JPH03126830A - High strength copper alloy - Google Patents
High strength copper alloyInfo
- Publication number
- JPH03126830A JPH03126830A JP26387489A JP26387489A JPH03126830A JP H03126830 A JPH03126830 A JP H03126830A JP 26387489 A JP26387489 A JP 26387489A JP 26387489 A JP26387489 A JP 26387489A JP H03126830 A JPH03126830 A JP H03126830A
- Authority
- JP
- Japan
- Prior art keywords
- copper alloy
- strength
- alloy
- thermal conductivity
- high strength
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 41
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 4
- 239000010949 copper Substances 0.000 claims description 16
- 239000000956 alloy Substances 0.000 abstract description 22
- 239000004065 semiconductor Substances 0.000 abstract description 4
- 239000000463 material Substances 0.000 abstract description 3
- 230000032683 aging Effects 0.000 abstract description 2
- 229910045601 alloy Inorganic materials 0.000 description 21
- 238000000034 method Methods 0.000 description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 9
- 239000000203 mixture Substances 0.000 description 7
- 238000005728 strengthening Methods 0.000 description 7
- 239000002244 precipitate Substances 0.000 description 6
- 239000000654 additive Substances 0.000 description 5
- 230000000996 additive effect Effects 0.000 description 5
- 239000006104 solid solution Substances 0.000 description 5
- 230000007423 decrease Effects 0.000 description 4
- 229910000765 intermetallic Inorganic materials 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 230000010354 integration Effects 0.000 description 3
- 238000001556 precipitation Methods 0.000 description 3
- 229910017526 Cu-Cr-Zr Inorganic materials 0.000 description 2
- 229910017810 Cu—Cr—Zr Inorganic materials 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000001376 precipitating effect Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000005242 forging Methods 0.000 description 1
- 238000005098 hot rolling Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005482 strain hardening Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Abstract
Description
【発明の詳細な説明】
［発明の目的］
（産業上の利用分野）
本発明は高力銅合金に関し、さらに詳しくはＩＣなどの
半導体用リードフレーム、あるいはコネクターなどに用
いられる高力銅合金に関する。[Detailed Description of the Invention] [Object of the Invention] (Industrial Application Field) The present invention relates to a high-strength copper alloy, and more particularly to a high-strength copper alloy used in lead frames for semiconductors such as ICs, connectors, etc. .
（従来の技術）
従来、ＩＣなどの半導体用リードフレームには例えばＦ
ｅ−４２Ｎｉ系合金等のＦｅ系合金を用いている。これ
はＦｅ系合金の有する性質、つまり引張り強度あるいは
硬度などの機械的強度が優れているためである。(Prior art) Conventionally, lead frames for semiconductors such as ICs have, for example, F.
Fe-based alloys such as e-42Ni-based alloys are used. This is because the Fe-based alloy has excellent mechanical strength such as tensile strength and hardness.
一方、熱伝導性を向上させるためにＣｕに微量の元素を
添加した、例えばＣｕ−Ｃｒ−Ｚｒ合金などのＣｕ合金
を用いることも行われている。On the other hand, in order to improve thermal conductivity, Cu alloys such as Cu-Cr-Zr alloys, in which trace amounts of elements are added to Cu, have also been used.
（発明が解決しようとする課題）
上記したような従来のＦｅ系合金あるいはＣｕ系合金に
おいて、まずＦｅ系合金は熱伝導性が低いために近年の
ＩＣチップなどの高集積化。(Problems to be Solved by the Invention) Regarding the conventional Fe-based alloys or Cu-based alloys as described above, first of all, Fe-based alloys have low thermal conductivity, so they have become highly integrated in recent years such as IC chips.
高出力化に伴う発熱に対して、放熱効果が不十分であり
配線の断線などの不具合を起こす原因となる場合があり
、他方Ｃｕ系合金は熱伝導性は良好であるが強度におい
てＦｅ系合金はど高くなく不十分であるため、たとえば
リードフレームとして用いた場合に基板への挿入、取扱
い、ハンダデイッ゛プなどにおいてリードの強度、特に
高集積化に伴うリードの微細化において問題を生じる場
合があった。The heat dissipation effect is insufficient for the heat generated by high output, which may cause problems such as wiring breakage.On the other hand, Cu-based alloys have good thermal conductivity, but Fe-based alloys have poor strength. For example, when used as a lead frame, problems may arise in the strength of the leads during insertion into a board, handling, solder dipping, etc., especially in the miniaturization of leads due to higher integration. there were.
上記したような問題により合圧のＩＣの高集積化には対
応できなくなってきたため、新たに熱伝導性が高くかつ
強度もＦｅ系合金と同等の高強度を有する材料が求めら
れてきた。Due to the above-mentioned problems, it has become impossible to cope with the high integration of combined pressure ICs, so a new material with high thermal conductivity and strength comparable to that of Fe-based alloys has been sought.
本発明者らは上記問題を解決するために、高熱伝導性を
有するＣｕ合金を採用し、高強度を付与するための方法
について検討を重ねた。In order to solve the above problem, the present inventors adopted a Cu alloy having high thermal conductivity and repeatedly studied methods for imparting high strength.
ここで、高熱伝導性を有するＣｕ系の材料の機械的強度
を向上させる方法について説明する。この方法としては
次に挙げる３種類の方法が考えられる。以下、その説明
を行なう。Here, a method for improving the mechanical strength of a Cu-based material having high thermal conductivity will be described. The following three methods can be considered as this method. The explanation will be given below.
３つの方法とは、１）固溶強化、２）加工強化。The three methods are 1) solid solution strengthening and 2) processing strengthening.
３）析出強化の３種類である。3) There are three types of precipitation strengthening.
この３つの方法を比較・検討してみると、まず固溶強化
を行う場合、添加元素のＣｕへの固溶により熱伝導性が
低下するため好ましくない。また、加工強化を行なう場
合、使用時における温度上昇に伴い合金が軟化し、また
異方性が生じるため好ましくない。したがってＣｕ系合
金の高熱伝導性を維持したままで機械的強度を向上させ
る方法としては析出強化が有、効である。Comparing and examining these three methods, it is found that solid solution strengthening is not preferred because the thermal conductivity decreases due to solid solution of the additive element in Cu. In addition, when performing work strengthening, the alloy softens as the temperature rises during use and anisotropy occurs, which is not preferable. Therefore, precipitation strengthening is an effective method for improving the mechanical strength of Cu-based alloys while maintaining their high thermal conductivity.
本発明においてもこの析出強化の方法を採用し、Ｃｕ合
金中に金属間化合物を析出させることにより高熱伝導性
を維持したままでＣｕ系合金の強度を向上しようとする
ものである。The present invention also employs this method of precipitation strengthening, and attempts to improve the strength of the Cu-based alloy while maintaining high thermal conductivity by precipitating intermetallic compounds in the Cu alloy.
本発明は、高強度でかつ高熱伝導性を有する高力銅合金
の提供を目的とする。The present invention aims to provide a high-strength copper alloy having high strength and high thermal conductivity.
［発明の構成］
（課題を解決するための手段）
本発明は、Ｓｉ：０．０１ｗｔ％以上、 １ｗｔ％以
下；Ｔｉ：Ｏ，０１ｗｔ％以上、２ｗｔ％以下；Ｍｇ：
Ｑ、０１ｗｔ％以上、１ｗｔ％以下。[Structure of the Invention] (Means for Solving the Problems) The present invention provides Si: 0.01 wt% or more and 1 wt% or less; Ti: O, 01 wt% or more and 2 wt% or less; Mg:
Q, 01wt% or more and 1wt% or less.
Ｎｉ：Ｏ，１ｗｔ％以上、３ｗｔ％以下；残部実質的に
Ｃｕからなる高力銅合金である。Ni:O, 1 wt% or more and 3 wt% or less; the balance is a high-strength copper alloy consisting essentially of Cu.
以下、本願発明の高力銅合金の添加成分の限定理由を詳
述する。The reasons for limiting the additive components of the high-strength copper alloy of the present invention will be explained in detail below.
Ｓｉ、Ｔｉ、ＭｇはＣｕ基地中にＮｉとの金属間化合物
よりなる析出物を析出することにより強度を向上する元
素であり、まずＳｉはあまりその量が少ないと得られる
銅合金中の析出物の量が少ないため強度が向上しに＜＜
、逆にあまりその量が多いとＣ，ｕ中に固溶したりある
いは単体で残留するため、加工性および製造される銅合
金の熱伝導性、導電率が低下しやすく好ましくない。そ
のためＳｉ量はＯ，０１ｗｔ％以上、１ｗｔ％以下が好
ましい。Si, Ti, and Mg are elements that improve strength by precipitating precipitates consisting of intermetallic compounds with Ni in the Cu base, and first of all, Si precipitates in the copper alloy obtained when the amount is too small. The strength is improved due to the small amount of
On the other hand, if the amount is too large, it becomes a solid solution in C and u or remains as a single substance, which is undesirable because workability and the thermal conductivity and electrical conductivity of the produced copper alloy tend to decrease. Therefore, the amount of Si is preferably 0.01 wt% or more and 1 wt% or less.
Ｔｉはあまりその量が少ないと得られる銅合金中の析出
物の量が少ないため強度が向上しにくく、逆にあまりそ
の量が多いとＣｕ中に固溶したりあるいは単体で残留す
るため、加工性および製造される銅合金の熱伝導性、導
電率が低下しやすく好ましくない。そのためＴｉ量は０
．０１ｗｔ％以上、２ｗｔ％以下が好ましい。より好ま
しくはＱ、１ｗｔ％以上、０．５ｗｔ％以下である。If the amount of Ti is too small, the amount of precipitates in the resulting copper alloy will be small, making it difficult to improve the strength.On the other hand, if the amount is too large, it will dissolve in the Cu or remain alone, making it difficult to process. This is not preferable because it tends to lower the properties and the thermal conductivity and electrical conductivity of the copper alloy produced. Therefore, the amount of Ti is 0
．． The content is preferably 01 wt% or more and 2 wt% or less. More preferably, Q is 1 wt% or more and 0.5 wt% or less.
Ｍｇはあまりその量が少ないと得られる銅合金中の析出
物の量が少ないため強度が向上しにくく、逆にあまりそ
の量が多いとＣｕ中に固溶したりあるいは単体で残留す
るため、加工性および製造される銅合金の熱伝導性、導
電率が低下しやすく好ましくない。そのためＭｇ量は０
゜０１ ｗ ｔ％以上、１ｗｔ％以下が好ましい。より
好ましくは０．０２ｗｔ％以上、Ｑ、５ｗｔ％以下であ
る。If the amount of Mg is too small, the amount of precipitates in the resulting copper alloy will be small, making it difficult to improve the strength.On the other hand, if the amount is too large, it will dissolve in the Cu or remain alone, making it difficult to process. This is not preferable because it tends to lower the properties and the thermal conductivity and electrical conductivity of the copper alloy produced. Therefore, the amount of Mg is 0
It is preferably at least 0.01 wt% and at most 1 wt%. More preferably, it is 0.02 wt% or more and Q, 5 wt% or less.
Ｎｉはあまりその量が少ないと各添加元素との金属間化
合物より得られる銅合金中の析出物の量が少ないため強
度が向上しにくく、逆にあまりその量が多いとＣｕ中に
固溶したりあるいは単体で残留するため、加工性および
製造される銅合金の熱伝導性、導電率が低下しやすく好
ましくない。If the amount of Ni is too small, the amount of precipitates in the copper alloy obtained from intermetallic compounds with each additive element will be small, making it difficult to improve the strength.On the other hand, if the amount is too large, it will form a solid solution in Cu. This is undesirable because it tends to reduce processability and the thermal conductivity and electrical conductivity of the copper alloy produced.
そのためＮｉ量は０１１ｗｔ％以上、３ｗｔ％以下が好
ましい。より好ましくは０，５ｗｔ％以上。Therefore, the amount of Ni is preferably 0.11 wt% or more and 3 wt% or less. More preferably 0.5 wt% or more.
１．５ｗｔ％以下である。It is 1.5 wt% or less.
ここでＮｉは他の３元素、すなわちＳｉ、Ｔｉ。Here, Ni is the other three elements, namely Si and Ti.
Ｍｇと金属間化合物となりＣｕ基地中に析出するのであ
るが、各添加元素とＮｉとの関係は以下の関係が好まし
い。It becomes an intermetallic compound with Mg and precipitates in the Cu base, and the relationship between each additional element and Ni is preferably as follows.
３、Ｎ１ｗｔ％（Ｓｉ）、５
Ｓ ｉｗｔ％
Ｍｇｗ ｔ％
Ｔｉｗｔ％
Ｎ１ｗｔ％ （Ｔ ｄ ｄ）＝Ｎｉｗｔ％ （Ｓｉ
）＋Ｎ１ｗｔ％（Ｍｇ）十Ｎ１ｗｔ％（Ｔｔ）なお、本
明細書においてＮ１ｗｔ％（Ｘ）とは添加元素ＸとＣｕ
合金中に析出するＮｉｆｆ１を表わすものとする。3, N1wt% (Si), 5 Siwt% Mgwt% Tiwt% N1wt% (T d d) = Niwt% (Si
) + N1wt% (Mg) + N1wt% (Tt) In this specification, N1wt% (X) refers to the additive element X and Cu.
Let it represent Niff1 precipitated in the alloy.
より好ましくは、 Ｎ１ｗｔ％（Ｓｉ）号４，２ Ｓ ｉ ｗ ｔ％ Ｎ１ｗｔ％（Ｍｇ） −，１，２ Ｍｇｗｔ％ Ｎ ｉ ｗ ｔ％（’ｒＤ 、、 ７ Ｔｉｗｔ％ である。More preferably, N1wt% (Si) No. 4,2 S i w t% N1wt% (Mg) -, 1, 2 Mgwt% N i w t%('rD ,, 7 Tiwt% It is.
上記添加元素の他に、本発明の効果がより顕著になる元
素を若干量添加することは何等問題はない。その中でも
Ｃｒ、Ｚｒが好ましい。その量としてはＣｒは、Ｏ，Ｑ
５ｗｔ％以上、 ０． ４ｗｔ％以下；Ｚｒは、０．
０１ｗｔ％以上、 ０． ３ｗｔ％以下である。In addition to the above additive elements, there is no problem in adding a small amount of an element that makes the effect of the present invention more pronounced. Among them, Cr and Zr are preferred. The amount of Cr is O, Q
5wt% or more, 0. 4wt% or less; Zr is 0.
01 wt% or more, 0. It is 3wt% or less.
Ｃｒは０．０５ｗｔ％未満では製造される銅合金の強度
が向上しにくいため好ましくなく、また、０．４ｗｔ％
を超える場合には製造される銅合金の導電率および曲げ
疲労強度が低下しやすく、また鋳造しにくいため好まし
くない。好ましいＣｒ量は０，２ｗｔ％以上、０．３５
ｗｔ％以下である。If Cr is less than 0.05 wt%, it is difficult to improve the strength of the copper alloy produced, so it is not preferable, and if Cr is less than 0.4 wt%
If it exceeds the above range, the electrical conductivity and bending fatigue strength of the produced copper alloy tend to decrease, and it is difficult to cast, which is not preferable. The preferable amount of Cr is 0.2 wt% or more, 0.35
wt% or less.
Ｚｒは０．０１ｗｔ％未満では製造される銅合金の強度
が向上しにくいため好ましくなく、また、０．３ｗｔ％
を超える場合には製造される銅合金の導電率および曲げ
強度が低下しやすく、また鋳造しにいため好ましくない
。好ましいＺｒ量は０．０３ｗｔ％以上、０．１５ｗｔ
％以下である。Zr is not preferable if it is less than 0.01 wt% because it is difficult to improve the strength of the produced copper alloy, and if it is less than 0.3 wt%
If it exceeds this value, the electrical conductivity and bending strength of the produced copper alloy tend to decrease, and it becomes difficult to cast, which is not preferable. The preferred amount of Zr is 0.03wt% or more, 0.15wt
% or less.
以下、本発明の組成の銅合金を製造する具体的な手段・
工程の１例を説明する。Hereinafter, specific means for producing the copper alloy having the composition of the present invention will be described.
An example of the process will be explained.
まず、本発明の組成の銅合金をそれぞれ常法により溶解
・鋳造してインゴットを製造する。その後、８００〜１
０００°Ｃにて鍛造してビレットを形成する。その後、
７５０〜１０００℃にて熱間圧延を行い、６００℃以上
の温度より急冷することにより溶体化処理を行う。その
後、冷間加工を施し、２００〜５００℃にて時効処理を
行い本発明の銅合金を製造する。First, each copper alloy having the composition of the present invention is melted and cast by a conventional method to produce an ingot. After that, 800-1
A billet is formed by forging at 000°C. after that,
Hot rolling is performed at 750 to 1000°C, and solution treatment is performed by rapidly cooling from a temperature of 600°C or higher. Thereafter, cold working is performed and aging treatment is performed at 200 to 500°C to produce the copper alloy of the present invention.
本発明の高力銅合金は、例えばＩＣなどの半導体用リー
ドフレーム、あるいはコネクターなど高強度でかつ熱伝
導性が要求される用途において用いられるものであり、
これらの特性が要求される用途であれば何等限定される
ものではない。The high-strength copper alloy of the present invention is used in applications that require high strength and thermal conductivity, such as lead frames for semiconductors such as ICs, or connectors.
There are no limitations as long as the use requires these characteristics.
（実施例） 以下、本発明の詳細な説明する。(Example) The present invention will be explained in detail below.
第１表に示す組成を有する合金成分をそれぞれ常法によ
り溶解・鋳造してインゴットを製造した後、８５０℃に
て鍛造してビレットを形成した。Ingots were produced by melting and casting alloy components having the compositions shown in Table 1 using conventional methods, and then forged at 850° C. to form billets.
そのビレットを９００℃で熱間圧延を行い、直接６００
℃以上の温度で急冷して溶体化処理を行った。その後冷
間加工を施し、厚さ０．２５ｍｍとして３００℃にて時
効処理を行い高力銅合金を製造した。The billet was hot rolled at 900℃ and directly rolled at 600℃.
Solution treatment was performed by rapid cooling at a temperature of ℃ or higher. Thereafter, it was cold-worked to a thickness of 0.25 mm and aged at 300°C to produce a high-strength copper alloy.
第１表に本発明の実施例で用いた高力銅合金の組成を示
す。なお第１表には比較として、従来の銅合金の１種で
あるＣｕ−Ｃｒ−Ｚｒ合金をＮｏ。Table 1 shows the composition of the high strength copper alloy used in the examples of the present invention. For comparison, Table 1 shows Cu-Cr-Zr alloy, which is a type of conventional copper alloy.
８に、Ｃｕ−Ｃｒ−Ｚ ｒ−Ｔ ｉ合金をＮｏ、、９に
、さらに従来のＦｅ−４２Ｎｉ合金をＮｏ、１．０に併
せて示す。8 shows the Cu-Cr-Zr-Ti alloy as No. 9, and the conventional Fe-42Ni alloy as No. 1.0.
以
下
余
白
このようにして製造した高力銅合金の引張強度（ｋ ｇ
／ ｍ ｍ ” ） ＋ ビッカース硬度（Ｈｖ）
、導電率（ＩＡＣ８％）、折曲げ回数を測定した。その
結果を第２表に示す。なお、本発明の高力銅合金との比
較のため、第１表に示した比較例の測定結果も併せて示
す。The following margin shows the tensile strength (kg g) of the high strength copper alloy produced in this way.
/ mm”) + Vickers hardness (Hv)
, electrical conductivity (IAC 8%), and number of bends were measured. The results are shown in Table 2. For comparison with the high-strength copper alloy of the present invention, the measurement results of comparative examples shown in Table 1 are also shown.
なお、熱伝導性についてはこれと比例関係にある導電率
を測定することにより代替した。Note that thermal conductivity was replaced by measuring electrical conductivity, which is in a proportional relationship.
以下余白
第２表から明らかなように、本発明の組成の銅合金とす
ることにより、従来のＦｅ系合金と同等な強度を有し、
かつ従来のＣｕ系合金と導電性。As is clear from Table 2 below, by using the copper alloy with the composition of the present invention, it has strength equivalent to that of conventional Fe-based alloys,
and conductivity compared to conventional Cu-based alloys.
放熱性において同等な、高強度でかつ高熱伝導性の高力
銅合金が得られている。A high-strength, high-thermal-conductivity, high-strength copper alloy with comparable heat dissipation properties has been obtained.
［発明の効果］
以上詳述してきたように、本発明の組成の銅合金とする
ことにより、従来のＦｅ系合金と同等な強度を有し、か
つ従来のＣｕ合金と導電率、放熱性などにおいて同等な
、高強度でかつ高熱伝導性の高力銅合金が得られる。本
発明により近年の高集積化に対応した優れた高力銅合金
が得られる。[Effects of the Invention] As detailed above, the copper alloy having the composition of the present invention has strength equivalent to that of conventional Fe-based alloys, and has superior conductivity, heat dissipation, etc. to conventional Cu alloys. A high-strength copper alloy with high strength and high thermal conductivity equivalent to the above can be obtained. The present invention provides an excellent high-strength copper alloy that is compatible with the recent trend toward higher integration.
さらに、ニッケルが高価であるためＦｅ−４２Ｎｌ系合
金自体も高価であったことなども考慮すると、本発明の
組成のＣｕ合金とすることにより、高価なＮｉの使用量
を大幅に低減でき、安価に製造することが可能となった
ため製造コストが低減した。Furthermore, considering the fact that nickel is expensive and the Fe-42Nl alloy itself is also expensive, by creating a Cu alloy with the composition of the present invention, the amount of expensive Ni used can be significantly reduced, making it inexpensive. The manufacturing cost has been reduced as it has become possible to manufacture the
Claims (1)
０１ｗｔ％以上，２ｗｔ％以下；Ｍｇ：０．０１ｗｔ％
以上，１ｗｔ％以下，Ｎｉ：０．１ｗｔ％以上，３ｗｔ
％以下；残部実質的にＣｕからなることを特徴とする高
力銅合金。Si: 0.01 wt% or more, 1 wt% or less; Ti: 0.
01wt% or more, 2wt% or less; Mg: 0.01wt%
or more, 1wt% or less, Ni: 0.1wt% or more, 3wt
% or less: A high-strength copper alloy characterized in that the remainder essentially consists of Cu.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26387489A JPH03126830A (en) | 1989-10-12 | 1989-10-12 | High strength copper alloy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26387489A JPH03126830A (en) | 1989-10-12 | 1989-10-12 | High strength copper alloy |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03126830A true JPH03126830A (en) | 1991-05-30 |
Family
ID=17395442
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26387489A Pending JPH03126830A (en) | 1989-10-12 | 1989-10-12 | High strength copper alloy |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03126830A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5668814B1 (en) * | 2013-08-12 | 2015-02-12 | 三菱マテリアル株式会社 | Copper alloy for electronic and electrical equipment, copper alloy sheet for electronic and electrical equipment, parts for electronic and electrical equipment, terminals and bus bars |
-
1989
- 1989-10-12 JP JP26387489A patent/JPH03126830A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5668814B1 (en) * | 2013-08-12 | 2015-02-12 | 三菱マテリアル株式会社 | Copper alloy for electronic and electrical equipment, copper alloy sheet for electronic and electrical equipment, parts for electronic and electrical equipment, terminals and bus bars |
| JP2015036433A (en) * | 2013-08-12 | 2015-02-23 | 三菱マテリアル株式会社 | Copper alloy for electronic/electric apparatus, copper alloy sheet for electronic/electric apparatus, component for electronic/electric apparatus, terminal and bus bar |
| US10392680B2 (en) | 2013-08-12 | 2019-08-27 | Mitsubishi Materials Corporation | Copper alloy for electric and electronic devices, copper alloy sheet for electric and electronic devices, component for electric and electronic devices, terminal, and bus bar |
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