JPH0314039Y2 - - Google Patents

Info

Publication number

JPH0314039Y2

JPH0314039Y2 JP4747485U JP4747485U JPH0314039Y2 JP H0314039 Y2 JPH0314039 Y2 JP H0314039Y2 JP 4747485 U JP4747485 U JP 4747485U JP 4747485 U JP4747485 U JP 4747485U JP H0314039 Y2 JPH0314039 Y2 JP H0314039Y2

Authority

JP

Japan

Prior art keywords

flat part

chip

electrolytic capacitor

sealing body

type electrolytic

Prior art date

1985-04-01

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

• Espacenet
• Global Dossier
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• 239000003990 capacitor Substances 0.000 claims description 22
• 238000007789 sealing Methods 0.000 claims description 9
• 239000011347 resin Substances 0.000 claims description 6
• 229920005989 resin Polymers 0.000 claims description 6
• 238000005452 bending Methods 0.000 claims 1
• 239000011888 foil Substances 0.000 description 5
• XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
• 229910052782 aluminium Inorganic materials 0.000 description 3
• 229910000679 solder Inorganic materials 0.000 description 3
• 239000000758 substrate Substances 0.000 description 3
• 239000004020 conductor Substances 0.000 description 2
• 238000005476 soldering Methods 0.000 description 2
• 230000003811 curling process Effects 0.000 description 1
• 230000007547 defect Effects 0.000 description 1
• 230000000694 effects Effects 0.000 description 1
• 239000008151 electrolyte solution Substances 0.000 description 1
• WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
• 238000000034 method Methods 0.000 description 1
• 238000004806 packaging method and process Methods 0.000 description 1