JPH0311644A - Manufacture of lead frame of tape for tab use - Google Patents

Abstract

PURPOSE:To prevent a lead and the like from being deformed at a product and during a processing treatment process by a method wherein a resist pattern is formed on a conductor material on which a fixation tape has been pasted and it is etched. CONSTITUTION:When a conductor material 10 such as a copper sheet, a copper foil or the like is etched and a conductor circuit such as an inner lead 16 or the like is formed, fixation tapes 12 which are used to prevent the conductor circuit from being deformed are pasted in advance on required parts of the conductor material 10. A prescribed pattern is formed on the conductor material 10 on which the fixation tapes 12 have been pasted; after that, it is etched and the conductor circuit is formed. Thereby, it is possible to prevent a lead and the like from being deformed during various processing treatment processes and at a product.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for manufacturing a lead frame or TAB tape.

(Prior art) Lead frames used in resin-sealed semiconductor devices are designed to prevent inner leads from deforming during handling in post-processing or resin-sealing, and to facilitate wire bonding. Some devices are provided by attaching a rectangular electrically insulating fixing tape to the inner lead. In this lead frame, after the leads and the like are formed by etching or press punching, a fixing tape is attached to the required portions of the inner leads to prevent deformation of the inner leads.

Further, in a TAB tape having a base film, a conductive material such as copper foil is adhered to the base film, and the conductive material is etched to form a conductive circuit in a predetermined pattern. In this TAB tape, the conductor circuit is supported by the base film, thereby preventing the leads etc. from being deformed.

(Problem to be solved by the invention) By the way, the lead frame or TAB tape is
As semiconductor chips and the like become more highly integrated, devices with more and more pins are required, and in order to increase the number of pins, thinner materials are used as conductor materials.

However, with the conventional method of attaching fixed tape,
After the conductor circuit is formed by etching, press punching, etc., and various processing treatments such as plating are performed, the fixing tape is finally attached, so the leads etc. A problem arises in that it is not possible to prevent the deformation that occurs.

Such deformation during the processing process is more likely to occur as the thickness of the conductor material used becomes thinner, so in order to increase the number of pins, it is necessary to eliminate the problem of deformation of the conductor material during the processing process. Must.

Note that TAB tapes with conductor circuits formed on a base film have the advantage that deformation of the conductor circuits can be prevented by holding the conductor circuits with the base film, but it is difficult to use expensive insulating films such as polyimide. Since it is widely used as a base film, it has the problem of increasing cost.

Therefore, the present invention has been made to solve the above problems, and its purpose is to prevent deformation of leads, etc. in products, and also to effectively prevent deformation of leads, etc. during processing steps. An object of the present invention is to provide a method for manufacturing a lead frame or TAB tape.

(Means for solving problems) The present invention has the following configuration to achieve the above object.

That is, in a method for manufacturing a lead frame or TAB tape in which a conductor circuit such as an inner lead is formed by etching a conductor material such as a copper plate or copper foil, the required portions of the conductor material are etched before etching the conductor material. A fixing tape is applied in advance to prevent deformation of the conductor circuit, and a predetermined resist pattern is formed on the conductor material to which the fixing tape is attached, and then etching is performed to form the conductor circuit. Features.

(Operation) A conductor circuit is formed by pasting a fixing tape on a conductor material in advance, forming a resist pattern on the conductor material to which the fixing tape is attached, and etching it. By attaching a fixing tape to the conductor material in advance and processing it, it is possible to prevent the leads from deforming during processing.

(Embodiments) Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

FIG. 1, FIG. 2, and FIG. 3 are diagrams for explaining the manufacturing method according to the present invention, and sequentially show the manufacturing process of the lead frame.

In FIG. 1(a), 10 is a conductor material on which various parts such as inner leads, outer leads, and die pads are formed. In the embodiment, a long copper strip is used as the conductor material 10.

12 is a fixing tape stuck on the conductor material 10. The fixing tape 12 is positioned and pasted in advance according to the position of the inner leads, etc. (5) formed on the conductor material 10. In the embodiment, it is attached on all sides surrounding the die pad. FIG. 1(b) is a sectional view showing a state in which the fixing tape 12 is stuck on the conductor material 10.

FIG. 2 shows a state before a resist 1 pattern is formed on the conductor material 10 to which the fixing tape 12 is attached and etching is performed. FIG. 2(a) is a plan view showing the upper surface to which the fixing tape 12 is attached. Etching resist 14 is applied to the entire upper surface of the conductor material 10, including the fixing tape 12 portion. In addition, as shown in FIG. 2(b), the bottom surface of the conductor material 10 to which the fixing tape 12 is not attached is coated with Elatin Breath 1 to 14, and conductive circuits such as inner leads, outer leads, and die pads are coated. A predetermined resist pattern is formed by exposing according to the pattern.

Next, the conductive material on which the above resist pattern has been formed is etched.

Figure 3(a) shows that a conductor circuit is formed by etching (6
) - It is in a state of being. In the figure, 16 is an inner lead and 18 is a die pad. Etching is performed while the fixing tape 12 remains attached to the conductor material 10, and after etching, it is attached onto the inner lead 12 as shown in the figure. By pasting the fixing tape 12 across the inner leads 16, the inner leads 16 are prevented from deforming.

In the above manufacturing method, since the fixing tape 12 is already attached at the time the conductor circuit is formed, even if a fairly thin conductor material 10 is used, the processing that can be carried out during or after the conductor circuit is formed. Deformation of the lead during processing can be prevented, and handling operations during the manufacturing process are also extremely easy. Furthermore, since the leads are held by the fixing tape 12 even after the processing is completed, deformation of the leads can be prevented, and misalignment of the leads can be prevented.

Note that the fixing tape 12 is of course not limited to the attachment position on the inner lead, and may be applied to any location where it is necessary to prevent deformation of the lead frame.

Moreover, since the conventional method and apparatus for attaching a fixing tape to a lead frame can be applied to the work of attaching the fixing tape 12 to the conductor material 10 using the above method, manufacturing is easy.

In the two-legged example, a resist pattern was formed on the lower surface of the conductor material 10 to which the fixing tape 12 was not attached, and the conductor material 10 was etched from one side, but in some cases, a resist pattern was formed on both sides of the conductor material 10. A pattern may be formed and etched from both sides. In this case, it is necessary to perform etching taking into consideration that the portion to which the fixing tape 12 is attached will be etched only from one side.

The above example describes a method for manufacturing a lead frame.
AB tape) can also be manufactured using the same procedure as above.

That is, after pasting a fixing tape having electrical insulating properties in the same manner as above to a predetermined location on a conductor material such as copper foil, a resist pattern is formed on the conductor material and etching is performed to form a predetermined conductor circuit. A TAB tape having the following properties is obtained. The obtained TAB tape consists of a fixing tape attached to a conductor circuit, so by attaching the fixing tape to a position where the leads are likely to deform, such as the inner lead section, the inner lead section etc. A single-layer TAB tape is obtained that can prevent deformation. Compared to TAB tapes that have a wide base film over almost the entire surface of the conductor circuit, this TAB tape has a smaller adhesion area for the fixing tape, making it possible to save on expensive films such as polyimide, thereby reducing costs. In addition, compared to conventional single-layer TAB tapes, it is possible to prevent deformation of areas where deformation is likely to occur, such as inner leads, and it is possible to suitably cope with the increase in the number of pins.

Hereinafter, the present invention has been variously explained using preferred embodiments, but the present invention is not limited to these embodiments, and can be similarly applied to various types of semiconductor devices. Of course, many modifications can be made without departing from the spirit of 9).

(Effect of the invention) As described above, the lead frame or T according to the present invention
According to the manufacturing method of AB tape, necessary parts such as inner leads are held with fixing tape at the time when the conductor circuit is formed, so the leads etc. are not deformed during the conductor circuit formation process or various subsequent processing steps. Therefore, even if the conductor material is thinner than the conventional conductor material, a conductor circuit can be suitably formed. This allows the lead frame etc. to have a larger number of pins.

In addition, the TAB tape has remarkable effects such as being able to effectively prevent deformation of the leads etc. by attaching the fixing tape to easily deformable parts such as the inner leads.

[Brief explanation of drawings]

1(a), 2(a), and 3(a) are plan views showing the manufacturing process of manufacturing a lead frame by the manufacturing method according to the present invention, and FIG. 1(b), and FIG. (b) and FIG. 3(10) (b) are respectively corresponding cross-sectional views. 10... Conductor material, 12... Fixing tape, 14...
・Eratin breath 1~, 16...inner lead,
18...Die pad.

Claims (1)

[Claims] 1. In a method for manufacturing a lead frame or TAB tape in which a conductor circuit such as an inner lead is formed by etching a conductor material such as a copper plate or copper foil, the conductor is etched at the required locations on the conductor material before etching the conductor material. A fixing tape is attached in advance to prevent deformation of the circuit, and a predetermined resist pattern is formed on the conductor material to which the fixing tape is attached, and then etched to form a conductor circuit. A method for manufacturing a lead frame or TAB tape.