JPH0358451A - Pin grid array type package - Google Patents

Abstract

PURPOSE:To contrive an increase in the efficiency of an outer lead terminal inserting work at the time of manufacture of a package and a reduction in the manufacturing cost outer lead terminals by a method wherein the length of a part, with which the peripheral edge part of a package substrate is covered, of a cap is made longer than the thickness of the package substrate and a package stopper is formed. CONSTITUTION:A part, with which the peripheral edge part of a package substrate 3 is covered, of a cap 1 is formed longer than the plate thickness of the package 3 and holds simultaneously the role of a package stopper at the time of installation of a package in a socket. Accordingly, the need of outer lead terminals with a package stopper is eliminated and only one kind of outer lead terminals 2 without a package stopper is used for outer lead terminals. Thereby, an increase in the efficiency of an outer lead terminal inserting work at the time of manufacture of the package and a reduction in the manufacturing cost of the outer lead terminals are contrived.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a pin grid array type package, and particularly to a resin-sealed pin grid array type package. [Prior Art] Conventionally, this type of pin grid array type package (hereinafter referred to as package) has a package stopper constructed by arranging external terminals 12 provided with stoppers at the four corners, as shown in FIG. Precept, cap 11 package board 3
The length of the portion covering the peripheral portion of the package substrate 3 was formed to be shorter than the thickness of the package substrate 3.

[Problem to be solved by the invention]

In the conventional package described above, a package stopper was formed by arranging external lead terminals l2 with stoppers at the four corners of the package, so the external lead terminals were divided into external lead terminals 2 without stoppers and external lead terminals with stoppers. There are two types of 12, and in the manufacturing of packages,
A drawback is that external lead terminals must be selectively inserted into the package substrate.

Furthermore, an external lead terminal with a stopper has a disadvantage in that it is more expensive than an external lead terminal without a stopper.

An object of the present invention is to provide a package that can be inserted into a board without selecting external lead terminals and can use inexpensive lead terminals.

[Force means to solve problems]

The present invention relates to a package substrate, a pellet mounted on the package substrate, and an electrode pad of the pellet connected to a bonding wire and a wiring layer formed on the package substrate, and passing through the package substrate to the outside. In a pin grid array type package, the package includes an external lead led out to the pellet, a resin that covers the pellet, and a cap that is bonded to the resin and covers the mounting surface and peripheral edge of the pellet of the substrate of the package. A package stopper is formed by making the length of the portion covering the peripheral portion longer than the thickness of the package substrate.

[Example] Next, an example of the present invention will be described with reference to the drawings.

FIG. 1 is a sectional view of an embodiment of the present invention.

As shown in FIG. 1, the portion of the cap 1 that covers the peripheral edge of the package substrate 3 is formed to be longer than the thickness of the package substrate 3. It also serves as the role of

Therefore, the external lead terminal 12 with the package stopper shown in FIG. 2 is no longer necessary, and the external lead terminal is
Only one type of external lead terminal 2 without a package stopper is required, making it possible to improve the efficiency of the external lead terminal insertion work during package manufacturing and to reduce the manufacturing cost of external lead terminals.

〔Effect of the invention〕

As explained above, in the present invention, by forming the package I header with a cap that is longer than the thickness of the package substrate, two types of external lead terminals can be reduced to one type without a stopper. The external lead terminals can be randomly inserted into the package substrate during manufacturing, and the manufacturing cost of the external lead terminals can be reduced.

[Brief explanation of drawings]

Claims (1)

[Claims] A package substrate, a pellet mounted on the package substrate, and an external device connected to the electrode pad of the pellet via a bonding wire and a wiring layer formed on the package substrate and led out through the package substrate. In a pin grid array type package, the package includes a lead, a resin that covers the pellet, and a cap that is bonded to the resin and covers the pellet mounting surface and the periphery of the substrate of the package, the periphery of the cap being covered. 1. A pin grid array type package, characterized in that a package stopper is formed by making the length of the portion longer than the thickness of the package substrate.