | Electroplating of conductive metal layer to surface of non-conductive substance |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62133099A (en) |
-
1986
- 1986-04-10 JP JP61081249A patent/JPS62133099A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62133099A (en) | 1987-06-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |