JP2806571B2 - Resin-sealed semiconductor device - Google Patents
Resin-sealed semiconductor deviceInfo
- Publication number
- JP2806571B2 JP2806571B2 JP1260476A JP26047689A JP2806571B2 JP 2806571 B2 JP2806571 B2 JP 2806571B2 JP 1260476 A JP1260476 A JP 1260476A JP 26047689 A JP26047689 A JP 26047689A JP 2806571 B2 JP2806571 B2 JP 2806571B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- semiconductor device
- island
- sealed semiconductor
- stamped
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、樹脂封止型半導体装置に関する。Description: TECHNICAL FIELD The present invention relates to a resin-sealed semiconductor device.
従来、樹脂封止型半導体装置においては、会社名、品
名、ロット記号やシリアル番号などの管理情報を示す記
号や数字は封止樹脂の表面に捺印されていた。Conventionally, in resin-encapsulated semiconductor devices, symbols and numerals indicating management information such as company names, product names, lot symbols, and serial numbers have been stamped on the surface of the encapsulating resin.
上述した従来の樹脂封止型半導体装置においては品名
等の記号や数字が封止樹脂表面に捺印されている為に、
捺印が消えた場合に、製造履歴がわからなくなり、管理
や使用上不便であるという欠点がある。In the above-mentioned conventional resin-encapsulated semiconductor device, symbols and numbers such as product names are stamped on the sealing resin surface,
When the seal disappears, there is a disadvantage that the production history is not known, which is inconvenient in management and use.
本発明の樹脂封止型半導体装置は、半導体ペレットを
搭載するアイランドの裏面に管理情報を示す記号又は数
字が金属粉或いはレーザにより捺印され、前記アイラン
ドを含む半導体ペレットが封止樹脂により封止されたこ
とを特徴とする。In the resin-encapsulated semiconductor device of the present invention, a symbol or a number indicating management information is stamped on the back surface of the island on which the semiconductor pellet is mounted with metal powder or a laser, and the semiconductor pellet including the island is sealed with a sealing resin. It is characterized by having.
次に、本発明について、図面を参照して説明する。 Next, the present invention will be described with reference to the drawings.
第１図は本発明の一実施例の部分破砕斜視図である。 FIG. 1 is a partially broken perspective view of one embodiment of the present invention.
アイランド１には半導体ペレット２が接着されてお
り、その電極パッドと外部端子３はワイヤー４にて接続
されている。アイランド１の裏面には、社名（XYZ）、
国名、ロット記号（ABCDE）５−１、シリアル番号（123
45）５−２などの管理情報を示す数字や記号が捺印され
ており、これらは封止樹脂６にて封止されている。捺印
材料は樹脂封止時の温度上昇に耐えるものなら何でもよ
いが、鉛等に代表される様なＸ線が透過しないか又は透
過しずらい金属粉を含んだものを使用すると、樹脂封止
後、Ｘ線透過装置にて樹脂を開封することなく捺印を見
ることができ一層工合がよい。A semiconductor pellet 2 is adhered to the island 1, and its electrode pads and external terminals 3 are connected by wires 4. On the back of Island 1, the company name (XYZ),
Country name, lot code (ABCDE) 5-1 and serial number (123
45) Numbers and symbols indicating management information such as 5-2 are stamped, and these are sealed with the sealing resin 6. Any material can be used as long as it can withstand the temperature rise during resin encapsulation. However, if a material containing metal powder such as lead that does not transmit or hardly transmit X-rays is used, resin encapsulation can be achieved. Thereafter, the seal can be viewed without opening the resin with an X-ray transmission device, which is more convenient.
捺印の代りにレーザにて捺印を行なっても差支えな
い。この場合、アイランドへ直接、レーザにて刻印を行
うため樹脂封止時の温度上昇に対し、捺印が消えること
がないといった利点が有る。Laser marking may be used instead of marking. In this case, since the engraving is performed directly on the island with a laser, there is an advantage that the imprint does not disappear even if the temperature rises during resin sealing.
以上説明したように本発明は、アイランドの裏面に管
理情報を示す数字又は記号が記載されているので、封止
樹脂上に捺印されたものが消えた場合においても、その
製品の履歴を確実に把握することができ、管理や不良解
析などを行なう上で便利であるという効果がある。As described above, in the present invention, since the numbers or symbols indicating the management information are described on the back surface of the island, even if the seal stamped on the sealing resin disappears, the history of the product is surely confirmed. This has the effect of being able to ascertain and being convenient for performing management and failure analysis.
第１図は本発明の一実施例の部分破砕斜視図である。 １……アイランド、２……半導体ペレット、３……外部
端子、４……ワイヤー、５−１……ロット記号、５−２
……シリアル番号、６……封止樹脂。FIG. 1 is a partially broken perspective view of one embodiment of the present invention. DESCRIPTION OF SYMBOLS 1 ... Island, 2 ... Semiconductor pellet, 3 ... External terminal, 4 ... Wire, 5-1 ... Lot code, 5-2
…… Serial number, 6 …… Sealing resin.
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.6，ＤＢ名) H01L 23/28 - 23/30──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int. Cl. 6 , DB name) H01L 23/28-23/30
Claims (1)
面に管理情報を示す記号又は数字が金属粉或いはレーザ
により捺印され、前記アイランドを含む半導体ペレット
が封止樹脂により封止されたことを特徴とする樹脂半導
体装置。1. A symbol or a number indicating management information is stamped on a back surface of an island on which a semiconductor pellet is mounted with metal powder or a laser, and the semiconductor pellet including the island is sealed with a sealing resin. Resin semiconductor device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1260476A JP2806571B2 (en) | 1989-10-04 | 1989-10-04 | Resin-sealed semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1260476A JP2806571B2 (en) | 1989-10-04 | 1989-10-04 | Resin-sealed semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03123060A JPH03123060A (en) | 1991-05-24 |
| JP2806571B2 true JP2806571B2 (en) | 1998-09-30 |
Family
ID=17348483
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1260476A Expired - Fee Related JP2806571B2 (en) | 1989-10-04 | 1989-10-04 | Resin-sealed semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2806571B2 (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63285955A (en) * | 1987-05-18 | 1988-11-22 | Mitsubishi Electric Corp | Resin-sealed semiconductor device |
-
1989
- 1989-10-04 JP JP1260476A patent/JP2806571B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03123060A (en) | 1991-05-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS5936249U (en) | Flat package for at least one integrated circuit device | |
| JP2806571B2 (en) | Resin-sealed semiconductor device | |
| GB1190290A (en) | Method of Fitting Semiconductor Pellet on Metal Body | |
| EP0142447A2 (en) | Semiconductor package | |
| JP2880878B2 (en) | Vertical surface-mount resin-encapsulated semiconductor device | |
| JP2001127236A (en) | Ic package | |
| JPS6148952A (en) | Semiconductor device | |
| JPS5826176B2 (en) | Resin-encapsulated semiconductor device | |
| JPH05243456A (en) | Plastic molded type semiconductor device | |
| WO1995001651A1 (en) | Moisture barrier for plastic package with heat spreader | |
| JPS6218054Y2 (en) | ||
| JPS61241947A (en) | Semiconductor device | |
| JP3333859B2 (en) | Environment-resistant resin-encapsulated semiconductor device | |
| JPS5833856A (en) | Semiconductor device | |
| JPH0720924Y2 (en) | Semiconductor device | |
| JPS6020143A (en) | Isfet sensor | |
| JPS5588358A (en) | Resin-sealed semiconductor device | |
| JPH03169057A (en) | Semiconductor device | |
| JPH0596895A (en) | Ic module and ic card using same module | |
| TW495890B (en) | Semiconductor device and its manufacturing method | |
| JPS6011644Y2 (en) | semiconductor equipment | |
| JPS5883157U (en) | Resin-encapsulated semiconductor device | |
| JPH05190709A (en) | Multichip package | |
| JPH01286345A (en) | Resin sealed semiconductor device | |
| JPS60171734A (en) | Semiconductor device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |