JPH03109816U - - Google Patents
Info
- Publication number
- JPH03109816U JPH03109816U JP1863890U JP1863890U JPH03109816U JP H03109816 U JPH03109816 U JP H03109816U JP 1863890 U JP1863890 U JP 1863890U JP 1863890 U JP1863890 U JP 1863890U JP H03109816 U JPH03109816 U JP H03109816U
- Authority
- JP
- Japan
- Prior art keywords
- vertical
- circuit
- circuit board
- dividing grooves
- horizontal dividing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011230 binding agent Substances 0.000 claims 1
- 239000000919 ceramic Substances 0.000 claims 1
- 238000001746 injection moulding Methods 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 6
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
- Structure Of Printed Boards (AREA)
Description
第1図ないし第3図は、本考案に係る集合基板
の一実施例を示すもので、第1図は平面図、第2
図は第1図の−線矢視断面図、第3図は第1
図の−線矢視断面図、第4図は第1図の集合
基板より得た基板の平面図、第5図は、集合基板
の上下両面に分割溝を形成した状態を示す第3図
相当図、第6図、第7図は空孔の形状が異なる場
合の第4図相当図、第8図は、ボス9を取付けた
基板の斜視図である。
1……回路用集合基板(集合基板)、2……回
路用基板(基板)、3……縦分割溝、4……横分
割溝、5……小孔、6……ガイド、7……空孔、
8,8′,8″……切欠き、9……ボス、9a…
…孔、10……ピンゲート痕。
1 to 3 show an embodiment of the collective substrate according to the present invention, in which FIG. 1 is a plan view, and FIG.
The figure is a sectional view taken along the - line in Figure 1, and Figure 3 is a cross-sectional view of Figure 1.
4 is a plan view of the substrate obtained from the collective substrate of FIG. 1, and FIG. 5 is equivalent to FIG. 3 showing a state in which dividing grooves are formed on both upper and lower surfaces of the collective substrate. 6 and 7 are views corresponding to FIG. 4 when the shapes of the holes are different, and FIG. 8 is a perspective view of the substrate to which the boss 9 is attached. 1...Circuit collective board (collective board), 2...Circuit board (substrate), 3...Vertical dividing groove, 4...Horizontal dividing groove, 5...Small hole, 6...Guide, 7... Vacancy,
8, 8', 8''...notch, 9...boss, 9a...
...hole, 10... pin gate mark.
Claims (1)
なる混合物を射出成形して得られる成形体の焼結
物である回路用集合基板であつて、 多数の小孔を有する板状の回路用基板に分割す
るための、縦および横方向の分割溝を有し、これ
ら縦および横方向の分割溝の交る部分には、空孔
が設けられていることを特徴とする回路用集合基
板。[Claims for Utility Model Registration] A circuit board assembly which is a sintered product obtained by injection molding a mixture of a ceramic sinterable substance and a binder, and which has a large number of small holes. A circuit characterized in that it has vertical and horizontal dividing grooves for dividing the circuit board into shaped circuit boards, and a hole is provided at the intersection of the vertical and horizontal dividing grooves. Collective board for.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1863890U JPH03109816U (en) | 1990-02-26 | 1990-02-26 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1863890U JPH03109816U (en) | 1990-02-26 | 1990-02-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03109816U true JPH03109816U (en) | 1991-11-12 |
Family
ID=31521790
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1863890U Pending JPH03109816U (en) | 1990-02-26 | 1990-02-26 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03109816U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006245107A (en) * | 2005-03-01 | 2006-09-14 | Ngk Spark Plug Co Ltd | Wiring board for multiple machining |
-
1990
- 1990-02-26 JP JP1863890U patent/JPH03109816U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006245107A (en) * | 2005-03-01 | 2006-09-14 | Ngk Spark Plug Co Ltd | Wiring board for multiple machining |
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