JPH03126055U - - Google Patents
Info
- Publication number
- JPH03126055U JPH03126055U JP3435290U JP3435290U JPH03126055U JP H03126055 U JPH03126055 U JP H03126055U JP 3435290 U JP3435290 U JP 3435290U JP 3435290 U JP3435290 U JP 3435290U JP H03126055 U JPH03126055 U JP H03126055U
- Authority
- JP
- Japan
- Prior art keywords
- power module
- power
- phenolic resin
- epoxy resin
- overcoated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 239000005011 phenolic resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims 2
- 229920001568 phenolic resin Polymers 0.000 claims 2
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3435290U JPH03126055U (bg) | 1990-03-30 | 1990-03-30 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3435290U JPH03126055U (bg) | 1990-03-30 | 1990-03-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03126055U true JPH03126055U (bg) | 1991-12-19 |
Family
ID=31538749
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3435290U Pending JPH03126055U (bg) | 1990-03-30 | 1990-03-30 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03126055U (bg) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011086896A1 (ja) * | 2010-01-15 | 2011-07-21 | 三菱電機株式会社 | 電力用半導体モジュール |
JP2012043875A (ja) * | 2010-08-17 | 2012-03-01 | Mitsubishi Electric Corp | 電力用半導体装置 |
WO2013008424A1 (ja) * | 2011-07-11 | 2013-01-17 | 三菱電機株式会社 | 電力用半導体モジュール |
-
1990
- 1990-03-30 JP JP3435290U patent/JPH03126055U/ja active Pending
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2011086896A1 (ja) * | 2010-01-15 | 2013-05-16 | 三菱電機株式会社 | 電力用半導体モジュール |
CN102687270A (zh) * | 2010-01-15 | 2012-09-19 | 三菱电机株式会社 | 电力用半导体模块 |
EP2525404A1 (en) * | 2010-01-15 | 2012-11-21 | Mitsubishi Electric Corporation | Power semiconductor module |
JP5147996B2 (ja) * | 2010-01-15 | 2013-02-20 | 三菱電機株式会社 | 電力用半導体モジュール |
WO2011086896A1 (ja) * | 2010-01-15 | 2011-07-21 | 三菱電機株式会社 | 電力用半導体モジュール |
EP2525404A4 (en) * | 2010-01-15 | 2014-01-01 | Mitsubishi Electric Corp | SEMICONDUCTOR POWER MODULE |
CN109166833A (zh) * | 2010-01-15 | 2019-01-08 | 三菱电机株式会社 | 电力用半导体模块 |
JP2012043875A (ja) * | 2010-08-17 | 2012-03-01 | Mitsubishi Electric Corp | 電力用半導体装置 |
WO2013008424A1 (ja) * | 2011-07-11 | 2013-01-17 | 三菱電機株式会社 | 電力用半導体モジュール |
CN103650137A (zh) * | 2011-07-11 | 2014-03-19 | 三菱电机株式会社 | 功率半导体模块 |
JPWO2013008424A1 (ja) * | 2011-07-11 | 2015-02-23 | 三菱電機株式会社 | 電力用半導体モジュール |
EP2733743A4 (en) * | 2011-07-11 | 2015-03-18 | Mitsubishi Electric Corp | POWER SEMICONDUCTOR MODULE |
JP2016167635A (ja) * | 2011-07-11 | 2016-09-15 | 三菱電機株式会社 | 電力用半導体モジュール |
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