JPH03110152A - Production of laminated sheet - Google Patents
Production of laminated sheetInfo
- Publication number
- JPH03110152A JPH03110152A JP1250115A JP25011589A JPH03110152A JP H03110152 A JPH03110152 A JP H03110152A JP 1250115 A JP1250115 A JP 1250115A JP 25011589 A JP25011589 A JP 25011589A JP H03110152 A JPH03110152 A JP H03110152A
- Authority
- JP
- Japan
- Prior art keywords
- laminate
- prepreg
- prepregs
- base material
- continuously
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 239000000463 material Substances 0.000 claims abstract description 25
- 239000004744 fabric Substances 0.000 claims abstract description 16
- 239000011521 glass Substances 0.000 claims abstract description 10
- 229910052751 metal Inorganic materials 0.000 abstract description 13
- 239000002184 metal Substances 0.000 abstract description 13
- 238000010438 heat treatment Methods 0.000 abstract description 12
- 238000000465 moulding Methods 0.000 abstract description 11
- 239000011888 foil Substances 0.000 abstract description 10
- 238000000034 method Methods 0.000 abstract description 6
- 238000010030 laminating Methods 0.000 abstract 2
- 229920005989 resin Polymers 0.000 description 27
- 239000011347 resin Substances 0.000 description 27
- 238000011437 continuous method Methods 0.000 description 9
- 239000003822 epoxy resin Substances 0.000 description 8
- 229920000647 polyepoxide Polymers 0.000 description 8
- 239000002966 varnish Substances 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 238000001035 drying Methods 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 4
- 229920001187 thermosetting polymer Polymers 0.000 description 4
- 238000003475 lamination Methods 0.000 description 3
- 238000005253 cladding Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000008280 blood Substances 0.000 description 1
- 210000004369 blood Anatomy 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000001934 delay Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Laminated Bodies (AREA)
Abstract
Description
本発明は、プリント配線板として用いられる積層板の連
続工法による製造方法に関するものである。The present invention relates to a method for manufacturing a laminated board used as a printed wiring board by a continuous method.
積層板は通常、紙やガラス布などを基材としてこれに熱
硬化性Ut脂を含浸乾燥することによってプリプレグを
調製すると共に、このプリプレグを所定の定寸法に切断
し、この定寸法に切断した複数枚のプリプレグ及び必要
に応じて銅箔などの金属箔を重ね、これをプレス装置に
プレートを介して10〜14組重ねてセットし、上下の
熱盤によって所定時間加熱加圧する多段積層成形をおこ
なうことによって、製造がおこなわれている。しかし、
このように多段積層成形で積層板を製造する場合は、パ
ッチ作業となるために作業能率が悪く、生産性に多大の
問題を有する。
このために、本出願人によって積層板を連続工法で製造
する方法が特開昭60−189439号公報等によって
提供されている。すなわち、複数枚の長尺のプリプレグ
を重ねて連続的に送りつつ、必要に応じてさらに長尺の
金属箔を重ね、そしてこれをダブルベルトに連続的に通
してダブルベルトによって加熱加圧することによって、
積層板を連続して成形することができるようにしたもの
である。この方法によれば、連続した成形作業で積層板
を製造できるために生産能率がパッチ作業の多段積層成
形よりも飛躍的に向上する。Laminated boards are usually prepared by preparing prepreg by using paper or glass cloth as a base material, impregnating it with thermosetting Ut resin and drying it, and cutting this prepreg into a predetermined size. Multiple sheets of prepreg and metal foil such as copper foil are stacked as necessary, and 10 to 14 sets of these are stacked and set in a press machine via plates, and multi-stage lamination molding is performed by heating and pressing for a predetermined period of time using upper and lower heating plates. Manufacturing is done by doing things. but,
When a laminate is manufactured by multi-stage lamination molding in this manner, the work efficiency is poor due to patch work, and there are many problems in productivity. For this purpose, the present applicant has proposed a method of manufacturing a laminate using a continuous method, such as in Japanese Patent Laid-Open No. 189439/1983. In other words, multiple sheets of long prepreg are piled up and continuously fed, and if necessary, a long metal foil is piled up, and this is continuously passed through a double belt and heated and pressurized by the double belt. ,
This allows the laminated plates to be formed continuously. According to this method, since the laminate can be manufactured by continuous molding operations, the production efficiency is dramatically improved compared to multi-stage lamination molding using patch operations.
一方、電子工業や通信、コンピュータなどの分野におい
て使用される周波数は高周波の領域にシフトされており
、このような高周波領域で用いられるプリント配線板の
積層板においては、信号の伝播遅延を短くするうえで誘
電率がより小さいことが要求されている。このためにこ
のような高周波特性が優れた積層板を得るために、積層
板を構成する樹脂、すなわちプリプレグの樹脂として周
波数特性に優れた例えば特許出願公表昭61−5004
34号のような芳香族ポリイソシアネートなどを用いる
ことがなされているが、高周波特性に優れた樹脂は一般
に高温(場合によっては250〜300℃)で長時間(
場合によっては1〜2時FIR)成形をおこなう必要が
ある。
しかし、プリプレグを連続的にダブルベルトに通して加
熱加圧成形する場合には、高温で長時間成形を持続させ
ることができないために、このような高周波特性が優れ
た樹脂を用いて調製したプリプレグを使用して上記のよ
うなダブルベルトによる連続工法で積層板を製造するこ
とはできないものであり、高周波特性に優れた積層板を
連続工法で製造することは困難であるというのが現状で
ある。
本発明は上記の点に鑑みて為されたものであり、高周波
特性に優れた積層板を連続工法で製造することができる
積層板の製造方法を提供することを目的とするものであ
る。On the other hand, the frequencies used in fields such as the electronics industry, communications, and computers are being shifted to high-frequency regions, and printed wiring board laminates used in such high-frequency regions are designed to shorten signal propagation delays. Moreover, a smaller dielectric constant is required. For this reason, in order to obtain such a laminate with excellent high frequency characteristics, a resin constituting the laminate, that is, a prepreg resin, which has excellent frequency characteristics, such as a patent application published in 1988-5004, has been developed.
Aromatic polyisocyanates such as No. 34 have been used, but resins with excellent high frequency properties are generally used at high temperatures (250 to 300°C in some cases) for long periods of time (
In some cases, it may be necessary to perform FIR molding at 1 to 2 o'clock. However, when the prepreg is continuously passed through a double belt and molded under heat and pressure, it is impossible to sustain the molding for a long time at high temperatures. It is not possible to manufacture laminates using the above-mentioned continuous method using double belts, and the current situation is that it is difficult to manufacture laminates with excellent high frequency characteristics using the continuous method. . The present invention has been made in view of the above points, and it is an object of the present invention to provide a method for manufacturing a laminate that can manufacture a laminate with excellent high frequency characteristics by a continuous method.
本発明に係る積層板の製造方法は、フッ素樹脂多孔質シ
ートを基材として調製した長尺のプリプレグ1aと、ガ
ラス布を基材としてlIIglシた長尺のプリプレグ1
bとを連続的に送りつつ所要枚数のこのプリプレグ1
at 1 bを重ね合わせ、これをダブルベルト2に連
続して送り込んで積層成形することを特徴とするもので
ある。
以下本発明の詳細な説明する。
プリプレグ18t 1 bは基材に樹脂のワニスを含浸
させて乾燥することによって、長尺のものとして調製さ
れる。本発明においてはこの基材としてフッ素樹脂(ポ
リテトラプルオロエチレン)の多孔質シートを用いてプ
リプレグ1aを調製すると共に、基材としてガラス布を
用いてプリプレグ1bを調製し、この二種のプリプレグ
1 a、 1 bを組み合わせて用いるものである。フ
ッ素樹脂多孔質シートは77素樹脂のシートに平均粒径
が1μ以下程度の小孔を多数設けて多孔質に形成したも
のであり、例えば日東電工株式会社から市販されている
ものを用いることができる。このシートはこのように小
孔を設けた多孔質であるために、紙やガラス布などと同
様に熱硬化性樹脂ワニスに浸漬させることによって熱硬
化性樹脂ワニスを良好に浸透させ、紙やガラス布を基材
として用いる場合と同様の工法で容易にプリプレグ1を
調製することができる。またガラス布としてはガラス繊
維の織布や不織布を用いることができる。そして本発明
において、7ツ素樹脂多孔質シートやプラス布に含浸さ
せる樹脂としては、特定のものに限定されず任意のもの
を用いることができるが、特にエポキシ樹脂などの熱硬
化性樹脂が好ましい。
モして11図に示すように、このプリプレグ1a、 1
bをロール状に巻いたものから巻き外して所定枚数を
〃イドロール6を経由させて連続的に送り、重ねロール
7によって各プリプレグ1 at 1 bを連続的に重
ね合わせる。このとき、フッ素樹脂多孔質シートを基材
とするプリプレグ1aとプラス布を基材とするプリプレ
グ1bとを交互に重ねるようにするのが好ましい。一方
、#l笛などの金属M10も長尺に形成してロール状に
巻いておき、これを巻き外して上記の重ね合わせたプリ
プレグ1 at i bの最外層の外面に重ね合わせる
。両面金属箔張り積層板を製造する場合には、2枚の金
属箔10を用いて重ね合わせたプリプレグ1 at 1
bの雨量外層に重ねるようにし、また片面金属箔張り
積層板を製造する場合には、一方の最外層にのみ金属箔
10を重ねるようにすると共に他方の最外層には7ツ素
樹脂フイルム等の150℃以上の温度に耐えると共に高
周波特性が優れたフィルムを重ねるようにする。ここで
、金属M10は接着剤を塗布したものや、アルミニウム
キャリヤーと極薄銅箔との組み合わせになっている箔な
ど任意のものを使用することができる。
このように複数枚のプリプレグ1 a、 1 b及び必
要に応じて金属箔10を重ねた積層物5を連続して送り
つつ、この積層物5を予備加熱してプリプレグ1 a、
1 bに含まれる樹脂を溶融状態にした後に、ドラム9
によって連続駆動される上下のエンドレスベルト3.4
を具備して構成されるダブルベルト2に積層物5を連続
して導入する。このように予備加熱をおこなうにあたっ
ては、積層物5を上下の高周波印加電極8,8開に通し
て無圧下または接触圧下で誘電加熱することによってお
こなうのが好ましい。誘電加熱すると加熱温度はプリプ
レグ1 at 1 bの表面部よりもむしろ内部で高く
なり、電熱などを用いて外部加熱をする場合のように表
面部が高く加熱されてプリプレグ1a、1bの表面部の
樹脂の硬化反応が速く進行することがな(、ダブルベル
ト2で加圧してもプリプレグ1 at i b内から気
泡が抜けきらなくなって積層板にボイドが含まれるとい
うようなことを低減することができるのである。そして
積層物5をダブルベルト2に通して上下のエンドレスベ
ルト3,4間で積層物5を加圧するにあたって、各エン
ドレスベルト3,4内には熱盤などの加圧加熱装置11
.11が配設してあって、この加圧加熱装置11によっ
て積層物5を加熱加圧できるようにしてあり、プリプレ
グ1 at 1 bの樹脂を硬化させると共に複数枚の
プリプレグ18t 1 b及び金属箔10を積層接着さ
せるものである。加圧は20 k8/ e+n2〜30
kg/ca+2程度以下の低圧でおこなわれるものであ
り、場合によっては接触圧でおこなわれることもある。
このようにして積層された積層体はダブルベルト2の駆
動に伴って連続して導出されるものであり、〃イドロー
ラ12に導いて切断機13で切断することによって、定
寸法となった金属箔張りの積層板Aを得ることができる
ものである。
上記のようにして連続工法で積N成形するにあたって、
プリプレグ1aの基材となる7ツ素樹脂多孔性シートは
、その素材であるフッ素樹脂が低い誘電率を有して高周
波特性が優れているために、高い高周波特性を有してい
るものであり、含浸させる樹脂として高周波特性が優れ
たものを使用する必要なく、エポキシ樹脂など積層板に
一般に使用されるものを用いても、高周波特性の高い積
層板Aを製造することができる。従って高い高周波数特
性を有する樹脂を用いる場合のような、高温で長時間の
成形をおこなう必要がなくなり、従来から使用されてい
る連続工法をそのまま用いて高周波特性の高い積層板A
を製造することが可能になるのである。尚、各プリプレ
グ1 at 1 bを重ね合わせてダブルベルト2に送
り込むにあたって、フッ素樹脂多孔質シートを基材とす
るプリプレグ1aとガラス布を基材とするプリプレグ1
bとを交互に重ねるようにすれば、積層板Aの基材の層
構成が均一になり、基材が偏る場合のように積層板Aが
反り変形を生じることを防ぐことができる。The method for manufacturing a laminate according to the present invention includes a long prepreg 1a prepared using a porous fluororesin sheet as a base material, and a long prepreg 1 prepared using glass cloth as a base material.
b and the required number of prepregs 1 while continuously feeding
It is characterized in that at 1 b are superimposed and continuously fed into the double belt 2 to form a laminate. The present invention will be explained in detail below. The prepreg 18t 1 b is prepared as a long prepreg by impregnating a base material with resin varnish and drying it. In the present invention, prepreg 1a is prepared using a porous sheet of fluororesin (polytetrafluoroethylene) as the base material, and prepreg 1b is prepared using glass cloth as the base material. 1a and 1b are used in combination. A porous fluororesin sheet is a sheet of 77 base resin made porous by providing a large number of small pores with an average particle size of about 1 μm or less, and for example, a sheet commercially available from Nitto Denko Corporation can be used. can. Because this sheet is porous with small pores, it can be soaked in thermosetting resin varnish in the same way as paper or glass cloth, allowing the thermosetting resin varnish to penetrate well. Prepreg 1 can be easily prepared using the same method as when cloth is used as a base material. Further, as the glass cloth, a woven cloth or a non-woven cloth of glass fiber can be used. In the present invention, the resin to be impregnated into the 7-component resin porous sheet or the plus cloth is not limited to a specific one and any resin can be used, but thermosetting resins such as epoxy resins are particularly preferred. . As shown in Figure 11, these prepregs 1a, 1
b is unwound from a roll and a predetermined number of prepregs are continuously fed through an idle roll 6, and each prepreg 1 at 1 b is continuously overlapped by a stacking roll 7. At this time, it is preferable to alternately stack prepregs 1a having a fluororesin porous sheet as a base material and prepregs 1b having a plush cloth as a base material. On the other hand, a metal M10 such as a #l whistle is also formed into a long length and wound into a roll, which is unwound and superimposed on the outer surface of the outermost layer of the above-mentioned superimposed prepregs 1 at i b. When manufacturing a double-sided metal foil-clad laminate, prepregs 1 at 1 are prepared by overlapping two metal foils 10.
When producing a single-sided metal foil-covered laminate, the metal foil 10 should be overlapped only on one outermost layer, and the other outermost layer should be covered with a 7-layer resin film, etc. The film should be layered with a film that can withstand temperatures of 150°C or more and has excellent high frequency characteristics. Here, any metal M10 can be used, such as one coated with an adhesive or a foil made of a combination of an aluminum carrier and an ultra-thin copper foil. While continuously feeding the laminate 5 in which a plurality of prepregs 1 a, 1 b and metal foil 10 are stacked as necessary, the laminate 5 is preheated to form prepregs 1 a, 1 b,
After the resin contained in 1b is melted, the drum 9
Upper and lower endless belts continuously driven by 3.4
The laminate 5 is successively introduced into a double belt 2 comprising: Preheating is preferably carried out by dielectrically heating the laminate 5 under no pressure or under contact pressure by passing the laminate 5 through the upper and lower high frequency application electrodes 8, 8. When dielectric heating is performed, the heating temperature becomes higher inside the prepregs 1 at 1 b rather than at the surface, and as in the case of external heating using electric heating, the surface is heated to a high temperature and the surface of the prepregs 1a, 1b is heated to a high temperature. This prevents the curing reaction of the resin from proceeding quickly (and reduces the possibility that air bubbles cannot be completely removed from the prepreg 1 at i b even if pressure is applied with the double belt 2, and voids are included in the laminate. When passing the laminate 5 through the double belt 2 and pressurizing the laminate 5 between the upper and lower endless belts 3 and 4, a pressurizing and heating device 11 such as a heating plate is installed inside each endless belt 3 and 4.
.. 11 is provided, and the laminate 5 can be heated and pressurized by this pressurizing/heating device 11, and the resin of the prepregs 1 at 1 b is cured, and the plurality of prepregs 18t 1 b and metal foils are cured. 10 are laminated and bonded together. Pressure is 20k8/e+n2~30
It is carried out at a low pressure of about kg/ca+2 or less, and in some cases it is carried out at a contact pressure. The laminated body thus laminated is continuously drawn out as the double belt 2 is driven, and is led to the idle roller 12 and cut by the cutter 13, thereby cutting the metal foil into a fixed size. It is possible to obtain a laminate A with a high tension. When performing stack N forming using the continuous method as described above,
The 7-carbon resin porous sheet that is the base material of prepreg 1a has high high frequency properties because the fluororesin that is its material has a low dielectric constant and excellent high frequency properties. It is not necessary to use a resin with excellent high frequency properties as the impregnating resin, and even if a resin commonly used for laminated plates such as epoxy resin is used, the laminate A with high high frequency properties can be manufactured. Therefore, there is no need for long-time molding at high temperatures, which is required when using resin with high high frequency characteristics, and laminate A with high high frequency characteristics can be produced using the conventional continuous method.
This makes it possible to manufacture . In addition, when superimposing each prepreg 1 at 1 b and sending it to the double belt 2, the prepreg 1a whose base material is a fluororesin porous sheet and the prepreg 1 whose base material is glass cloth are stacked.
By alternately stacking the layers B and B, the layer structure of the base material of the laminate A becomes uniform, and it is possible to prevent the laminate A from being warped and deformed as in the case where the base material is uneven.
【実施例]
以下本発明を実施例によって具体的に説明する。
及1性
エポキシ当量520のブロム化エポキシ樹脂を520重
量部、ジシアンノアミドを9重量部、2−エチル−4−
メチルイミグゾールを0.5重量部それぞれ配合し、こ
れを溶剤に溶解してエポキシ樹脂ワニスを得た。このワ
ニスの160℃でのゲルタイムは10分であった。
そして基材として日東電工株式会社製ポリテトラフルオ
aエチレン多孔質シート(厚さ50μ、気孔率85%、
平均孔径0.6μ)を用い、上記エポキシ樹脂ワニスを
含浸して乾燥することによって、樹脂含量が50重量%
、160℃でのゲルタイムが180秒のプリプレグを得
た。また基材として厚み50μの〃ラス織布を用い、上
記エポキシ樹脂ワニスを含浸して乾燥することによって
、at 血合tが50重量%、160℃でのゲルタイム
が180秒のプリプレグを得た。
次ぎに、このプリプレグを5枚づつ用いて第1図に示す
連続工法で積層板の製造をおこなった。
すなわち、各プリプレグを5枚づつ交互に重ねると共に
その上下に厚さ0.035mmの銅箔を重ね、発振周波
数13.56MHzの高周波誘電加熱装置を用いて積層
物の中央部の温度が120〜125℃になるように加熱
し、プリプレグの樹脂を溶融状態にして0.1a+/分
の速度で回転しているダブルベルトに導入し、圧力25
kg/am2、温度170℃の条件で20分間ダブルベ
ルトに通すことによって積層成形をおこない、さらに所
定寸法に切断することによって両面銅張りの積層板を得
た。
塩1目I
上記実施例で用いたエポキシ樹脂ワニスを205g/m
2のがラス布に含浸させて乾燥することによって、樹脂
含量が45重量%、160℃でのゲルタイムが180℃
のプリプレグを得た。このプリプレグを500++eX
500mmの定寸法に切断し、これを8枚重ね合わせ
ると共に上下にさらに厚み0.035IIIlllの銅
箔を重ね、これを厚さ1.5IIImのステンレスプレ
ートの間に挾むと共に多段式油圧プレスの熱盤開に挿入
し、170℃で25分間加熱加圧して多段積層成形をお
こなうことによりて、両面銅張りの積層板を得た。
上記実施例及び比較例で得た積層板について、JIS
C6481に基づいて誘電率を測定した。
また、比較例で100枚の積層板を製造することができ
る時間内に実施例では何枚の積層板を製造することがで
きるかを計測した。これらの結果を次表に示す。
表の結果にみられるように、プリプレグの基材として7
7素樹脂多孔質シートを用いた実施例のものは、誘電率
が低く為周波特性に優れることが確認される。虫たダブ
ルベルトを用いる連続工法の実施例は生産能率が高いこ
とが確認される。
【発明の効果】
上述のように本発明にあっては、フッ素樹脂多孔質シー
トを基材として調製した長尺のプリプレグと、ガラス布
を基材として調製した長尺のプリプレグとを連続的に送
りつつ所要枚数のこのプリプレグを重ね合わせ、これを
ダブルベルトに連続して送り込んで積層成形するように
したので、プリプレグの基材となるフッ素樹脂多孔性シ
ートは低い誘電率を有して高周波特性が優れており、含
浸させる樹脂として高周波特性が優れたものを使用する
必要なくエポキシ樹脂など積層板に一般に使用されるも
のを用いても、高周波特性の高い積層板を製造すること
ができるものであり、高温で長時間の成形をおこなう必
要なく従来から使用されている連続工法をそのまま用い
て高周波特性の高い積層板を製造することができるもの
である。[Examples] The present invention will be specifically explained below using Examples. 520 parts by weight of a brominated epoxy resin with a monovalent epoxy equivalent of 520, 9 parts by weight of dicyanamide, 2-ethyl-4-
0.5 parts by weight of methyl imiguzole was added and dissolved in a solvent to obtain an epoxy resin varnish. The gel time of this varnish at 160°C was 10 minutes. As a base material, a polytetrafluor-a ethylene porous sheet manufactured by Nitto Denko Corporation (thickness 50μ, porosity 85%,
By impregnating with the above epoxy resin varnish and drying it, the resin content is 50% by weight.
, a prepreg with a gel time of 180 seconds at 160°C was obtained. Further, a lath woven fabric having a thickness of 50 μm was used as a base material, and by impregnating it with the above-mentioned epoxy resin varnish and drying it, a prepreg having an at blood content of 50% by weight and a gel time at 160° C. of 180 seconds was obtained. Next, a laminate was manufactured using the continuous construction method shown in FIG. 1 using five sheets of each prepreg. That is, five sheets of each prepreg were stacked alternately, and copper foils with a thickness of 0.035 mm were stacked on top and bottom of the prepregs, and a high-frequency dielectric heating device with an oscillation frequency of 13.56 MHz was used to heat the central part of the laminate to a temperature of 120 to 125 MHz. ℃, the prepreg resin is melted and introduced into a double belt rotating at a speed of 0.1a+/min, and the pressure is 25℃.
kg/am2 and a temperature of 170° C. for 20 minutes through a double belt to form a laminate, and further cut to a predetermined size to obtain a laminate with copper cladding on both sides. Salt 1: 205 g/m of the epoxy resin varnish used in the above example
By impregnating 2 into lath cloth and drying it, the resin content is 45% by weight and the gel time at 160°C is 180°C.
prepreg was obtained. This prepreg is 50++eX
Cut to a fixed size of 500 mm, stack 8 pieces, and further layer copper foil with a thickness of 0.035IIIll on top and bottom, sandwich this between stainless steel plates with a thickness of 1.5IIIm, and heat it in a multi-stage hydraulic press. A laminate with copper cladding on both sides was obtained by inserting the laminate into a disc opening and performing multi-stage laminate molding by heating and pressurizing at 170° C. for 25 minutes. Regarding the laminates obtained in the above examples and comparative examples, JIS
The dielectric constant was measured based on C6481. In addition, it was measured how many laminates could be manufactured in the example within the time required to manufacture 100 laminates in the comparative example. These results are shown in the table below. As seen in the results in the table, 7
It is confirmed that the example using a porous sheet of 7-component resin has a low dielectric constant and excellent frequency characteristics. It is confirmed that the continuous method using the double belt has high production efficiency. [Effects of the Invention] As described above, in the present invention, a long prepreg prepared using a porous fluororesin sheet as a base material and a long prepreg prepared using a glass cloth as a base material are continuously produced. The required number of sheets of prepreg are stacked together while being fed, and then continuously fed into a double belt for laminated molding.The porous fluororesin sheet, which is the base material of the prepreg, has a low dielectric constant and high frequency characteristics. This makes it possible to produce laminates with excellent high-frequency properties even when using epoxy resin, which is commonly used for laminates, without the need to use a resin with excellent high-frequency properties as the impregnating resin. Therefore, it is possible to manufacture a laminate with high high frequency characteristics using the conventional continuous method without the need for long-term molding at high temperatures.
第1図は本発明に用いる装置の概略図であり、1 a、
1 bはプリプレグ、2はダブルベルト、Aは積層板
である。FIG. 1 is a schematic diagram of the apparatus used in the present invention, 1a,
1B is a prepreg, 2 is a double belt, and A is a laminate.
Claims (1)
尺のプリプレグと、ガラス布を基材として調製した長尺
のプリプレグとを連続的に送りつつ所要枚数のこのプリ
プレグを重ね合わせ、これをダブルベルトに連続して送
り込んで積層成形することを特徴とする積層板の製造方
法。(1) While continuously feeding a long prepreg prepared using a porous fluororesin sheet as a base material and a long prepreg prepared using a glass cloth as a base material, the required number of prepregs are stacked together. A method for producing a laminate, characterized by laminated forming by continuously feeding the plate onto a double belt.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1250115A JPH03110152A (en) | 1989-09-26 | 1989-09-26 | Production of laminated sheet |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1250115A JPH03110152A (en) | 1989-09-26 | 1989-09-26 | Production of laminated sheet |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03110152A true JPH03110152A (en) | 1991-05-10 |
Family
ID=17203054
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1250115A Pending JPH03110152A (en) | 1989-09-26 | 1989-09-26 | Production of laminated sheet |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03110152A (en) |
-
1989
- 1989-09-26 JP JP1250115A patent/JPH03110152A/en active Pending
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