JPH056925A - Tab tape for manufacture of semiconductor device - Google Patents

Abstract

PURPOSE:To perform a coating operation by using a low-viscosity resin by a method wherein, when a semiconductor chip is mounted on a TAB tape and the surface of the chip is coated with a resin for protective use, a gap between a device hole and the peripheral edge of the semiconductor chip is narrowed. CONSTITUTION:The title tape is provided with the following structure: overhang faces 4 which are formed of a base tape material (or the same copper foil material as that of a lead pattern) are formed in corner parts inside a device hole as a square opening part formed in a base tape 6; and a gap between a semiconductor chip 3 and the device hole 1 is narrowed in order to prevent a resin from being dripped when an epoxy resin 8 used to protect the surface of the semiconductor chip 3 bonded to inner leads 2 is coated.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a TAB for manufacturing semiconductor devices.
The present invention relates to a tape, and particularly to the shape of a device hole formed in a TAB tape.

[0002]

2. Description of the Related Art Conventional TAB (Tape Automa)
The tape used for the ted bonding) is a resin tape to be the base tape 6 as shown in the plan view of FIG.
A rectangular or square opening slightly larger than the semiconductor chip 3 to be mounted is punched out to form a device hole 1, a copper foil is attached to this resin tape, and the copper foil is etched to form a lead pattern for manufacture. (See JP-A-58-15252). The inner leads 2 of the lead pattern project in a finger shape toward the device hole 1, and the tips of the inner leads 2 are connected to bumps on the semiconductor chip 3 arranged in the device hole 1 by bonding.

Generally, the device hole 1 of this type of TAB tape has a size with a gap of 0.5 to 1.5 mm when the semiconductor chip 3 is placed therein.
When a semiconductor device is manufactured using this TAB tape, usually, in order to ensure reliability, a resin such as an epoxy resin is applied to the protruding portion of the semiconductor chip 3 and the inner lead 2 to the device hole 1 after the bonding step. To protect the surfaces of these chips 3 and leads 2 (NIKKEI ELECTRONICS 199).
0.8.6, No. 506, P113). And
After forming the protective film, the TAB tape is wound on a reel, and the reel is set in an outer lead bonding device.
Then, the outer leads 7 are bonded to a package or the like to assemble the semiconductor device.

[0004]

In such a TAB tape, when the resin coating is formed, the gap between the device hole and the semiconductor chip is particularly large at the corner portion. It is difficult to uniformly form the resin film by drooping downward from the gap. This is a particularly serious problem when a resin having a low viscosity is used as the coating material.

An object of the present invention is to ensure the uniformity of the above resin film even when the viscosity of the resin of the coating material is low.
To provide an AB tape.

[0006]

According to the TAB tape of the present invention, a projecting portion is provided by a base tape material or a copper foil material laminated on the base tape material at a corner portion of a device hole which is slightly larger than a semiconductor chip to be mounted. The corners are formed so as to form a projecting surface projecting inside the device hole. According to the present invention, since the projecting surface of each corner of the device hole overlaps with the corner of the mounted semiconductor chip to narrow the gap, the problem of dripping of the coating material in the resin coating step can be solved.

[0007]

EXAMPLE Referring to FIGS. 1A and 1B, a TAB tape of this example has a base tape 6 made of a polyimide resin at each of four corners of a device hole 1.
Is provided with the overhanging surface 4. These overhanging surfaces 4
Are provided at the same time when the base tape 6 is punched out to form the device hole 1. After that, a copper foil is attached to the base tape 6, and the copper foil is etched to form a plurality of finger-shaped inner leads 2 that respectively project toward the inside of the device hole 1. Next, as shown in FIG. 1B, gold bumps (not shown) formed on the semiconductor chip 3 (shown by a chain line in FIG. 1A) and the tips of the inner leads 2 are bonded. Next, the protruding portion of the inner lead 2 into the device hole 1 and the surface of the chip 1 are coated with an epoxy resin 8. Next, the outer lead 7 is cut at the outer peripheral aperture 9 portion, and the semiconductor chip 3 which has been subjected to inner lead bonding is separated from the tape 6.
Further, the outer leads are bonded to a substrate to form a package.

In the second embodiment of the present invention shown in FIG. 2, at each of the four corners of the device hole 1,
An overhang surface 5 made of a copper foil material on the base tape 6 is provided. The projecting surface 5 is formed at the same time when the inner lead 2 is formed by etching. Except for this point, the other steps are the same as those in the first embodiment, so the steps will not be described further. According to the present embodiment, since the projecting surface 5 projects to the position where it overlaps with the corner of the semiconductor chip 3, the gap between the corners is closed and the coating material is prevented from dripping at the corner. Further, according to the present embodiment, since the projecting surface 5 is formed by etching, it becomes easy to select the size of the projecting surface,
This has the advantage of being able to flexibly deal with mounting semiconductor chips of various sizes in the device holes of the same size.

[0009]

According to the tape automatic bonding (TAB) tape of the present invention, instead of making the corners of each rectangular opening into a simple right angle as in the prior art, each of the corners goes inside the opening. It forms an overhanging portion that extends toward. The overhanging portion can be formed at the same time when the opening is formed in the base tape, or can be formed at the same time as the selective etching of the metal foil closely attached to the base tape by the etching process. According to the present invention, since the gap between the corner of the opening and the corner of the semiconductor chip arranged in the opening can be narrowed by the protrusion, the semiconductor chip is bonded to the semiconductor chip. It is possible to prevent the resin from dripping from the corner portions when the inner leads are coated with the resin.

[Brief description of drawings]

FIG. 1 is a diagram showing a first embodiment of the present invention, in which FIG.
Is a partial plan view, and FIG. 6B is a sectional view taken along line AA.

FIG. 2 is a partial plan view of the second embodiment of the present invention.

FIG. 3 is a partial plan view of a conventional TAB tape.

[Explanation of symbols]

1 device hole 2 inner lead 3 semiconductor chips 4 Overhanging surface 5 Overhanging surface 6 base tape 7 Outer leads 8 Epoxy resin 9 Peripheral aperture

Claims (3)

[Claims] 1. A base tape having rectangular openings, which are made of a thin band-shaped insulating material and have a size larger than that of a rectangular semiconductor chip to be mounted, at regular intervals; and the opening provided in close contact with the surface of the base tape. A metal foil having a plurality of inner leads projecting toward the inner side of each of the inner parts of the rectangular semiconductor chip, and the inner edge of the rectangular semiconductor chip being kept at a uniform distance from the opening. In a TAB tape for manufacturing a semiconductor device, which is electrically connected to the vicinity of the tip of a lead and mechanically fixed, a part of at least one of the base tape and the metal foil is provided at each of four corners of the opening. And a TA for manufacturing a semiconductor device, which has an overhanging portion extending inside the opening so as to narrow the gap between the corner of the semiconductor chip and B tape. 2. The TAB tape for manufacturing a semiconductor device according to claim 1, wherein the projecting portion is formed on the base tape material at the same time as the opening portion. 3. The TAB tape for manufacturing a semiconductor device according to claim 1, wherein the projecting portion is formed of the copper foil material.