JPH0314227B2 - - Google Patents
Info
- Publication number
- JPH0314227B2 JPH0314227B2 JP60000010A JP1085A JPH0314227B2 JP H0314227 B2 JPH0314227 B2 JP H0314227B2 JP 60000010 A JP60000010 A JP 60000010A JP 1085 A JP1085 A JP 1085A JP H0314227 B2 JPH0314227 B2 JP H0314227B2
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- semiconductor device
- die
- carrier tape
- punch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W95/00—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60000010A JPS61159742A (ja) | 1985-01-04 | 1985-01-04 | アウタ−リ−ドボンデイング装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60000010A JPS61159742A (ja) | 1985-01-04 | 1985-01-04 | アウタ−リ−ドボンデイング装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61159742A JPS61159742A (ja) | 1986-07-19 |
| JPH0314227B2 true JPH0314227B2 (cg-RX-API-DMAC10.html) | 1991-02-26 |
Family
ID=11462483
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60000010A Granted JPS61159742A (ja) | 1985-01-04 | 1985-01-04 | アウタ−リ−ドボンデイング装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61159742A (cg-RX-API-DMAC10.html) |
-
1985
- 1985-01-04 JP JP60000010A patent/JPS61159742A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61159742A (ja) | 1986-07-19 |
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