JPH03123060A - Resin sealed type semiconductor device - Google Patents

Abstract

PURPOSE:To surely hold the record of a product by a method wherein figures and symbols which indicate management data are written on the rear of an island. CONSTITUTION:A semiconductor pellet 2 is bonded to an island 1, and the electrode pads of the pellet 2 are connected to external terminals 3 through wires 4. Figures and symbols which indicate management data such as a company name (XYZ), a country name, a lot symbol (ABCDE) 5-1, a serial number (12345) 5-2, and the like are printed on the rear of the island 1, and these figures and symbols are sealed up with sealing resin 6.

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to a resin-sealed semiconductor device.

[Conventional technology]

Conventionally, in resin-encapsulated semiconductor devices, symbols and numbers indicating management information such as company name, product name, lot code, and serial number have been stamped on the surface of the encapsulating resin.

[Problem to be solved by the invention]

In the conventional resin-encapsulated semiconductor devices mentioned above, symbols and numbers such as the product name are stamped on the surface of the encapsulating resin, so if the stamps disappear, the manufacturing history becomes unknown, which is inconvenient for management and use. There is a drawback.

[Means to solve the problem]

In the resin-sealed semiconductor device of the present invention, symbols and numbers indicating management information are written on the back side of the island on which the semiconductor pellet is mounted.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIG. 1 is a partially exploded perspective view of an embodiment of the present invention.

A semiconductor pellet 2 is bonded to the island 1,
The electrode pad and the external terminal 3 are connected by a wire 4. On the back of Island 1, the company name (XYZ), country name, lot code (ABCDE) 5-1, and serial number (
Numbers and symbols indicating management information such as 12345) 52 are stamped, and these are sealed with sealing resin 6.

The marking material may be any material as long as it can withstand the temperature rise during resin sealing, but if you use a material that contains metal powder, such as lead, that does not transmit or is difficult for X-rays to pass through, the resin sealing Afterwards, the seal can be seen using an X-ray transmission device without opening the resin seal, which is even more convenient.

There is no problem in using a laser instead of a seal.

In this case, since the marking is performed directly on the island using a laser, there is an advantage that the marking does not disappear even when the temperature rises during resin sealing.

〔Effect of the invention〕

As explained above, the present invention has numbers or symbols indicating management information written on the back side of the island, so even if the stamp on the sealing resin disappears, the history of the product can be reliably tracked. This has the effect of being convenient for management, failure analysis, etc.

FIG. 1 is a partially exploded perspective view of an embodiment of the present invention.

1...Island, 2...Semiconductor pellets 1~. 3.
...External terminal, 4...Wire, 5-1...Four 1
~ Symbol, 5-2... Serial number, 6... Sealing resin.

Claims (1)

[Claims] A resin-sealed semiconductor device characterized in that symbols and numbers indicating management information are written on the back side of an island on which semiconductor pellets are mounted.