JPS63129692A - Manufacture of printed wiring board - Google Patents
Manufacture of printed wiring boardInfo
- Publication number
- JPS63129692A JPS63129692A JP27544686A JP27544686A JPS63129692A JP S63129692 A JPS63129692 A JP S63129692A JP 27544686 A JP27544686 A JP 27544686A JP 27544686 A JP27544686 A JP 27544686A JP S63129692 A JPS63129692 A JP S63129692A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- plating
- wiring board
- copper plating
- solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 238000007747 plating Methods 0.000 claims description 41
- 239000010949 copper Substances 0.000 claims description 31
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 30
- 229910052802 copper Inorganic materials 0.000 claims description 30
- 238000011282 treatment Methods 0.000 claims description 15
- 239000000126 substance Substances 0.000 claims description 13
- 239000007788 liquid Substances 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 8
- 239000000203 mixture Substances 0.000 claims description 8
- 238000002203 pretreatment Methods 0.000 claims description 6
- 239000000243 solution Substances 0.000 description 24
- 238000005406 washing Methods 0.000 description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 13
- 239000003054 catalyst Substances 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 230000004913 activation Effects 0.000 description 3
- 239000000654 additive Substances 0.000 description 2
- 239000013522 chelant Substances 0.000 description 2
- 239000003638 chemical reducing agent Substances 0.000 description 2
- 230000003750 conditioning effect Effects 0.000 description 2
- 238000005238 degreasing Methods 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910001854 alkali hydroxide Inorganic materials 0.000 description 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000008139 complexing agent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 239000003002 pH adjusting agent Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 238000010019 resist printing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔概 要〕
スルーホールを有するプリント配線板を製造する方法に
おいて、スルーホールのメッキを行う前、そのメッキに
用いられるメッキ浴と同一かもしくはほぼ同一の組成を
有するアルカリ処理液を用いて被メッキ部位を前処理す
る。この前処理の結果、被メッキ部位のメッキ浴に対す
る順応性が著しく向上せしめられるので、より良好な性
質をもった銅メッキ皮膜をより強固にスルーホール内壁
に密着させることができる。[Detailed Description of the Invention] [Summary] In a method for manufacturing a printed wiring board having through holes, before plating the through holes, an alkali having the same or almost the same composition as the plating bath used for the plating is used. Pre-treat the area to be plated using a treatment solution. As a result of this pretreatment, the adaptability of the part to be plated to the plating bath is significantly improved, so that a copper plating film with better properties can be more firmly adhered to the inner wall of the through hole.
本発明は、スルーホールを有するプリント配線板を製造
する方法に関する。本発明は、さらに詳しく述べると、
このようなプリント配線板の製造において、スルーホー
ル内壁に対する銅メッキ皮膜の密着力を向上させかつ皮
膜の性質を改良することに関する。The present invention relates to a method of manufacturing a printed wiring board having through holes. More specifically, the present invention includes:
The present invention relates to improving the adhesion of a copper plating film to the inner wall of a through hole and improving the properties of the film in the production of such printed wiring boards.
従来、プリント配線板は、銅張積層板を用い、スルーホ
ール用穴開け、エツチングレジストｌ１ｇ形成、銅エツ
チングによるパターン形成、化学銅メッキ、ソルダレジ
スト印刷などの一連の工程からなるサブトラクト法、そ
の他によって製造されている。また、スルーホール用穴
開けの後であって化学銅メッキの前には、スルーホール
内における銅メッキ析出を良好ならしめるため、次のよ
うな一連の前処理を行なっている：（１）脱脂、（２）
湯洗、（３）水洗、（４）コンディショニング、（５）
水洗、（６）エツチング、（７）水洗、（８）触媒処理
、（９）活性化及び（１０）水洗。水洗の完了後、キレ
ート銅、錯化剤、還元剤、水酸化アルカリを主成分とす
る化学銅メッキ液を用いて無電解銅メッキを実施するこ
とができる。Conventionally, printed wiring boards have been produced using copper-clad laminates using the subtract method, which consists of a series of steps such as through-hole drilling, etching resist l1g formation, pattern formation by copper etching, chemical copper plating, and solder resist printing, etc. Manufactured. In addition, after drilling for through-holes and before chemical copper plating, the following series of pretreatments are performed to improve the copper plating precipitation in the through-holes: (1) Degreasing. ,(2)
Hot water washing, (3) cold water washing, (4) conditioning, (5)
Water washing, (6) etching, (7) water washing, (8) catalyst treatment, (9) activation, and (10) water washing. After completion of water washing, electroless copper plating can be performed using a chemical copper plating solution containing chelate copper, a complexing agent, a reducing agent, and an alkali hydroxide as main components.
上記したような従来のプリント配線板の製造方法では、
化学銅メッキ工程中に一連の前処理工程を実施している
けれども、被メッキ部位における前処理液と化学銅メッ
キ液とのなじみの点から、現実には、メッキ析出むら１
、メッキ析出銅表面のメッキの膨れ、ザラ、また、取り
扱いによってはメッキ皮膜の剥離等の不都合がおこり得
る。したがって、化学銅メッキ工程をさらに改良するこ
とが金型まれている。In the conventional printed wiring board manufacturing method as described above,
Although a series of pre-treatment steps are carried out during the chemical copper plating process, in reality, due to the compatibility between the pre-treatment solution and the chemical copper plating solution in the area to be plated, uneven plating deposition may occur.
Inconveniences such as blistering and roughness of the plating on the surface of the deposited copper, and peeling of the plating film depending on handling, may occur. Therefore, it is desirable to further improve the chemical copper plating process.
上記した問題点は、本発明によれば、スルーホールを有
するプリント配線板を製造する方法であって、一連の前
処理を経た後であって化学銅メッキ液を用いてスルーホ
ールの無電解銅メッキを行う前、銅を含まない点を除い
て前記メッキ液と同一であるかもしくはほぼ同一の組成
をもったアルカリ処理液を用いて被メッキ部位を処理す
ることを特徴とする方法によって解決することができる
。According to the present invention, the above-mentioned problems are solved by a method of manufacturing a printed wiring board having through holes, in which electroless copper plating is applied to the through holes using a chemical copper plating solution after a series of pre-treatments. The problem is solved by a method characterized in that, before plating, the part to be plated is treated with an alkaline treatment solution that is the same or has almost the same composition as the plating solution except that it does not contain copper. be able to.
ここで使用するアルカリ処理液は、化学銅メッキ液との
液なじみの点から、はぼ同一の５０〜８０℃の温度であ
ることが好ましい。なぜなら、化学銅メッキ液は、５０
℃未満では物性の低下があり、８０℃を上進ると液の分
解がおこるからである。The alkaline processing solution used here is preferably at a temperature of 50 to 80° C., which is almost the same as the chemical copper plating solution, from the viewpoint of liquid compatibility with the chemical copper plating solution. This is because the chemical copper plating solution is 50%
This is because if the temperature is below 80°C, the physical properties will deteriorate, and if the temperature exceeds 80°C, the liquid will decompose.
本発明において、゛メッキ液と同一であるかもしくはほ
ぼ同一の組成をもったアルカリ処理液”とは、アルカリ
処理液がメッキ液と同一組成であり、但し、少なくとも
キレートｍ、硫酸銅等の銅成分を含有しないものを指し
ている。したがって、このアルカリ処理液は、メッキ浴
から銅成分だけを除いたものであっても、銅成分とその
他の任意の成分を一緒に除いたものであってもよい。例
えばこのアルカリ処理液は、ｐＨ調整剤、安定剤、例え
ばホルムアルデヒドなどのような還元剤、水酸化ナトリ
ウムのようなアルカリ剤を主成分として含有する水溶液
であることができる。In the present invention, "alkaline processing solution having the same or almost the same composition as the plating solution" means that the alkaline processing solution has the same composition as the plating solution, provided that at least chelate m, copper sulfate, etc. Therefore, even if this alkaline processing solution is one in which only the copper component is removed from the plating bath, it is one in which the copper component and any other optional components are removed together. For example, the alkaline treatment liquid may be an aqueous solution containing as main components a pH adjuster, a stabilizer, a reducing agent such as formaldehyde, and an alkaline agent such as sodium hydroxide.
本発明によれば、一連の前処理工程を経て性状が改良さ
れた被メッキ部位に対して、メッキ液とほぼ同一組成の
アルカリ処理液が作用するので、メッキ液に対する被メ
ッキ部位の順応性が著しく改良され、よって、メッキ完
了後、よりすぐれた銅メッキ皮膜をもったスルーホール
が得られる。According to the present invention, an alkaline treatment liquid having almost the same composition as the plating solution is applied to the plated area whose properties have been improved through a series of pretreatment steps, so that the adaptability of the plated area to the plating solution is improved. This is significantly improved, thus resulting in a through-hole with a better copper plating layer after plating is complete.
銅張積層板に口径０．４鶴、０．９１℃ｍのスルーホー
ルを形成した後、次のような化学銅メッキのための前処
理を行った。After forming a through hole with a diameter of 0.4 mm and a temperature of 0.91° C.m in the copper-clad laminate, the following pretreatment for chemical copper plating was performed.
（１）脱脂（油などの汚れの除去）
６分、８０℃
（２）湯洗（脱脂剤等の除去）
１分、８０℃
（３）水洗（湯洗の補助）
１分
（４）コンディショニング（被メッキ面の液ぬれ性向上
）
２分、２５℃
（５）水洗（コンディショナの除去）
１分
（６）エンチング（酸化銅の除去）
３分、２５℃
（７）水洗（エツチング液の除去）
１分
（８）触媒処理（被メッキ面への触媒化）５分、４５℃
（９）水洗（触媒処理液の除去）
１分
（１０）活性化（触媒処理部の活性化）７分、２５℃
（１１）水洗（活性化液の除去）
１分
（１２）アルカリ処理（化学銅メッキ液に対する順応性
の向上）
アルカリ処理液の組成ニ
ー−」［−−
ＮａＯ８５ｇ／１２
界面活性剤 ５ｇ／ｌ
その他の添加剤 少量
液温を約７０℃に保ったアルカリ処理液に基板を約２分
間にわたって浸漬した。(1) Degreasing (removal of oil and other stains) 6 minutes, 80℃ (2) Hot water washing (removal of degreasers, etc.) 1 minute, 80℃ (3) Water washing (auxiliary to hot water washing) 1 minute (4) Conditioning (Improve the wettability of the plated surface) 2 minutes, 25℃ (5) Water washing (removal of conditioner) 1 minute (6) Enching (removal of copper oxide) 3 minutes, 25℃ (7) Water washing (removal of etching solution) Removal) 1 minute (8) Catalyst treatment (catalyticization of the surface to be plated) 5 minutes, 45°C (9) Water washing (removal of catalyst treatment liquid) 1 minute (10) Activation (activation of catalyst treatment part) 7 min, 25°C (11) Water washing (removal of activating solution) 1 min (12) Alkaline treatment (improving adaptability to chemical copper plating solution) Composition of alkaline treatment solution [--NaO85g/12 Surfactant 5 g/l Other additives A small amount of the substrate was immersed in an alkaline treatment solution kept at a temperature of about 70° C. for about 2 minutes.
一連の前処理の完了後、次のような組成の無電解銅メッ
キ液を用いてスルーホールメッキを実施した。液温約７
０℃、浸漬時間１４時間であった。After completing a series of pretreatments, through-hole plating was performed using an electroless copper plating solution having the following composition. Liquid temperature approx. 7
The temperature was 0°C and the immersion time was 14 hours.
ｉ
εＤＴＡ−Ｃｕ ２ ｇ ／
１２ＨＣＨＯ３ｇ／ｌ
Ｎａ０ｔｌ １０ ｇ／ １
界面活性剤 １０ ｇ／ｌ
その他の添加剤 少量
得られた銅メッキ皮膜を物性及び基板に対する密着力に
関して評価したところ、満足し得る結果が得られた。特
にこの皮膜は、従来の処理によって得た皮膜とは異なっ
て、メッキむら、膨れ、ザラ等の欠陥を示さなかった。i εDTA-Cu 2 g /
12HCHO3g/l Na0tl 10g/1
Surfactant 10 g/l Other additives The copper plating film obtained in a small amount was evaluated in terms of physical properties and adhesion to the substrate, and satisfactory results were obtained. In particular, this film did not exhibit defects such as uneven plating, blisters, and roughness, unlike films obtained by conventional treatments.
本発明によれば、従来の方法に較べて、より良好な性質
をもった銅メッキ皮膜をより強固にスルーホール内壁に
密着させることができる。According to the present invention, it is possible to more firmly adhere a copper plating film having better properties to the inner wall of a through hole than with conventional methods.
Claims (1)
法であって、一連の前処理を経た後であって化学銅メッ
キ液を用いてスルーホールの無電解銅メッキを行う前、
銅を含まない点を除いて前記メッキ液と同一であるかも
しくはほぼ同一の組成をもったアルカリ処理液を用いて
被メッキ部位を処理することを特徴とするプリント配線
板の製法。 ２、前記アルカリ処理液が５０〜８０℃の温度である、
特許請求の範囲第１項に記載の製法。 ３、被プリント配線板を前記アルカリ処理液中に浸漬し
て処理する、特許請求の範囲第１項又は第２項に記載の
製法。[Claims] 1. A method for manufacturing a printed wiring board having through-holes, the method comprising: after a series of pre-treatments and before performing electroless copper plating of the through-holes using a chemical copper plating solution; ,
A method for manufacturing a printed wiring board, characterized in that a part to be plated is treated using an alkaline treatment liquid having the same or almost the same composition as the plating liquid except that it does not contain copper. 2. The temperature of the alkaline treatment liquid is 50 to 80°C.
The manufacturing method according to claim 1. 3. The manufacturing method according to claim 1 or 2, wherein the printed wiring board is treated by immersing it in the alkaline treatment liquid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27544686A JPS63129692A (en) | 1986-11-20 | 1986-11-20 | Manufacture of printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27544686A JPS63129692A (en) | 1986-11-20 | 1986-11-20 | Manufacture of printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63129692A true JPS63129692A (en) | 1988-06-02 |
Family
ID=17555640
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27544686A Pending JPS63129692A (en) | 1986-11-20 | 1986-11-20 | Manufacture of printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63129692A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1996020294A1 (en) * | 1994-12-27 | 1996-07-04 | Ibiden Co., Ltd. | Pretreatment solution for electroless plating, electroless plating bath and electroless plating method |
| JP2002053973A (en) * | 2000-08-07 | 2002-02-19 | Ibiden Co Ltd | Pretreating solution for electroless plating, treating solution for electroless plating, and method for producing multilayer printed circuit board |
| JP2002076618A (en) * | 2000-08-23 | 2002-03-15 | Ibiden Co Ltd | Method for manufacturing multilayer printed circuit board |
| JP2002344134A (en) * | 2001-05-15 | 2002-11-29 | Okuno Chem Ind Co Ltd | Method of electroless copper plating for wiring board having blind via hole |
| JP2007254867A (en) * | 2006-03-24 | 2007-10-04 | Seiko Epson Corp | Plating method |
-
1986
- 1986-11-20 JP JP27544686A patent/JPS63129692A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1996020294A1 (en) * | 1994-12-27 | 1996-07-04 | Ibiden Co., Ltd. | Pretreatment solution for electroless plating, electroless plating bath and electroless plating method |
| KR100235850B1 (en) * | 1994-12-27 | 1999-12-15 | 엔도 마사루 | Pretreatment solution for electroless plating, electroless plating bath and electroless plating method |
| US6146700A (en) * | 1994-12-27 | 2000-11-14 | Ibiden Co., Ltd. | Pretreating solution for electroless plating, electroless plating bath and electroless plating process |
| US6174353B1 (en) | 1994-12-27 | 2001-01-16 | Ibiden Co., Ltd. | Pretreating solution for electroless plating, electroless plating bath and electroless plating process |
| JP2002053973A (en) * | 2000-08-07 | 2002-02-19 | Ibiden Co Ltd | Pretreating solution for electroless plating, treating solution for electroless plating, and method for producing multilayer printed circuit board |
| JP2002076618A (en) * | 2000-08-23 | 2002-03-15 | Ibiden Co Ltd | Method for manufacturing multilayer printed circuit board |
| JP4508380B2 (en) * | 2000-08-23 | 2010-07-21 | イビデン株式会社 | Manufacturing method of multilayer printed wiring board |
| JP2002344134A (en) * | 2001-05-15 | 2002-11-29 | Okuno Chem Ind Co Ltd | Method of electroless copper plating for wiring board having blind via hole |
| JP4670065B2 (en) * | 2001-05-15 | 2011-04-13 | 奥野製薬工業株式会社 | Electroless copper plating method for wiring board with blind via hole |
| JP2007254867A (en) * | 2006-03-24 | 2007-10-04 | Seiko Epson Corp | Plating method |
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