JPH03138079A - Soldering device - Google Patents
Soldering deviceInfo
- Publication number
- JPH03138079A JPH03138079A JP27410089A JP27410089A JPH03138079A JP H03138079 A JPH03138079 A JP H03138079A JP 27410089 A JP27410089 A JP 27410089A JP 27410089 A JP27410089 A JP 27410089A JP H03138079 A JPH03138079 A JP H03138079A
- Authority
- JP
- Japan
- Prior art keywords
- nozzle
- inert gas
- soldering device
- soldering
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005476 soldering Methods 0.000 title claims description 16
- 229910000679 solder Inorganic materials 0.000 claims abstract description 10
- 239000011261 inert gas Substances 0.000 claims abstract description 8
- 239000007789 gas Substances 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract description 2
- 238000002347 injection Methods 0.000 abstract 1
- 239000007924 injection Substances 0.000 abstract 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
- 229910001873 dinitrogen Inorganic materials 0.000 description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 241000269436 Ranidae Species 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、プリント基板に電子部品をはんだ付けするた
めの噴流式のはんだ付け装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a jet-type soldering device for soldering electronic components to a printed circuit board.
従来の技術
従来、噴流式のはんだ付け装置は、第２図に示すように
、先端部を細く絞った第１のノズル１１と、第１のノズ
ル１１よりも高い位置で片側だけに溶融はんだ１２を噴
出させる第２のノズル１３とを備えている。電子部品１
４を挿入あるいはマウントしたプリント基板１５は、ま
ず第１のノズル１１からの噴流を通過させたのち、未は
んだ部又ははんだのボタ付き部を第２のノズル１３によ
って正常なはんだ付け状態にするようになっている。BACKGROUND OF THE INVENTION Conventionally, as shown in FIG. 2, a jet-type soldering device has a first nozzle 11 with a narrow tip and a molten solder 12 on only one side at a higher position than the first nozzle 11. and a second nozzle 13 that spouts out. Electronic parts 1
4 is inserted or mounted, the jet stream from the first nozzle 11 passes through the printed circuit board 15, and then the unsoldered part or the solder buttoned part is brought into a normal soldering state by the second nozzle 13. It has become.
発明が解決しようとする課題
ところが、近年の電子部品１４の小型化、ラニドの微小
化にともない、第２のノズル１３だけでは未はんだやブ
リッジ、ボタ付き等のはんだ付け不良は修正できなくな
ってきているという問題があった。Problems to be Solved by the Invention However, with the miniaturization of electronic components 14 and miniaturization of ranids in recent years, it has become impossible to correct soldering defects such as unsoldered parts, bridges, and spots using only the second nozzle 13. There was a problem with that.
本発明は、上記従来の問題点を鑑み、はんだ付け不良を
少なくすることができる噴流式のはんだ付け装置を提供
することを目的とする。SUMMARY OF THE INVENTION In view of the above-mentioned conventional problems, an object of the present invention is to provide a jet-type soldering device that can reduce soldering defects.
課題を解決するための手段
本発明のはんだ付け装置は、上記目的を達成するために
、第１のノズルと第２のノズルとの間に、窒素ガス又は
窒素と水素の混合ガスを噴出させるためのノズルを設け
たことを特徴とする特作 用
本発明のはんだ付け装置によると、第１のノズルと第２
のノズルとの間に設けたノズルから出る不活性ガスによ
って、第１のノズルを通過してくるプリント基板で発生
する未はんだやブリッジボタ付き等を少なくすることが
できる。Means for Solving the Problems In order to achieve the above object, the soldering apparatus of the present invention includes a method for ejecting nitrogen gas or a mixed gas of nitrogen and hydrogen between the first nozzle and the second nozzle. According to the special feature of the soldering device of the present invention, which is characterized by being provided with a first nozzle and a second nozzle,
The inert gas emitted from the nozzle provided between the first nozzle and the first nozzle can reduce unsoldered spots, bridge bottles, etc. that occur on the printed circuit board passing through the first nozzle.
実 施 例
以下、本発明の一実施例におけるはんだ付け装置を第１
図に基づいて説明する。本実施例では第１図に示すよう
に先端部が先細になった第１のノズル１と、第１のノズ
ル１から出る噴流２に向って窒素ガスを噴射させるよう
な角度に設けた第３のガス噴出ノズル３と、第１のノズ
ル１よりも高い位置で片側だけに溶融はんだ４を噴出さ
せる第２のノズル５とを設けている。Embodiment Hereinafter, a soldering apparatus according to an embodiment of the present invention will be described.
This will be explained based on the diagram. In this embodiment, as shown in FIG. 1, the first nozzle 1 has a tapered tip, and the third nozzle is provided at an angle such that nitrogen gas is injected toward the jet 2 coming out of the first nozzle 1. A gas ejection nozzle 3 is provided, and a second nozzle 5 that ejects molten solder 4 only on one side is provided at a higher position than the first nozzle 1.
次に、動作を説明する。電子部品６を挿入、マウントし
たプリント基板７は、第１のノズル１からの噴流２を通
過すると同時に第３のガス噴出ノズル３からの窒素ガス
によって従来発生していた未はんだ部やブリッジ、ボタ
不良部を修正したのち、第２のノズル５の溶融はんだ４
によって最後の修正を行うことができる。Next, the operation will be explained. The printed circuit board 7 into which the electronic components 6 are inserted and mounted passes through the jet stream 2 from the first nozzle 1, and at the same time, the nitrogen gas from the third gas jet nozzle 3 removes the unsoldered parts, bridges, and buttons that are conventionally generated. After correcting the defective part, melt the solder 4 of the second nozzle 5.
Final corrections can be made by
なお、上記実施例において、窒素ガスの代りに窒素と水
素の混合ガスなどの不活性ガスを用いることができる。Note that in the above embodiments, an inert gas such as a mixed gas of nitrogen and hydrogen can be used instead of nitrogen gas.
発明の効果
本発明のはんだ付け装置によれば、以上の説明から明ら
かなように、第３のガス噴出ノズルから出る不活性ガス
によって狭い部分へのはんだ供給が可能になり、未はん
だやブリッジを解決することができる。Effects of the Invention According to the soldering device of the present invention, as is clear from the above description, the inert gas emitted from the third gas jet nozzle makes it possible to supply solder to narrow areas, thereby eliminating unsoldered parts and bridges. It can be solved.
またこの不活性ガスによって、第１のノズルを通過した
後のプリント基板の酸化を防止することができるため、
第２のノズルの効果がより高くでるようになる。Additionally, this inert gas can prevent the printed circuit board from oxidizing after passing through the first nozzle.
The second nozzle becomes more effective.
第１図は本発明の一実施例におけるはんだ付け装置の断
面図、第２図は従来例の断面図である。
１・・・・・・第１のノズル、２，４・・・・・・溶融
はんだ、３・・・・・・第３のノズル、５・・・・・・
第２のノズル、６・・・・・・電子部品、７・・・・・
・プリント基板。FIG. 1 is a sectional view of a soldering device according to an embodiment of the present invention, and FIG. 2 is a sectional view of a conventional example. 1...First nozzle, 2,4...Melted solder, 3...Third nozzle, 5...
Second nozzle, 6...Electronic component, 7...
·Printed board.
Claims (1)
噴出させて、プリント基板に電子部品をはんだ付けする
はんだ付け装置において、第１のノズルと第２のノズル
との間に、不活性ガスを噴出させるための第３のノズル
を設けたことを特徴とするはんだ付け装置。In a soldering device that spouts molten solder through a first nozzle and a second nozzle to solder electronic components to a printed circuit board, an inert gas is spouted between the first nozzle and the second nozzle. A soldering device characterized by being provided with a third nozzle for soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1274100A JP2819683B2 (en) | 1989-10-20 | 1989-10-20 | Soldering equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1274100A JP2819683B2 (en) | 1989-10-20 | 1989-10-20 | Soldering equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03138079A true JPH03138079A (en) | 1991-06-12 |
| JP2819683B2 JP2819683B2 (en) | 1998-10-30 |
Family
ID=17536998
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1274100A Expired - Fee Related JP2819683B2 (en) | 1989-10-20 | 1989-10-20 | Soldering equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2819683B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0592259A (en) * | 1991-09-30 | 1993-04-16 | Osaka Asahi Kagaku Kk | Soldering device in atmosphere of inert gas |
| JPH0565475U (en) * | 1992-02-18 | 1993-08-31 | 千住金属工業株式会社 | Automatic soldering equipment |
| JPH06304744A (en) * | 1993-04-23 | 1994-11-01 | Ichiro Kawakatsu | Method and device for soldering in inert atmosphere |
| JP2012019190A (en) * | 2010-07-07 | 2012-01-26 | Samsung Electro-Mechanics Co Ltd | Soldering injection nozzle and soldering machine including the same |
-
1989
- 1989-10-20 JP JP1274100A patent/JP2819683B2/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0592259A (en) * | 1991-09-30 | 1993-04-16 | Osaka Asahi Kagaku Kk | Soldering device in atmosphere of inert gas |
| JPH0565475U (en) * | 1992-02-18 | 1993-08-31 | 千住金属工業株式会社 | Automatic soldering equipment |
| JPH06304744A (en) * | 1993-04-23 | 1994-11-01 | Ichiro Kawakatsu | Method and device for soldering in inert atmosphere |
| JP2567336B2 (en) * | 1993-04-23 | 1996-12-25 | 一郎 川勝 | Soldering equipment in an inert atmosphere |
| JP2012019190A (en) * | 2010-07-07 | 2012-01-26 | Samsung Electro-Mechanics Co Ltd | Soldering injection nozzle and soldering machine including the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2819683B2 (en) | 1998-10-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |