JP2708914B2 - Manufacturing method of laminated board - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial applications]

 The present invention relates to the production of a laminate by a continuous pressureless method.

2. Description of the Related Art Conventionally, in a continuous pressureless method, after being cured by heating, it is cut into required dimensions. In this case, it is almost cut to a size of 1 × 1 m. When a printed wiring board is manufactured from this 1 × 1 m size, it is cut to a required size of, for example, 30 × 30 cm or 10 × 40 cm.

[Problems to be solved by the invention]

In the past, the loss due to cutting to a required size was large, and the productivity was low. The present invention has been made in view of the above circumstances, and an object of the present invention is to reduce the loss caused by cutting the size when manufacturing a printed wiring board, and to improve the productivity of a laminated board. It is to provide a manufacturing method.

[Means for Solving the Problems]

The method for producing a laminate according to the present invention is a method for producing a laminate under continuous pressure-free conditions. After laminating a number of the resin-impregnated base materials 2 and continuously supplying the metal foil 3 to the upper surface and / or lower surface thereof, a laminated body 4 is manufactured, and the laminated body 4 is continuously heated and cured without pressure. It is characterized by cooling and winding, and the above-mentioned problem has been solved by this configuration. [Function] Since the laminated board A can be wound, when the printed wiring board is manufactured, it can be unwound and cut into a predetermined size, thereby reducing the loss due to cutting and increasing the productivity. It is. In addition, by selecting a flexible resin, there is an advantage that the winding of the laminated plate becomes easy, and a production line for winding the laminated plate can be easily obtained. Since the cooling is performed later, the line can be shortened as compared with the case of the natural cooling, and the space for installing the manufacturing line in the factory can be reduced. Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. Examples of the flexible resin used in the present invention include a modified epoxy resin, a modified unsaturated polyester resin, a modified phenol resin, a modified polyimide resin, and the like. These modifying means include aliphatic modification, rubber modification and the like. Paper, glass cloth, glass non-woven fabric, glass paper, synthetic woven cloth, and synthetic non-woven cloth are used as the long strip-shaped base material 1. A glass base material is preferable as the electrical laminate. The coiled long strip-shaped base material 1 is rewound and continuously flowed up and down a plurality of times, and a varnish of a flexible resin is flowed from above to manufacture the resin-impregnated base material 2. In this case, the long strip-shaped substrate 1 may be immersed in a varnish of a flexible resin. Next, the resin-impregnated base material 2 is passed between the pair of rollers 5 and 6 so that a plurality of the resin-impregnated base materials 2 are stacked, and the metal foil 3
Are pressed to form a laminate 4. As the metal foil 3, copper, aluminum, iron, nickel, zinc, or the like or a foil of these alloys can be used. Thereafter, the laminate 4 is passed through the heating furnace 7 and continuously heated and cured without pressure. Next, it is passed through the cooling furnace 8 and cooled to produce a long laminated plate A. Cooling is preferably rapid cooling, for example, cooling in water. Thereafter, it is wound up and stored, and is unwound and cut to a required size when manufacturing a printed wiring board. Next, examples of the present invention will be specifically described. (Example) A long glass cloth with a thickness of 0.1 mm and a width of 1050 mm (product number "116
E ", manufactured by Nitto Boseki Co., Ltd.) and 100 parts by weight of a flexible epoxy resin (product number: 8711, manufactured by Shell Chemical Co., Ltd.), 4 parts by weight of dicyandiamide, and 0.2 parts by weight of benzylmethylamine in an epoxy resin varnish. Was impregnated so as to be 45% by weight, and a copper foil having a thickness of 0.035 mm was further laminated on the upper and lower surfaces thereof to obtain a laminate. After being transported and cured by heating at 165 ° C. under no pressure for 20 minutes, it was rapidly cooled to 60 ° C. in water and wound around a paper tube having a diameter of 10 cm to produce a double-sided copper-clad laminate having a thickness of 0.6 mm. Example) A double-sided copper-clad laminate was manufactured in the same manner as in Example except that an epoxy resin (product number "828", manufactured by Shell Chemical Co., Ltd.) was used instead of the flexible epoxy resin. However, the laminate could not be wound up, so it had to be cut to 1000 x 1000 mm. When manufacturing a printed wiring board from the double-sided copper-clad laminates of Examples and Comparative Examples, in Examples, the wound double-sided copper-clad laminates were rewound and cut to a required size. When a double-sided copper-clad laminate of 1000 × 1000 mm was cut into a required size, the cutting loss in the example was 1/2 compared to the comparative example.

【The invention's effect】

According to the invention of claim 1, there is provided a method for producing a laminated plate without continuous pressure, wherein a required number of continuous strip-shaped long base materials supplied with a flexible resin to be impregnated. A resin-impregnated base material is laminated and a metal foil is continuously supplied to the upper surface and / or lower surface of the substrate to produce a laminate. The laminate is continuously heated without pressure, and then cooled and wound. Since a long laminated board can be wound and stored, and when manufacturing a printed wiring board, by unwinding and cutting to a predetermined size, loss due to cutting can be reduced and productivity can be increased. Things. In addition, by selecting a flexible resin, there is an advantage that the winding of the laminated plate becomes easy, and a production line for winding the laminated plate can be easily obtained. Since the cooling is performed later, the line can be shortened as compared with the case of the natural cooling, and the space for installing the manufacturing line in the factory can be reduced. According to the second aspect of the invention, in addition to the effect of the first aspect, since the long strip-shaped base is a glass base, the glass base is impregnated with a flexible resin by a paper-like base. It is easy to increase compared to, because the flexible resin is a rubber modified epoxy resin
It is easy to reduce obstruction of the winding property of the laminate.

[Brief description of the drawings]

FIG. 1 is a schematic view showing the steps of one embodiment of the present invention, wherein A is a laminated plate, 1 is a long strip-shaped substrate, 2 is a resin-impregnated substrate, 3 is a copper foil, and 4 is a laminated body. is there.

Claims (2)

(57) [Claims] 1. A method for producing a laminated board without continuous pressure, comprising supplying a required number of resin-impregnated substrates by supplying a flexible resin to a continuously supplied long strip-shaped substrate. A metal foil is continuously supplied to the upper surface and / or lower surface thereof to produce a laminate, and the laminate is continuously heated and cured under no pressure, and then cooled and wound. Manufacturing method of the laminated plate to be performed. 2. The method according to claim 1, wherein the long strip-shaped substrate is a glass substrate, and the flexible resin is a rubber-modified epoxy resin.