JPH03128937U - - Google Patents

Info

Publication number
JPH03128937U
JPH03128937U JP3815690U JP3815690U JPH03128937U JP H03128937 U JPH03128937 U JP H03128937U JP 3815690 U JP3815690 U JP 3815690U JP 3815690 U JP3815690 U JP 3815690U JP H03128937 U JPH03128937 U JP H03128937U
Authority
JP
Japan
Prior art keywords
electrode terminals
conductive particles
insulating adhesive
substrates
pair
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3815690U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3815690U priority Critical patent/JPH03128937U/ja
Publication of JPH03128937U publication Critical patent/JPH03128937U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29199—Material of the matrix
    • H01L2224/2929—Material of the matrix with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29299—Base material
    • H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83851—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive

Description

【図面の簡単な説明】
第１図〜第５図は本考案に係る電極端子の接合
構造の一実施例を示す図であり、第１図は導電性
粒子入りシートを示す縦断面図、第２図は半導体
ユニツトの電極端子部分および導電性粒子入りシ
ートを示す縦断面図、第３図は半導体ユニツトの
電極端子部分に導電性粒子が付着した状態を示す
縦断面図、第４図は接続用の電極端子部分を示す
縦断面図、第５図は完成された接合構造の縦断面
図、第６図および第７図は従来の電極端子の接合
構造を示す図であり、第６図は電極端子の接合構
造の平面図、第７図は接合部の縦断面図である。 ３ｂ……ＬＣＤガラス、４……ＩＴＯパターン
、２１……導電性粒子、２２……熱可塑性接着剤
、２３……導電性粒子２１入りシート、２４……
剥離紙、２５……フイルム基板、２６……電極端
子、２８……パターン。

Claims (1)

  1. 【実用新案登録請求の範囲】 一対の基板に形成された対向する電極端子間に
    、絶縁性接着剤及び導電粒子を介在させて接合す
    る接合構造において、 前記一対の基板のうちの一方の基板の電極端子
    に導電性粒子を付着させ、他方の基板の電極端子
    に絶縁性接着剤を施し、接合時に前記導電性粒子
    によつて該絶縁性接着剤を該電極端子間より逃が
    すようにして前記導電性粒子により前記互いに対
    向する電極端子間を導通させるように構成された
    ことを特徴とする電極端子の接合構造。
JP3815690U 1990-04-10 1990-04-10 Pending JPH03128937U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3815690U JPH03128937U (ja) 1990-04-10 1990-04-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3815690U JPH03128937U (ja) 1990-04-10 1990-04-10

Publications (1)

Publication Number Publication Date
JPH03128937U true JPH03128937U (ja) 1991-12-25

Family

ID=31545909

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3815690U Pending JPH03128937U (ja) 1990-04-10 1990-04-10

Country Status (1)

Country Link
JP (1) JPH03128937U (ja)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS504666B1 (ja) * 1970-12-25 1975-02-22
JPS62154746A (ja) * 1985-12-27 1987-07-09 Casio Comput Co Ltd 電子部品の接合方法
JPH01227444A (ja) * 1988-03-07 1989-09-11 Sharp Corp 接続構造

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS504666B1 (ja) * 1970-12-25 1975-02-22
JPS62154746A (ja) * 1985-12-27 1987-07-09 Casio Comput Co Ltd 電子部品の接合方法
JPH01227444A (ja) * 1988-03-07 1989-09-11 Sharp Corp 接続構造

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