JPH03110153A - Production of laminated sheet - Google Patents
Production of laminated sheetInfo
- Publication number
- JPH03110153A JPH03110153A JP1250116A JP25011689A JPH03110153A JP H03110153 A JPH03110153 A JP H03110153A JP 1250116 A JP1250116 A JP 1250116A JP 25011689 A JP25011689 A JP 25011689A JP H03110153 A JPH03110153 A JP H03110153A
- Authority
- JP
- Japan
- Prior art keywords
- laminate
- prepreg
- continuously
- double belt
- prepregs
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 17
- 239000004744 fabric Substances 0.000 claims abstract description 15
- 239000000463 material Substances 0.000 claims abstract description 13
- 238000003475 lamination Methods 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 abstract description 14
- 239000002184 metal Substances 0.000 abstract description 14
- 238000010438 heat treatment Methods 0.000 abstract description 12
- 238000000465 moulding Methods 0.000 abstract description 12
- 239000011888 foil Substances 0.000 abstract description 11
- 238000000034 method Methods 0.000 abstract description 7
- 238000010030 laminating Methods 0.000 abstract 2
- 229920005989 resin Polymers 0.000 description 22
- 239000011347 resin Substances 0.000 description 22
- 238000011437 continuous method Methods 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 239000003822 epoxy resin Substances 0.000 description 7
- 229920000647 polyepoxide Polymers 0.000 description 7
- 239000011889 copper foil Substances 0.000 description 5
- 238000001035 drying Methods 0.000 description 4
- 239000002966 varnish Substances 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 3
- 238000005253 cladding Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- -1 polytetrafluoroethylene Polymers 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 239000002759 woven fabric Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 230000001934 delay Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
Abstract
Description
本発明は、プリンF配線板として用いられる積層板の連
続工法による製造方法に関するものである。The present invention relates to a method for manufacturing a laminate used as a Print F wiring board by a continuous method.
積層板は通常、紙やガラス布などを基材としてこれに熱
硬化性樹脂を含浸乾燥することによってプリプレグを調
製すると共に、このプリプレグを所定の定寸法に切断し
、この定寸法に切断した複数枚のプリプレグ及び必要に
応じて銅箔などの金属箔を重ね、これをプレス装置にプ
レートを介して10〜14ffi重ねてセットし、上下
の熱盤によって所定時間加熱加圧する多段積層成形をお
こなうことによって、製造がおこなわれている。しかし
、このように多段積層成形で積層板を製造する場合は、
パッチ作業となるために作業能率が悪く、生産性に多大
の問題を有する。
このために、本出願人によって積層板を連続工法で製造
する方法が特開昭60−189439号公報等によって
提供されている。すなわち、複数枚の長尺のプリプレグ
を重ねて連続的に送りつつ、必要に応じてさらに長尺の
金属箔を重ね、そしてこれをダブルベルトに連続的に通
してダブルベルトによって加熱加圧することによって、
積層板を連続して成形することができるようにしたもの
である。この方法によれば、連続した成形作業で積層板
を製造できるために生産能率がバッチ作業の多段積層成
形よりも飛躍的に向上する。Laminated boards are usually prepared by preparing prepreg by using paper or glass cloth as a base material and impregnating it with a thermosetting resin and drying it, and then cutting this prepreg into a predetermined size, and then cutting the prepreg into a plurality of pieces cut into the specified size. Layering sheets of prepreg and metal foil such as copper foil as necessary, setting these in a press machine with 10 to 14 ffi overlapped via plates, and performing multi-stage lamination molding by heating and pressing for a predetermined period of time using upper and lower heating plates. Manufactured by. However, when manufacturing laminates by multi-stage lamination molding like this,
Since it is a patch work, the work efficiency is low and there are many problems in productivity. For this purpose, the present applicant has proposed a method of manufacturing a laminate using a continuous method, such as in Japanese Patent Laid-Open No. 189439/1983. In other words, multiple sheets of long prepreg are piled up and continuously fed, and if necessary, a long metal foil is piled up, and this is continuously passed through a double belt and heated and pressurized by the double belt. ,
This allows the laminated plates to be formed continuously. According to this method, since the laminate can be manufactured in a continuous molding operation, the production efficiency is dramatically improved compared to multi-stage lamination molding in a batch operation.
一方、電子工業や通信、コンピュータなどの分野におい
て使用される周波数は高周波の領域にシフトされており
、このような高周波領域で用いられるプリント配線板の
積層板においては、信号の伝播遅延を短くするうえで誘
電率がより小さいことが要求されている。このためにこ
のような高周波特性が優れた積層板を得るために、積層
板を構成する樹脂、すなわちプリプレグの樹脂として周
波数特性に優れた例えば特許出願公表昭61−5004
34号のような芳香族ポリイソシアネートなどを用いる
ことがなされているが、高周波特性に優れた樹脂は一般
に高温(場合によっては250〜300℃)で長時間(
場合によっては1〜2時間)成形をおこなう必要がある
。
しかし、プリプレグを連続的にダブルベルトに通して加
熱加圧成形する場合には、高温で長時間成形を持続させ
ることができないために、このような高周波特性が優れ
た樹脂を用いて調製したプリプレグを使用して上記のよ
うなダブルベルトによる連続工法で積層板を製造するこ
とはできないものであり、高周波特性に優れた積層板を
連続工法で製造することは困難であるというのが現状で
ある。
本発明は上記の点に鑑みて為されたものであり、高周波
特性に優れた積層板を連続工法で製造することができる
積層板の製造方法を提供することを目的とするものであ
る。On the other hand, the frequencies used in fields such as the electronics industry, communications, and computers are being shifted to high-frequency regions, and printed wiring board laminates used in such high-frequency regions are designed to shorten signal propagation delays. Moreover, a smaller dielectric constant is required. For this reason, in order to obtain such a laminate with excellent high frequency characteristics, a resin constituting the laminate, that is, a prepreg resin, which has excellent frequency characteristics, such as a patent application published in 1988-5004, has been developed.
Aromatic polyisocyanates such as No. 34 have been used, but resins with excellent high frequency properties are generally used at high temperatures (250 to 300°C in some cases) for long periods of time (
In some cases, it may be necessary to perform molding for 1 to 2 hours. However, when the prepreg is continuously passed through a double belt and molded under heat and pressure, it is impossible to sustain the molding for a long time at high temperatures. It is not possible to manufacture laminates using the above-mentioned continuous method using double belts, and the current situation is that it is difficult to manufacture laminates with excellent high frequency characteristics using the continuous method. . The present invention has been made in view of the above points, and it is an object of the present invention to provide a method for manufacturing a laminate that can manufacture a laminate with excellent high frequency characteristics by a continuous method.
本発明に係る積層板の製造方法は、フッ素樹脂布を基材
として調製した長尺のプリプレグ1を連続的に送りつつ
所要枚数のこのプリプレグ1,1・・・を重ね合わせ、
これをダブルベルト2に連続して送り込んで積層成形す
ることを特徴とするものである。
以下本発明の詳細な説明する。
プリプレグ1は基材に樹脂の7ニスを含浸させて乾燥す
ることによって、長尺のものとして調製される0本発明
においてはこの基材として、フッ素樹脂(ポリテトラフ
ルオロエチレン)の布を用いるものである。フッ素樹脂
布はフッ素樹脂繊維の織布あるいは不織布として作成さ
れているものであり、例えばダイキン工業株式会社から
ボリブン布として市販されているものを用いることがで
きる。また本発明において、フッ素樹脂布に含浸させる
樹脂としては任意のものを用いることができるが、特に
エポキシ樹脂などの熱硬化性樹脂が好ましい。
そして第1図に示すように、このプリプレグ1をロール
状に巻いたものから巻き外して所定枚数を〃イドロール
6を経由させ連続的に送り、重ねロール7によって各プ
リプレグ1を連続的に重ね合わせる。一方、銅箔などの
金属箔10も長尺に形成してロール状に巻いておき、こ
れを巻き外して上記の重ね合わせたプリプレグ1の最外
層の外面に重ね合わせる。両面金属箔張り積層板を製造
する場合には、2枚の金属箔10を用いて重ね合わせた
プリプレグ1の雨量外層に重ねるようにし、また片面金
属箔張り積層板を製造する場合には、一方の最外層にの
み金属箔10を重ねるようにすると共に他方の最外層に
は7フ素樹脂フイルム等の150℃以上の温度に耐える
と共に高周波特性に優れたフィルムを重ねるようにする
。ここで、金属箔10としては接着剤を塗布したものや
、アルミニウムキャリヤーと極薄銅箔との組み合わせに
なっている箔など任意のものを使用することができる。
このように複数枚のプリプレグ1及び必要に応じて金属
1i10を重ねた積層物5を連続して送りつつ、この積
層物5を予備加熱してプリプレグ1に含まれる樹脂を溶
融状態にした後に、ドラム9によって連続駆動される上
下のエンドレスベルト3.4によって構成されるダブル
ベルト2に積層物5を連続して導入する。このように予
備加熱をおこなうにあたっては、積層物5を上下の高周
波印加電極8.8間に通して無圧下または接触圧下で誘
電加熱することによっておこなうのが好ましい。誘電加
熱すると加熱温度はプリプレグ1の表面部よりもむしろ
内部で高くなり、電熱などを用いて外部加熱をする場合
のように表面部が高く加熱されてプリプレグ1の表面部
の樹脂の硬化反応が速く進行することがなく、ダブルベ
ルト2で加圧してもプリプレグ1内から気泡が抜けきら
なくなって積層板にボイドが含まれるというようなこと
を低減することができるのである。そして積層物5をダ
ブルベルト2に通して上下のエンドレスベルト3,4間
で積層物5を加圧するにあたって、各エンドレスベルト
3,4内には熱盤などの加圧加熱装置i i、t iが
配設してあって、この加圧加熱装置11によって積層物
5を加熱加圧できるようにしてあり、プリプレグ1の樹
脂を硬化させると共に複数枚のプリプレグ1及び金属箔
10を積層接着させるものである。加圧は20kg/c
a+2〜30 kg/ cm2程度以下の低圧でおこな
われるものであり、場合によっては接触圧でおこなわれ
ることもある。このようにして積層された積層体はダブ
ルベルト2の駆動に伴って連続して導出されるものであ
り、〃イドローラ12に導いて切断機13で切断するこ
とによって、定寸法となった金属箔張りの積層板Aを得
ることができるものである。
上記のようにして連続工法で積層成形するにあたって、
プリプレグ1の基材となる7ツ素樹脂布は、その素材で
あるフッ素樹脂が低い誘電率を有して高周波特性が優れ
ているために、高い高周波特性を有しているものであり
、含浸させる樹脂として高周波特性が優れたものを使用
する必要なく、エポキシ樹脂など積層板に一般に使用さ
れるものを用いても、高周波特性の高い積層板Aを製造
することができる。従って高い高周波数特性を有する樹
脂を用いる場合のような、高温で長時間の成形をおこな
う必要がなくなり、従来から使用されて〜・る連続工法
をそのまま用いて高周波特性の高い積層板Aを製造する
ことが可能になるものである。The method for manufacturing a laminate according to the present invention involves continuously feeding a long prepreg 1 prepared using fluororesin cloth as a base material, and stacking a required number of prepregs 1, 1...
This is characterized in that it is continuously fed into a double belt 2 and laminated. The present invention will be explained in detail below. Prepreg 1 is prepared as a long piece by impregnating a base material with a resin varnish and drying it. In the present invention, a fluororesin (polytetrafluoroethylene) cloth is used as the base material. It is. The fluororesin cloth is made as a woven or nonwoven fabric of fluororesin fibers, and for example, one commercially available from Daikin Industries, Ltd. as Volibun cloth can be used. Further, in the present invention, any resin can be used to impregnate the fluororesin cloth, but thermosetting resins such as epoxy resins are particularly preferred. Then, as shown in FIG. 1, this prepreg 1 is unwound from a roll, a predetermined number of sheets are continuously fed through an idle roll 6, and each prepreg 1 is continuously overlapped by a stacking roll 7. . On the other hand, a metal foil 10 such as a copper foil is also formed into a long length and wound into a roll, which is unwound and superimposed on the outer surface of the outermost layer of the above-mentioned superimposed prepregs 1. When manufacturing a double-sided metal foil-clad laminate, two metal foils 10 are used to overlap the outer layer of the superimposed prepreg 1, and when manufacturing a single-sided metal foil-clad laminate, one The metal foil 10 is layered only on the outermost layer of the metal foil 10, and a film such as a 7-fluorine resin film that can withstand temperatures of 150° C. or more and has excellent high frequency characteristics is layered on the other outermost layer. Here, any metal foil 10 can be used, such as one coated with an adhesive or a combination of an aluminum carrier and an ultra-thin copper foil. While continuously feeding the laminate 5 in which a plurality of prepregs 1 and metals 1i10 are piled up as necessary, the laminate 5 is preheated to melt the resin contained in the prepreg 1, and then The laminate 5 is successively introduced into a double belt 2 constituted by an upper and lower endless belt 3.4 which is continuously driven by a drum 9. Preheating is preferably carried out by passing the laminate 5 between the upper and lower high-frequency application electrodes 8.8 and dielectrically heating it under no pressure or under contact pressure. When dielectrically heated, the heating temperature is higher inside the prepreg 1 rather than on the surface, and as in the case of external heating using electric heating, the surface is heated to a high temperature and the curing reaction of the resin on the surface of the prepreg 1 is slowed down. This prevents the process from progressing quickly, and it is possible to reduce the occurrence of voids being included in the laminate due to the air bubbles not being completely removed from the prepreg 1 even when pressurized by the double belt 2. Then, when passing the laminate 5 through the double belt 2 and pressurizing the laminate 5 between the upper and lower endless belts 3 and 4, each endless belt 3 and 4 is equipped with a pressure heating device such as a heating plate i, ti. is arranged so that the laminate 5 can be heated and pressurized by this pressure/heating device 11, which cures the resin of the prepreg 1 and laminates and bonds a plurality of prepregs 1 and metal foils 10 together. It is. Pressure is 20kg/c
It is carried out at a low pressure of about a+2 to 30 kg/cm2 or less, and in some cases it is carried out at a contact pressure. The laminated body thus laminated is continuously drawn out as the double belt 2 is driven, and is led to the idle roller 12 and cut by the cutter 13, thereby cutting the metal foil into a fixed size. It is possible to obtain a laminate A with a high tension. When performing laminated molding using the continuous method as described above,
The 7-component resin cloth that is the base material of prepreg 1 has high high-frequency properties because the fluororesin that is its material has a low dielectric constant and excellent high-frequency properties. It is not necessary to use a resin with excellent high-frequency properties as the resin, and the laminate A with high high-frequency properties can be manufactured by using a resin commonly used for laminates, such as epoxy resin. Therefore, there is no need for long-term molding at high temperatures, which is required when using resin with high high-frequency characteristics, and laminate A with high high-frequency characteristics can be manufactured using the conventional continuous method. It is possible to do so.
以下本発明を実施例によって具体的に説明する。
艮1に
エポキシ当量520のブロム化エポキン樹脂を520重
量部、ノシアンノアミドを9重量部、2−エチル−4−
メチルイミグゾールを0.5重量部それぞれ配合し、こ
れを溶剤に溶解してエポキシ樹脂ワニスを得た。このフ
二スの160℃でのデルタイムは10分であった。そし
て基材として0゜1LIlffl厚のボリブン布(ダイ
キン工業株式会社製ポリテトラフルオロエチレン樹脂織
布)を用い、上記エポキシ樹脂ワニスを含浸して乾燥す
ることによって、樹脂含量が50重量%、160℃での
デルタイムが1sobのプリプレグを得た。
次ぎに、このプリプレグを用いて第1図に示す連続工法
で積層板の製造をおこなった。すなわち、プリプレグ8
枚を重ねると共にその上下に厚さ0゜035mmの銅箔
を重ね、発振周波数13.56MHzの高周波誘電加熱
装置を用いて積層物の中央部の温度力f120−125
℃になるように加熱し、プリプレグの樹脂を溶融状態に
して0.1m/分の速度で回転しているダブルベルトに
導入し、圧力25 kg/ 0m2、温度170℃の条
件で20分間ダブルベルトに通すことによって積層成形
をおこない、さらに所定寸法に切断することによって両
面銅張りの積層板を得た。
ルm
上記実施例で用いたエポキシ樹脂ワニスを205g/m
2のガラス布に含浸させて乾燥することによって、樹脂
含量が45重量%、160℃でのゲルタイムが180℃
のプリプレグを得た。このプリプレグを500曽論X5
00em+*の定寸法に切断し、これを8枚重ね合わせ
ると共に上下にさらに厚み0.035+a輪の銅箔を重
ね、これを厚さ1.51のステンレスプレートの間に挟
むと共に多段式油圧プレスの熱盤間に挿入し、170℃
で25分間加熱加圧して多段積層成形をおこなうことに
よって、両面銅張りの積層板を得た。
上記実施例及び比較例で得た積層板について、JIS
C6481に基づいて誘電率を測定した。
また、比較例で100枚の積層板を製造することができ
る時間内に実施例では何枚の積層板を製造することがで
きるかを計測した。これらの結果を次表に示す。
表の結果にみられるように、プリプレグの基材としてフ
ッ素樹脂布を用いた実施例のものは、誘電率が低く高周
波特性に優れることが確認される。
また連続工法の実施例は生産能率が高いことが確認され
る。The present invention will be explained in detail below using examples. 520 parts by weight of a brominated epoxy resin with an epoxy equivalent of 520, 9 parts by weight of nocyanamide, and 2-ethyl-4-
0.5 parts by weight of methyl imiguzole was added and dissolved in a solvent to obtain an epoxy resin varnish. The del time of this finis at 160°C was 10 minutes. Then, using a 0°1 LIffl thick polyvinyl cloth (polytetrafluoroethylene resin woven fabric manufactured by Daikin Industries, Ltd.) as a base material, impregnating it with the above epoxy resin varnish and drying it, the resin content was 50% by weight and the temperature was 160°C. A prepreg with a del time of 1 sob was obtained. Next, using this prepreg, a laminate was manufactured using the continuous construction method shown in FIG. That is, prepreg 8
At the same time, copper foils with a thickness of 0°035 mm are placed on top and bottom of the sheets, and a high-frequency dielectric heating device with an oscillation frequency of 13.56 MHz is used to heat the temperature at the center of the laminate f120-125.
℃, the prepreg resin is melted and introduced into a double belt rotating at a speed of 0.1 m/min, and the double belt is heated for 20 minutes at a pressure of 25 kg/0 m2 and a temperature of 170 ℃. Laminate molding was carried out by passing through the laminate, and the laminate was further cut into a predetermined size to obtain a laminate plate with copper cladding on both sides. 205g/m of the epoxy resin varnish used in the above example
By impregnating the glass cloth in Step 2 and drying it, the resin content was 45% by weight and the gel time at 160°C was 180°C.
prepreg was obtained. This prepreg is 500 x 5
00em+* were cut to a fixed size, 8 sheets were stacked on top of each other, and a 0.035+a ring of copper foil with a thickness of 0.035+a was layered on top and bottom, and this was sandwiched between stainless steel plates with a thickness of 1.51, and a multi-stage hydraulic press was used. Insert between heating discs to 170℃
By heating and pressing for 25 minutes to perform multi-stage lamination molding, a laminate plate with copper cladding on both sides was obtained. Regarding the laminates obtained in the above examples and comparative examples, JIS
The dielectric constant was measured based on C6481. In addition, it was measured how many laminates could be manufactured in the example within the time required to manufacture 100 laminates in the comparative example. These results are shown in the table below. As seen in the results in the table, it is confirmed that the examples using fluororesin cloth as the prepreg base material have a low dielectric constant and excellent high frequency characteristics. It is also confirmed that the continuous production method has high production efficiency.
上述のように本発明にあっては、フッ素樹脂布を基材と
して調製した長尺のプリプレグを連続的に送りつつ所要
枚数のこのプリプレグを重ね合わせ、これをダブルベル
トに連続して送り込んで積層成形するようにしたので、
プリプレグの基材となるフッ素樹脂布は低い誘電率を有
して高周波特性が優れており、含浸させる樹脂として高
周波特性が優れたものを使用する必要な(エポキシ樹脂
など積層板に一般に使用されるものを用いても、高周波
特性の高い積層板を製造することができるものであり、
高温で長時間の成形をおこなう必要なく従来から使用さ
れている連続工法をそのまま用いて高周波特性の高い積
層板を製造することができるものである。As described above, in the present invention, a long prepreg prepared using fluororesin cloth as a base material is continuously fed, a required number of prepregs are stacked, and the sheets are continuously fed to a double belt to be laminated. I decided to mold it, so
Fluororesin cloth, which is the base material for prepreg, has a low dielectric constant and excellent high-frequency properties, and it is necessary to use a resin with excellent high-frequency properties as the impregnating resin (such as epoxy resin, which is commonly used for laminated boards). It is possible to manufacture laminates with high high frequency characteristics even if using
It is possible to manufacture a laminate with high high frequency characteristics using the conventional continuous method without the need for long-term molding at high temperatures.
第1図は本発明に用いる装置の概略図であり°、1はプ
リプレグ、2はダブルベルト、Aは積層板である。FIG. 1 is a schematic diagram of the apparatus used in the present invention, where 1 is a prepreg, 2 is a double belt, and A is a laminate.
Claims (1)
レグを連続的に送りつつ所要枚数のこのプリプレグを重
ね合わせ、これをダブルベルトに連続して送り込んで積
層成形することを特徴とする積層板の製造方法。(1) Lamination characterized by continuously feeding a long prepreg prepared using fluororesin cloth as a base material, overlapping a required number of prepregs, and then continuously feeding this to a double belt to form a laminated layer. Method of manufacturing the board.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1250116A JPH03110153A (en) | 1989-09-26 | 1989-09-26 | Production of laminated sheet |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1250116A JPH03110153A (en) | 1989-09-26 | 1989-09-26 | Production of laminated sheet |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03110153A true JPH03110153A (en) | 1991-05-10 |
Family
ID=17203067
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1250116A Pending JPH03110153A (en) | 1989-09-26 | 1989-09-26 | Production of laminated sheet |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03110153A (en) |
-
1989
- 1989-09-26 JP JP1250116A patent/JPH03110153A/en active Pending
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