JPH03139814A - Ceramic capacitor - Google Patents
Ceramic capacitorInfo
- Publication number
- JPH03139814A JPH03139814A JP27725589A JP27725589A JPH03139814A JP H03139814 A JPH03139814 A JP H03139814A JP 27725589 A JP27725589 A JP 27725589A JP 27725589 A JP27725589 A JP 27725589A JP H03139814 A JPH03139814 A JP H03139814A
- Authority
- JP
- Japan
- Prior art keywords
- capacitor
- ceramic capacitor
- capacitors
- circuit board
- ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003985 ceramic capacitor Substances 0.000 title claims abstract description 31
- 239000003990 capacitor Substances 0.000 claims abstract description 20
- 238000005476 soldering Methods 0.000 claims abstract 2
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 229910000679 solder Inorganic materials 0.000 abstract description 6
- 238000002844 melting Methods 0.000 abstract description 2
- 230000008018 melting Effects 0.000 abstract description 2
- 230000015556 catabolic process Effects 0.000 abstract 2
- 230000000694 effects Effects 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 229910052573 porcelain Inorganic materials 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
Landscapes
- Ceramic Capacitors (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、磁器コンデンサの構造に関する。特に、取り
付ける回路基板上の占有面積を小さくできる磁器：１ン
デンナに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to the structure of a ceramic capacitor. In particular, the present invention relates to a 1-piece porcelain ware that can reduce the area occupied on a circuit board to which it is attached.
［従来の技術及び発明が解決しようとする問題点］積層
磁器′：１ンデンサは、小型で高容量で高い耐電圧を実
現でき、しかも、島い信頼性を有するもので、電ｆ・回
路の高密度化、信頼性の向上に大きく貢献するものであ
った。然し乍ら、更に、より高い容１Ａと高い耐電圧を
有するコンデンサを製造する場合、この形状は大きくな
らざるを得ないものであった。[Problems to be solved by the prior art and the invention] The laminated porcelain ':1' capacitor is small, has high capacity, and can achieve high withstand voltage, and has excellent reliability. This greatly contributed to higher density and improved reliability. However, in order to manufacture a capacitor having a higher capacity of 1 A and a higher withstand voltage, the shape has to be larger.
積層磁器コンデンサの製造工程の中で、誘電体材料中に
含まれる有機溶剤を乾燥させる工程があるが、コンデン
サの形状が大きくなると、この有機溶剤の乾燥が不十分
になり易い、乾燥が不十分であるとき、誘電体焼成時に
残った溶剤が急激に沸騰・気化し、誘電体内に気泡や亀
裂を残す、このために、大型の積層磁器コンデンサは量
産が困難であり、価格も高くなりがちであった。In the manufacturing process of multilayer ceramic capacitors, there is a step to dry the organic solvent contained in the dielectric material, but as the shape of the capacitor becomes larger, this organic solvent tends to be insufficiently dried. When the dielectric is fired, the solvent left behind during dielectric firing boils and vaporizes rapidly, leaving bubbles and cracks within the dielectric.For this reason, large multilayer ceramic capacitors are difficult to mass produce and tend to be expensive. there were.
また、仮に、大型の積層磁器コンデンサが製造されたと
しても、大型の電子部品は回路基板上の広い面積を占有
することになり、電子回路の高密度化を妨げるものであ
った。Furthermore, even if a large multilayer ceramic capacitor were manufactured, the large electronic components would occupy a large area on the circuit board, which would hinder the development of high density electronic circuits.
従って、本発明は、高い容量と高い耐電圧性を有する磁
器コンデンサの製造を容易にし、また、回路基板上の占
有面積の小さいコンデンサを提供することを目的とする
。そして、本発明は、組立て面積を少なくでき、高容量
で、高耐電圧の磁器コンデンサの製造を容易にし、また
、回路基板上の占有面積の小さいコンデンサを提供する
ことを１」的とする。Therefore, an object of the present invention is to facilitate manufacturing of a ceramic capacitor having high capacitance and high voltage resistance, and to provide a capacitor that occupies a small area on a circuit board. It is an object of the present invention to provide a capacitor that requires less assembly area, facilitates the manufacture of a high-capacity, high-withstand-voltage ceramic capacitor, and occupies a small area on a circuit board.
［問題点を解決するための手段］
本発明は、２個以上のチップ型積層磁器コンデンサを積
み重ね、その各磁器コンデンサの外部電極を揃えて、そ
の各外部電極をハンダ付けし、その積み重ねした構造体
を１個のコンデンサとしたことを特徴とする磁器コンデ
ンサである。[Means for Solving the Problems] The present invention provides a stacked structure in which two or more chip-type multilayer ceramic capacitors are stacked, the external electrodes of each of the ceramic capacitors are aligned, and each external electrode is soldered. This is a ceramic capacitor characterized by having a single capacitor body.
［作用］
本発明によると、チップ型積層磁器コンデンサを積み重
ね、各外部電極を、融点２５０°Ｃ以上のハンダで接続
し、１個のコンデンサとしたものである。[Function] According to the present invention, chip-type multilayer ceramic capacitors are stacked, and each external electrode is connected with solder having a melting point of 250° C. or higher to form one capacitor.
次に、本発明の磁器コンデンサを、具体的な実施例によ
り、説明するが、本発明は、その説明により限定される
ものではない。Next, the ceramic capacitor of the present invention will be explained using specific examples, but the present invention is not limited by the explanation.
［実施例］
第１図は、本発明による磁器コンデンサの実施例の１つ
の断面図である。チ・ｙプ型積層磁器コンデンサとして
は、形状は、８ 、２ｍ＋ｘ ６ 、３ｍＸ１．７１１
１で、静電容量温度特性は、Ｘ７Ｒ特性（−５５℃〜１
２５℃において、ΔＣ／Ｃは±１５％以内のものである
）、定格電圧５００ｖ、公称静電容量２２０ｎＦのもの
を４個用いた。各積層磁器コンデンサは、エポキシ系接
着剤により接合される０次に、各々の端子電極が形成す
る面に、高温クリ−１、ハンダ（Ｉ！Ａ点２９０℃）を
適量塗布し、リフロー炉で各々の端子電極を接合するこ
とにより完成する。[Embodiment] FIG. 1 is a sectional view of one embodiment of a ceramic capacitor according to the present invention. The shape of the chip-y type multilayer ceramic capacitor is 8, 2m + x 6, 3m x 1.711.
1, the capacitance temperature characteristics are X7R characteristics (-55℃~1
(At 25° C., ΔC/C is within ±15%), a rated voltage of 500 V, and a nominal capacitance of 220 nF were used. Each multilayer ceramic capacitor is bonded with epoxy adhesive, and then an appropriate amount of high-temperature cream 1 and solder (I!A point 290°C) is applied to the surface where each terminal electrode will be formed, and then placed in a reflow oven. It is completed by joining each terminal electrode.
この実施例に用いたチップ型積層磁器コンデンサ単体と
、実施例による磁器コンデンサの形状、電気的特性を第
１表に示す、容量が４倍、絶縁抵抗が多少低下する以外
は、本実施例によるものと、チップ型積層磁器コンデン
サ単体とでは、電気特性に差が認められず、積層磁器コ
ンデンサのすぐれた特性をそのまま受は継いでいること
が分かる。Table 1 shows the chip-type multilayer ceramic capacitor used in this example, and the shape and electrical characteristics of the ceramic capacitor according to the example. There is no difference in the electrical characteristics between the chip-type multilayer ceramic capacitor and the single chip-type multilayer ceramic capacitor, indicating that the product retains the excellent characteristics of the multilayer ceramic capacitor.
更に、回路基板に実装するときに、基板上に占めるコン
デンサの面積（ＬＸＷ）は、チップ型コンデンサと同じ
であり、チップ型コンデンサと同じランド寸法でハンダ
付けできるものとなる。また、外部電極は、高温ハンダ
で被われており、フロー リフロー等の方法で電極に異
常を来すことなく、容易にハンダ付けできる。Furthermore, when mounted on a circuit board, the capacitor occupies the same area (LXW) on the board as a chip-type capacitor, and can be soldered with the same land size as a chip-type capacitor. Furthermore, the external electrodes are covered with high-temperature solder, and can be easily soldered using a method such as flow reflow without causing any abnormality to the electrodes.
チップ型磁器コンデンサを用いているので、安価で高い
容量と高い耐電圧性を有する磁器コンデンサを製造する
ことができる。Since a chip-type ceramic capacitor is used, it is possible to manufacture a ceramic capacitor that is inexpensive, has high capacity, and has high voltage resistance.
第２に、回路基板上の占有面積の小さいコンデンサを製
造でさる。Second, it allows the manufacture of capacitors that occupy less space on circuit boards.
第３に、回路基板への表面実装が容易に行なえる。Third, surface mounting on a circuit board can be easily performed.
以上のごとき顕著な技術的な効果が得られた。The remarkable technical effects described above were obtained.
第１図は、本発明の磁器コンデンサの１例を示す構造断
面図である。
試料２０個について測定した平均値で示した。
［発明の効果］
本発明の磁器：１ンデンサは、以上のように、２個以上
のチップ型積層磁器コンデンサを積み重ね、その各外部
電極をハンダ付けし、その組み立てた構造体を、１個の
コンデンサとしたことで、第１に、比較的に製造し易く
、形状の小さい［主要部分の符号の説明］
１ 、、、、、、、、チップ型積層磁器コンデンサ２
、、、、、、、、接着剤
３ 、、、、、、、、高温ハンダFIG. 1 is a structural cross-sectional view showing one example of the ceramic capacitor of the present invention. It is shown as the average value measured for 20 samples. [Effects of the Invention] As described above, the ceramic:1 capacitor of the present invention stacks two or more chip-type multilayer ceramic capacitors, solders their respective external electrodes, and combines the assembled structure into one By making it a capacitor, firstly, it is relatively easy to manufacture and has a small size.
, , , , , , Adhesive 3 , , , , , , High-temperature solder
Claims (1)
その各磁器コンデンサの各外部電極を揃えて、その各外
部電極をハンダ付けで接続し、その積み重ねした構造体
を１個のコンデンサとしたことを特徴とする磁器コンデ
ンサ。Stacking two or more chip-type multilayer ceramic capacitors,
A ceramic capacitor characterized in that the external electrodes of each of the magnetic capacitors are aligned, the external electrodes are connected by soldering, and the stacked structure is made into one capacitor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27725589A JPH03139814A (en) | 1989-10-26 | 1989-10-26 | Ceramic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27725589A JPH03139814A (en) | 1989-10-26 | 1989-10-26 | Ceramic capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03139814A true JPH03139814A (en) | 1991-06-14 |
Family
ID=17580980
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27725589A Pending JPH03139814A (en) | 1989-10-26 | 1989-10-26 | Ceramic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03139814A (en) |
-
1989
- 1989-10-26 JP JP27725589A patent/JPH03139814A/en active Pending
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