JPH0311666Y2 - - Google Patents

Info

Publication number
JPH0311666Y2
JPH0311666Y2 JP7114385U JP7114385U JPH0311666Y2 JP H0311666 Y2 JPH0311666 Y2 JP H0311666Y2 JP 7114385 U JP7114385 U JP 7114385U JP 7114385 U JP7114385 U JP 7114385U JP H0311666 Y2 JPH0311666 Y2 JP H0311666Y2
Authority
JP
Japan
Prior art keywords
valve
passage
valve body
valve seat
liquid refrigerant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP7114385U
Other languages
English (en)
Japanese (ja)
Other versions
JPS61186073U (ko
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7114385U priority Critical patent/JPH0311666Y2/ja
Publication of JPS61186073U publication Critical patent/JPS61186073U/ja
Application granted granted Critical
Publication of JPH0311666Y2 publication Critical patent/JPH0311666Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Temperature-Responsive Valves (AREA)
JP7114385U 1985-05-13 1985-05-13 Expired JPH0311666Y2 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7114385U JPH0311666Y2 (ko) 1985-05-13 1985-05-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7114385U JPH0311666Y2 (ko) 1985-05-13 1985-05-13

Publications (2)

Publication Number Publication Date
JPS61186073U JPS61186073U (ko) 1986-11-20
JPH0311666Y2 true JPH0311666Y2 (ko) 1991-03-20

Family

ID=30608369

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7114385U Expired JPH0311666Y2 (ko) 1985-05-13 1985-05-13

Country Status (1)

Country Link
JP (1) JPH0311666Y2 (ko)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9390974B2 (en) 2012-12-21 2016-07-12 Qualcomm Incorporated Back-to-back stacked integrated circuit assembly and method of making
US9412644B2 (en) 2009-07-15 2016-08-09 Qualcomm Incorporated Integrated circuit assembly and method of making
US9466719B2 (en) 2009-07-15 2016-10-11 Qualcomm Incorporated Semiconductor-on-insulator with back side strain topology
US9496227B2 (en) 2009-07-15 2016-11-15 Qualcomm Incorporated Semiconductor-on-insulator with back side support layer
US9515181B2 (en) 2014-08-06 2016-12-06 Qualcomm Incorporated Semiconductor device with self-aligned back side features

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5083107B2 (ja) * 2008-08-05 2012-11-28 株式会社デンソー 膨張弁及びそれを備えた蒸気圧縮式冷凍サイクル

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9412644B2 (en) 2009-07-15 2016-08-09 Qualcomm Incorporated Integrated circuit assembly and method of making
US9466719B2 (en) 2009-07-15 2016-10-11 Qualcomm Incorporated Semiconductor-on-insulator with back side strain topology
US9496227B2 (en) 2009-07-15 2016-11-15 Qualcomm Incorporated Semiconductor-on-insulator with back side support layer
US9390974B2 (en) 2012-12-21 2016-07-12 Qualcomm Incorporated Back-to-back stacked integrated circuit assembly and method of making
US9515181B2 (en) 2014-08-06 2016-12-06 Qualcomm Incorporated Semiconductor device with self-aligned back side features

Also Published As

Publication number Publication date
JPS61186073U (ko) 1986-11-20

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