JPH0314047Y2 - - Google Patents

Info

Publication number
JPH0314047Y2
JPH0314047Y2 JP1986142126U JP14212686U JPH0314047Y2 JP H0314047 Y2 JPH0314047 Y2 JP H0314047Y2 JP 1986142126 U JP1986142126 U JP 1986142126U JP 14212686 U JP14212686 U JP 14212686U JP H0314047 Y2 JPH0314047 Y2 JP H0314047Y2
Authority
JP
Japan
Prior art keywords
bonding
optical path
lens barrel
objective lens
prism
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1986142126U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6349236U (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986142126U priority Critical patent/JPH0314047Y2/ja
Publication of JPS6349236U publication Critical patent/JPS6349236U/ja
Application granted granted Critical
Publication of JPH0314047Y2 publication Critical patent/JPH0314047Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers

Landscapes

  • Wire Bonding (AREA)
JP1986142126U 1986-09-17 1986-09-17 Expired JPH0314047Y2 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986142126U JPH0314047Y2 (enExample) 1986-09-17 1986-09-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986142126U JPH0314047Y2 (enExample) 1986-09-17 1986-09-17

Publications (2)

Publication Number Publication Date
JPS6349236U JPS6349236U (enExample) 1988-04-04
JPH0314047Y2 true JPH0314047Y2 (enExample) 1991-03-28

Family

ID=31050557

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986142126U Expired JPH0314047Y2 (enExample) 1986-09-17 1986-09-17

Country Status (1)

Country Link
JP (1) JPH0314047Y2 (enExample)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5867033A (ja) * 1981-10-19 1983-04-21 Hitachi Ltd ワイヤボンデイング方法

Also Published As

Publication number Publication date
JPS6349236U (enExample) 1988-04-04

Similar Documents

Publication Publication Date Title
JP3255807B2 (ja) Ｔｃｐ実装方法
US5330089A (en) Polar bond head
JPH0376134A (ja) 半導体装置の配線接続装置
JPH0314047Y2 (enExample)
JP4298473B2 (ja) 表面実装機
JP2004128384A (ja) 部品実装装置および部品実装方法
JP3187976B2 (ja) 部品装着装置
JP3123835B2 (ja) 部品装着装置
JPS6163099A (ja) 電子部品取付装置
JPH0870013A (ja) ボンディング方法及びその装置
JP3275742B2 (ja) チップのボンディング方法
JP2828552B2 (ja) ワイヤボンディング装置
JPS6148703A (ja) 部品自動搭載装置における保持位置確認装置
JP2810579B2 (ja) 部品装着装置
JP2757127B2 (ja) ワイヤボンダーのボンディング位置補正方法、およびその装置
KR960014482B1 (ko) 칩마운터의 칩부품위치인식장치
JPH0212024B2 (enExample)
CN213179857U (zh) 一种基于psd的微操作辅助装置
JPS605057B2 (ja) ワイヤボンデイング装置
JP3275872B2 (ja) 可動ステージ装置
JP3422315B2 (ja) 位置合わせ方法
JPS6063945A (ja) ワイヤボンデイング装置
JP2513151Y2 (ja) ボンディング装置
JPH0645652A (ja) 光学ヘッドのダイボンディング装置及びダイボンディング方法
JP4597003B2 (ja) 部品の画像取得方法及び装置