JPH03125213U - - Google Patents
Info
- Publication number
- JPH03125213U JPH03125213U JP3528490U JP3528490U JPH03125213U JP H03125213 U JPH03125213 U JP H03125213U JP 3528490 U JP3528490 U JP 3528490U JP 3528490 U JP3528490 U JP 3528490U JP H03125213 U JPH03125213 U JP H03125213U
- Authority
- JP
- Japan
- Prior art keywords
- housing
- side wall
- instrument
- slits
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Landscapes
- Details Of Measuring And Other Instruments (AREA)
Description
図面は本考案の一実施例を示すもので、第１図
は第１実施例の部分斜視図、第２図はその断面図
、第３図は第２実施例の斜視図、第４図はその断
面図、第５図は第３実施例の斜視図、第６図はそ
の断面図、第７図は従来構造の断面図、第８図は
その分解斜視図、第７図はその部分断面図である
。
１……ハウジング、１ｂ……側壁、８……プリ
ント基板、１１……放熱スリツト、１４……切欠
片。
The drawings show one embodiment of the present invention; FIG. 1 is a partial perspective view of the first embodiment, FIG. 2 is a sectional view thereof, FIG. 3 is a perspective view of the second embodiment, and FIG. 4 is a partial perspective view of the first embodiment. 5 is a perspective view of the third embodiment, FIG. 6 is a sectional view thereof, FIG. 7 is a sectional view of the conventional structure, FIG. 8 is an exploded perspective view thereof, and FIG. 7 is a partial sectional view thereof. It is a diagram. DESCRIPTION OF SYMBOLS 1... Housing, 1b... Side wall, 8... Printed circuit board, 11... Heat radiation slit, 14... Notch piece.
補正 平２．６．３０
図面の簡単な説明を次のように補正する。
明細書第７頁第７行目の「第７図」を「第９図
」と訂正する。Amendment 2.6.30 Hei 2. The brief description of the drawing is amended as follows. "Figure 7" on page 7, line 7 of the specification is corrected to "Figure 9."
Claims (1)
ジングにプリント基板を配設し、該ハウジングの
側壁に複数の放熱スリツトを形成した計器装置に
おいて、上記ハウジングに上記プリント基板側が
開口する複数の放熱スリツトを形成し、かつ該ハ
ウジングの側壁に該複数の放熱スリツト間に形成
された各切欠片の側面とハウジングの側壁側面と
を結合する連結部を一体形成して構成したことを
特徴とする計器放熱装置。 In an instrument device in which an instrument body is disposed in a housing, a printed circuit board is disposed in the housing, and a plurality of heat dissipation slits are formed in a side wall of the housing, a plurality of heat dissipation slits are formed in the housing and the printed circuit board side is open. An instrument heat radiating device characterized in that the side wall of the housing is integrally formed with a connecting portion that connects the side surface of each cutout piece formed between the plurality of heat radiating slits and the side wall side of the housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3528490U JPH03125213U (en) | 1990-03-31 | 1990-03-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3528490U JPH03125213U (en) | 1990-03-31 | 1990-03-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03125213U true JPH03125213U (en) | 1991-12-18 |
Family
ID=31540501
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3528490U Pending JPH03125213U (en) | 1990-03-31 | 1990-03-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03125213U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011069631A (en) * | 2009-09-24 | 2011-04-07 | Yazaki Corp | Instrument device |
-
1990
- 1990-03-31 JP JP3528490U patent/JPH03125213U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011069631A (en) * | 2009-09-24 | 2011-04-07 | Yazaki Corp | Instrument device |