JPH03127893A - Flexible wiring board - Google Patents
Flexible wiring boardInfo
- Publication number
- JPH03127893A JPH03127893A JP26734489A JP26734489A JPH03127893A JP H03127893 A JPH03127893 A JP H03127893A JP 26734489 A JP26734489 A JP 26734489A JP 26734489 A JP26734489 A JP 26734489A JP H03127893 A JPH03127893 A JP H03127893A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- flexible wiring
- wiring board
- polyphenylene oxide
- metal foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 claims abstract description 22
- 239000011347 resin Substances 0.000 claims abstract description 22
- 239000011888 foil Substances 0.000 claims abstract description 12
- 229910052751 metal Inorganic materials 0.000 claims abstract description 10
- 239000002184 metal Substances 0.000 claims abstract description 10
- 239000004721 Polyphenylene oxide Substances 0.000 claims abstract description 8
- 229920006380 polyphenylene oxide Polymers 0.000 claims abstract description 8
- 239000000945 filler Substances 0.000 claims abstract description 7
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 7
- 238000006243 chemical reaction Methods 0.000 claims abstract description 6
- 239000003999 initiator Substances 0.000 claims abstract description 6
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 claims abstract description 5
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 3
- 239000003063 flame retardant Substances 0.000 claims description 3
- -1 polybutylene terephthalate Polymers 0.000 abstract description 5
- 229920002857 polybutadiene Polymers 0.000 abstract description 3
- 229920001707 polybutylene terephthalate Polymers 0.000 abstract description 3
- 239000005062 Polybutadiene Substances 0.000 abstract description 2
- 229920001225 polyester resin Polymers 0.000 abstract description 2
- 239000004645 polyester resin Substances 0.000 abstract description 2
- 238000000034 method Methods 0.000 abstract 1
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000002966 varnish Substances 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 4
- 238000001035 drying Methods 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical class C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920002284 Cellulose triacetate Polymers 0.000 description 1
- 244000175448 Citrus madurensis Species 0.000 description 1
- 235000017317 Fortunella Nutrition 0.000 description 1
- 229920006361 Polyflon Polymers 0.000 description 1
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- NNLVGZFZQQXQNW-ADJNRHBOSA-N [(2r,3r,4s,5r,6s)-4,5-diacetyloxy-3-[(2s,3r,4s,5r,6r)-3,4,5-triacetyloxy-6-(acetyloxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6s)-4,5,6-triacetyloxy-2-(acetyloxymethyl)oxan-3-yl]oxyoxan-2-yl]methyl acetate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](OC(C)=O)[C@H]1OC(C)=O)O[C@H]1[C@@H]([C@@H](OC(C)=O)[C@H](OC(C)=O)[C@@H](COC(C)=O)O1)OC(C)=O)COC(=O)C)[C@@H]1[C@@H](COC(C)=O)O[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O NNLVGZFZQQXQNW-ADJNRHBOSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 150000001491 aromatic compounds Chemical class 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は電子機器、電気機器、コンピューター、通信機
器等に用いられるフレキシブル配線基板に関するもので
ある。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a flexible wiring board used in electronic equipment, electrical equipment, computers, communication equipment, etc.
従来のフレキシブル配線基板はポリエステルフィルムや
ポリイミドフィルムに銅箔等の金属箔を接着剤で以って
接着一体化してなるもので、各れも誘電率が比較的大き
く、且つ耐熱性に限界があった。Conventional flexible wiring boards are made by bonding metal foil such as copper foil to a polyester film or polyimide film using an adhesive, and each has a relatively high dielectric constant and has a limited heat resistance. Ta.
（１）
〔発明が解決しようとする問題点〕
従来の技術で述べたように熱可塑性樹脂フィルムと金属
箔とを接着してなるフレキシブル配線基板においては誘
電率、耐熱性に問題がある。本発明は従来の技術におけ
る上述の問題点に鑑みてなされたもので、その目的とす
るところは優れた高周波特性を有する且つ耐熱性のよい
フレキシブル配線基板を提供することにある。(1) [Problems to be Solved by the Invention] As described in the prior art, a flexible wiring board formed by bonding a thermoplastic resin film and a metal foil has problems in dielectric constant and heat resistance. The present invention has been made in view of the above-mentioned problems in the conventional technology, and its purpose is to provide a flexible wiring board having excellent high frequency characteristics and good heat resistance.
本発明はポリフェニレンオキサイドに対し、熱可塑性樹
脂、トリアリルインシアヌレート、難燃剤、反応開始剤
を添加し、更に必要に応じて充填剤を添加してなる樹脂
層と金属箔とからなることを特徴とするフレキシブル配
線基板のため、上記目的を達成することができたもので
、以下本発明の詳細な説明する。The present invention consists of a resin layer and a metal foil made by adding a thermoplastic resin, triallyl in cyanurate, a flame retardant, and a reaction initiator to polyphenylene oxide, and further adding a filler as necessary. The above object can be achieved because of the flexible wiring board having the characteristics, and the present invention will be described in detail below.
本発明に用粘るポリフェニレンオキサイドとしては変性
物をも包含するもので、特に限定しなｈが添加量は２０
〜７０重量部（以下単に部と記す）であることが好まし
い。熱可塑性樹脂としてはポリ２）
ブタジェン樹脂、ポリエステル樹脂、ポリブチレンテレ
フタレート樹脂等のようにポリフェニレンオキサイド樹
脂と相溶性のあるものならばよく特に限定するものでは
ないが、添加量は２〜３０部であることが好ましｔｎ０
トリアリルイソシアメレートとしては七ツマ−及び又は
プレポリマーとして用いることができ、添加量は１０〜
７０部であることが好ましい。難燃剤としては特に限定
するものではないが、テトラブロムビスフェノールＡ誘
導体ブロム化芳香族化合物等が好ましく、添加量は特に
限定しなり０反応開始剤としては有機過酸化物金柑ｂ１
添加量は１〜５部が好ましい。必要に応じて添加される
充填剤の種類は特に限定するものではなりが好ましくは
、粒径１〜ｌＯミクロンのクレー シリカ、タルク、炭
酸カルシウム、水酸化アルミニウム、セラミ、＋）り粉
等の無機充填剤を用いることが望ましい。なお充填剤を
添加する場合はシランカップリング剤を添加することが
好ましｂｏかくして得られる樹脂絹戚物はトルエン、ト
リクレン等の溶剤で粘度調整した樹脂ワニスを（３）
銅、アルミニウム、鉄、二＋−）ケル、亜鉛等の単独、
合金、組合せ箔等の金属箔に直接塗布、乾燥、硬化させ
たり或は上記樹脂ワニスをポリエチレンテレフタレート
フィルム、ポリブチレンテレフタレートフィルム、ポリ
イミドフィルム、ポリフェニレンサル７アイドフイルム
、弗素樹脂フィルムセルローズトリアセテートフィルム
笠のプラス千ツクフィルムや銅箔、アルミニウム箔等の
ような金属箔に塗布、乾燥後、離型シートを除去して傅
られる樹脂シートを金属箔に重ねて加熱加圧硬化させて
フレキシブル配線基板を得るものであるが、製造方法は
特に限定するものではない。樹脂層の厚みは硬化後で５
〜５００ミクロンであることが好ましい。なお金属箔は
樹脂層の上下面に配設することもできる。The polyphenylene oxide used in the present invention includes modified products, and is not particularly limited.
It is preferably 70 parts by weight (hereinafter simply referred to as parts). The thermoplastic resin is not particularly limited as long as it is compatible with polyphenylene oxide resin, such as poly(2) butadiene resin, polyester resin, polybutylene terephthalate resin, etc., but the amount added is 2 to 30 parts. It is preferable to have tn0
Triallyl isocyanate can be used as a 7-mer and/or prepolymer, and the amount added is 10 to 10%.
Preferably it is 70 parts. The flame retardant is not particularly limited, but preferred are tetrabromobisphenol A derivatives, brominated aromatic compounds, etc., and the amount added is not particularly limited.As the reaction initiator, organic peroxide kumquat b1
The amount added is preferably 1 to 5 parts. The type of filler added as necessary is not particularly limited, but preferably inorganic fillers such as clay silica, talc, calcium carbonate, aluminum hydroxide, ceramic powder, etc. with a particle size of 1 to 10 microns are used. It is desirable to use fillers. In addition, when adding a filler, it is preferable to add a silane coupling agent.The resin varnish thus obtained is a resin varnish whose viscosity has been adjusted with a solvent such as toluene or trichlene.(3) Copper, aluminum, iron, 2+-) Kel, zinc, etc. alone,
Directly apply, dry, and harden the above resin varnish to metal foils such as alloys and combination foils, or apply the above resin varnish to polyethylene terephthalate film, polybutylene terephthalate film, polyimide film, polyphenylene salt 7-eyed film, fluororesin film, cellulose triacetate film, etc. A flexible wiring board is obtained by coating a metal foil such as a solid film, copper foil, aluminum foil, etc., drying it, removing the release sheet, overlaying the resulting resin sheet on the metal foil, and curing it under heat and pressure. However, the manufacturing method is not particularly limited. The thickness of the resin layer is 5 after curing.
~500 microns is preferred. Note that the metal foil can also be provided on the upper and lower surfaces of the resin layer.
以下本発明を実施例にもとづいて説明する。The present invention will be explained below based on examples.
実施例
ポリフェニレンオキサイド４５部、ポリブタジェンＬ５
部、トリアリルイソシアヌレートモノマー２０部、トリ
アリルイソシアヌレートプレポリマー２０４ ）
部、テトラブロムビスフェノールＡ １０部、パーブチ
ルＰ（反応開始剤、日本油脂株式会社製）２部、粒径５
ミクロンの水酸化アルミニウム１００ 部、トルエン２
００部からなる樹脂ワニスを乾燥後厚みが１００ミクロ
ンになるように犀み２５ミクロンの弗素樹脂フィルム（
ダイキン工業株式会社製、商品名ポリフロンフィルム）
に塗布、乾燥して離型シート付樹脂シートを得、離型シ
ートｖ除去して厚み１００ミクロンの樹脂シートを得た
。次に厚さＱ、０３５１肩の銅箔上上記樹脂シートとを
成形圧力４ｏＫＱ／ｄ 、 ｔｓｏ℃で９０分間積層
成形してフレキシブル配線基板を得た。Example 45 parts of polyphenylene oxide, polybutadiene L5
20 parts of triallyl isocyanurate monomer, 204 parts of triallyl isocyanurate prepolymer, 10 parts of tetrabromobisphenol A, 2 parts of Perbutyl P (reaction initiator, manufactured by NOF Corporation), particle size 5
100 parts of micron aluminum hydroxide, 2 parts of toluene
After drying a resin varnish consisting of 0.00 parts, it was coated with a fluororesin film of 25 microns to a thickness of 100 microns (
Manufactured by Daikin Industries, Ltd. (trade name: Polyflon film)
The resin sheet with a release sheet was obtained by coating and drying, and the release sheet was removed to obtain a resin sheet with a thickness of 100 microns. Next, a flexible wiring board was obtained by laminating and molding the above resin sheet on a copper foil having a thickness of Q and a shoulder of 0351 for 90 minutes at a molding pressure of 4 degrees KQ/d and a temperature of 2 degrees Celsius.
比較例
厚す１００ミクロンのポリイミドフィルムと厚さ０．０
３５ｆｆ躍の銅箔とをエポキシ樹脂接右剤で接着してフ
レキシブル配線基板を得た。Comparative example: Polyimide film with a thickness of 100 microns and a thickness of 0.0
A flexible wiring board was obtained by bonding the 35FF copper foil with an epoxy resin adhesive.
実施例及び比較例のフレキシブル配線基板の性能は第１
表のようである。The performance of the flexible wiring boards of Examples and Comparative Examples was the first.
It looks like a table.
（５）
〔発明の効果〕
本発明は上述した如＜積取されてｂる。特許請求の範囲
に記載した構ｖｉ、ｖ有するフレキシブル配線基板にお
りでは、優れた高周波特性と耐熱性を有するフレキシブ
ル配線基板が褐られる効果がある。(5) [Effects of the Invention] The present invention is implemented as described above. The flexible wiring board having structures vi and v described in the claims has the effect that a flexible wiring board having excellent high frequency characteristics and heat resistance can be browned.
Claims (1)
、トリアリルイソシアヌレート、難燃剤、反応開始剤を
添加し、更に必要に応じて充填剤を添加してなる樹脂層
と金属箔とからなることを特徴とするフレキシブル配線
基板。(1) Consisting of a resin layer and metal foil made by adding a thermoplastic resin, triallylisocyanurate, a flame retardant, and a reaction initiator to polyphenylene oxide, and further adding a filler as necessary. A flexible wiring board featuring:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26734489A JPH03127893A (en) | 1989-10-12 | 1989-10-12 | Flexible wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26734489A JPH03127893A (en) | 1989-10-12 | 1989-10-12 | Flexible wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03127893A true JPH03127893A (en) | 1991-05-30 |
Family
ID=17443514
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26734489A Pending JPH03127893A (en) | 1989-10-12 | 1989-10-12 | Flexible wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03127893A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005057000A (en) * | 2003-08-01 | 2005-03-03 | Asahi Kasei Chemicals Corp | Film for flexible printed circuit board |
-
1989
- 1989-10-12 JP JP26734489A patent/JPH03127893A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005057000A (en) * | 2003-08-01 | 2005-03-03 | Asahi Kasei Chemicals Corp | Film for flexible printed circuit board |
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