JP2733346B2 - Manufacturing method of laminated board - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial applications]

 The present invention relates to the production of a laminate by a continuous pressureless method.

2. Description of the Related Art Conventionally, in a continuous pressureless method, after being cured by heating, it is cut into required dimensions. In this case, it is almost cut to a size of 1 × 1 m. When a printed wiring board is manufactured from this 1 × 1 m size, it is cut to a required size of, for example, 30 × 30 cm or 10 × 40 cm.

[Problems to be solved by the invention]

Conventionally, the loss due to cutting to a required size has increased, resulting in low productivity and a large dimensional change in the laminate. The present invention has been made in view of the above circumstances, and an object of the present invention is to reduce the loss caused by cutting the size when manufacturing a printed wiring board, to increase the productivity, and to increase the size. It is an object of the present invention to provide a method of manufacturing a laminated board having a small change.

Means for Solving the Problems The method for producing a laminate according to the present invention is a method for producing a laminate under continuous pressureless conditions. A required number of resin-impregnated base materials 2 to which resin has been supplied and impregnated are stacked, and a metal foil 3 is continuously supplied on the upper surface and / or lower surface thereof to produce a laminate 4. After being cured by heating under no pressure, after-curing and winding, the above-mentioned problem has been solved by this configuration. [Operation] This is a method for producing a laminated plate without continuous pressure, in which a continuous resin-supplied long strip-shaped base material 1 is impregnated with a flexible resin, a required number of resin-impregnated base materials 2 are stacked, and And / or laminating the metal foil 3 on the lower surface, heat-curing the laminated body 4 continuously and without pressure, and after-curing and winding.
In order to cut to the required size for each required length, it is rewound and cut.
Material loss can be avoided, and in addition, the selection of a flexible resin makes it easy to wind up the laminated board. The stress of the laminated board A obtained by the above can be released, the winding can be performed smoothly, the quality of the laminated board 4 to be wound can be stabilized, and the laminated board A can be conveniently shipped from the factory. Thus, the cost of the laminate A can be reduced. Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. Examples of the flexible resin used in the present invention include a modified epoxy resin, a modified unsaturated polyester resin, a modified phenol resin, a modified polyimide resin, and the like. These modifying means include aliphatic modification, rubber modification, and the like. Paper, glass cloth, glass nonwoven fabric, glass paper, synthetic fiber, synthetic fiber nonwoven fabric is used as the long strip-shaped substrate 1, and a glass substrate is preferable as the electrical laminate. The long strip-shaped base material 1 wound in a coil shape is rewound and continuously flowed up and down a plurality of times, and a varnish of a flexible resin is flowed from above to manufacture the resin-impregnated base material 2. In this case, the long strip-shaped substrate 1 may be immersed in a varnish of a flexible resin. Next, the resin-impregnated base material 2 is passed between the pair of rollers 5 and 6 so that a plurality of the resin-impregnated base materials 2 are stacked, and the metal foil 3
Are pressed to form a laminate 4. As the metal foil 3, copper, aluminum, iron, nickel, zinc, or the like or a foil of these alloys can be used. Thereafter, the laminate 4 is passed through the heating furnace 7 and continuously heated and cured without pressure. Next, the sheet is passed through an after-cure furnace 8 in which a plurality of rollers 8a are arranged above and below, and is after-cured to produce a long laminated plate A. After-curing is carried out by heating at a temperature higher than the thermal deformation temperature (Tg) of the resin used for 5 to 30 minutes. Thereafter, it is wound up and stored, and is unwound and cut to a required size when manufacturing a printed wiring board. Next, embodiments of the present invention will be described specifically. (Example) A long glass cloth with a thickness of 0.1 mm and a width of 1050 mm (product number "116
E ", manufactured by Nitto Boseki Co., Ltd.), 100 parts by weight of a flexible epoxy resin (product number" 871 ", manufactured by Shell Chemical Co., Ltd.), 4 parts by weight of dicyandiamide, 0.2 parts of benzyldimethylamine
45 parts by weight of epoxy resin varnish consisting of parts by weight
6 sheets were impregnated so as to obtain a copper foil having a thickness of 0.035 mm on the upper and lower surfaces to obtain a laminate. Next, the laminate was continuously carried into a heating furnace, heated and cured at 165 ° C. for 20 minutes under no pressure, and after-cured at 150 ° C. for 30 minutes, wound up on a paper tube having a diameter of 10 cm and a thickness of 0.6 mm. Was produced. (Comparative Example 1) A laminate was manufactured in the same manner as in the example, and then the laminate was continuously loaded into a heating furnace, heated and cured at 165 ° C under no pressure for 20 minutes, and then heated to 60 ° C in water. After quenching, it was wound around a paper tube having a diameter of 10 cm to produce a double-sided copper-clad laminate having a thickness of 0.6 mm. (Comparative Example 2) A double-sided copper-clad laminate was manufactured in the same manner as in Comparative Example 1, except that an epoxy resin (product number “828”, manufactured by Shell Chemical Co., Ltd.) was used instead of the flexible epoxy resin. However,
The laminate could not be wound up and had to be cut to 1000 x 1000 mm. When manufacturing a printed wiring board from the double-sided copper-clad laminates of Examples and Comparative Examples 1 and 2, in Examples and Comparative Example 1, the wound double-sided copper-clad laminates are rewound to a required size. When cutting was performed and the double-sided copper-clad laminate of 1000 × 1000 mm was cut to a required size in Comparative Example 2, the cutting loss of Example and Comparative Example 1 was 1/2 compared to Comparative Example 2. . The dimensional change of the example was 0.1 μ / mm, and the dimensional change of Comparative Example 1 and Comparative Example 2 was 0.2 μ / mm.

【The invention's effect】

According to the invention of claim 1, there is provided a method for producing a laminated plate without continuous pressure, wherein a required number of continuous strip-shaped long base materials supplied with a flexible resin to be impregnated. A resin-impregnated base material is stacked and a metal foil is continuously supplied to the upper surface and / or lower surface of the base material to produce a laminate, and the laminate is continuously heat-cured under no pressure, and after-cured. Because it is wound up, it is necessary to cut it to a predetermined size for each required length,
Since it is unwound and cut, there is an advantage that material loss can be avoided as compared with the conventional technique of cutting at the time of manufacturing, and in addition, by selecting a flexible resin, winding of the laminated board becomes easy, and further, After curing without heating under continuous pressure, after-curing, the after-curing can release the stress of the laminated board obtained by heating and curing under continuous pressure-free, allowing smooth winding and winding. This makes it possible to stabilize the quality of the laminated plate, which is advantageous in shipping the laminated plate from a factory, and thus to reduce the cost of the laminated plate. That is, in the invention of claim 1, the winding is favorably performed by selecting a flexible resin, and the laminated board obtained by heat curing is released with stress by using an after cure to improve the winding,
Stabilizing the quality while continuously manufacturing the laminate without pressure, and winding it continuously, thus avoiding material loss when cutting to the specified dimensions during manufacturing, stabilizing the quality and winding Thus, the present invention is advantageous in that the laminate is shipped from a factory, and the cost of the laminate is reduced. According to the second aspect of the invention, in addition to the effect of the first aspect, since the long strip-shaped base is a glass base, the glass base is impregnated with a flexible resin by a paper-like base. It is easy to increase compared to, because the flexible resin is a rubber modified epoxy resin
It is easy to reduce obstruction of the winding property of the laminate.

[Brief description of the drawings]

FIG. 1 is a schematic view showing the steps of one embodiment of the present invention, wherein A is a laminated plate, 1 is a long strip-shaped base material, 2 resin-impregnated base materials,
3 is a copper foil and 4 is a laminate.

Claims (2)

(57) [Claims] 1. A method for producing a laminated board without continuous pressure, comprising supplying a required number of resin-impregnated substrates by supplying a flexible resin to a continuously supplied long strip-shaped substrate. Are laminated and the metal foil is continuously supplied to the upper surface and / or the lower surface thereof to produce a laminated body. The laminated body is continuously heated and cured under no pressure, and after-cured and wound. A method for manufacturing a laminated board. 2. The method according to claim 1, wherein the long strip-shaped substrate is a glass substrate, and the flexible resin is a rubber-modified epoxy resin.