JPH03106762A - Package body - Google Patents

Abstract

PURPOSE:To prevent electrostatic rupture of a semiconductor device being a product formed into a product tape by providing a conductive tape which is superposed with the product and wound around a reel. CONSTITUTION:A TAB type package body 20 comprises a reel 1, a product tape 2 wound around the reel 1, and a spacer taper 3 superposed with the prod uct tape 2 and wound around the reel 1. The spacer tape 3 is formed of a conductive tape prepared such that carbon is kneaded in, for example, acryl resin, and having a surface resistivity value of approximate 10<-6>OMEGA.cm or less. This constitution prevents electrostatic rupture of a semiconductor element, attached to the product taper 2, by means of the spacer tape 3.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a package, particularly a TAB (Ta
pe Automated Bonding) type packaging. [Conventional technology] Thinning of semiconductor devices. TAB is known as a technology suitable for increasing the number of reads (bins). Regarding TAB technology, for example, ``Electronic Materials Special Edition'' published by Kogyo Kenkyukai,
Published November 18, 1980, listed on pages 145 to 149. As also described in this document, T
In AB, a carrier tape is superimposed on a semiconductor element (chip) constituting an LSI (Large Scale Integrated Circuit) or the like, and the tips of the inner leads of the leads patterned on the carrier tape are connected to the electrodes of the chip, especially the bumps. In this method, the inner lead and the bump are integrally joined by overlapping the bump with a raised electrode, and applying pressure and heat to the tip of the inner lead. Furthermore, as described in the same document, the carrier tape is wound onto reels (supply side reel, storage side reel) and unwound. At this time, a spacer film (spacer tape) for chip protection is superimposed on the carrier tape and wound up. On the other hand, electronic components that are easily damaged by static electricity, such as Nikkei BP
Published by Nikkei Electronics J February 2, 19B8
As stated in the 6th issue, P165-P170,
It is shipped in an anti-static magazine or bag. [Problems to be Solved by the Invention] In a TAB type package, a semiconductor element is supported by a carrier tape (product tape) wound on a reel and protected by a spacer tape. T of such a structure
In the AB type package, the carrier tape is made of an insulating polyimide film, and the spacer tape that protects the semiconductor elements is also made of an insulating resin film. By the way, semiconductor devices (semiconductor elements) that are easily damaged by static electricity are handled while being housed in trays, bags, etc. to prevent static electricity damage, as described in the above-mentioned literature. However, in the case of TAB-type packages, it has been found that even if they are placed in conductive bags, the effect of preventing electrostatic damage is not necessarily sufficient, and some items may suffer from electrostatic damage or damage. An object of the present invention is to provide a TAB type package that can prevent electrostatic breakdown and damage to semiconductor devices. The above and other objects and novel features of the present invention include:
It will become clear from the description of this specification and the attached drawings. [! Means for Solving Problem III] A brief summary of typical inventions disclosed in this application is as follows: In the TAB type package of the present invention, semiconductor elements are Spacer tapes (conductive tapes), which are conductive and serve as a strength member, are stacked on product tapes attached at regular intervals, and the product tapes and spacer tapes are wound around a reel. In addition, as another configuration, a spacer tape serving as a strength member is stacked on one side of a product tape on which semiconductor elements are attached at regular intervals, and a conductive tape is stacked on the other side of the product tape. , spacer tape,
The conductive tape is wrapped around a reel. [Function] According to the above-described means, since the TAB type package of the present invention has a conductive tape overlaid on a product tape to which a semiconductor element is attached, electrostatic damage to the semiconductor element can be prevented. In addition, in a configuration in which the spacer tape is a conductive tape, the TAB type package can be glued and the product tape can be used. Since there are only three parts, including the spacer table, it is possible to reduce costs, and since there are only two pieces of tape, it is easy to use, has good workability, and can improve productivity. [Example] An example of the present invention will be described below with reference to the drawings. Fig. 1 is a perspective view showing a TAB type package according to an embodiment of the present invention, No. 2rjA is a plan view showing a part of the product tape, Fig. 3 is a cross-sectional view, and Fig. 4 is a spacer tape. A plan view showing a part, Fig. 5 is a sectional view showing the spacer tape that also overlaps the product tape, and Fig. 6 is the same (
This is a schematic diagram showing the state of use of a TAB type package. As shown in Fig. 1, this TAB-shaped package consists of a reel 1, a product tape 2 wound around the reel 1, and a product tape 2 that overlaps the product tape 2 and reels the reel 1. It consists of a spacer tape 3 that is wound around. A mounting hole 4 having a rectangular cross section with slits at a pair of corners is provided in the center of the reel l, and can be fitted into the winding mechanism of various devices. As shown in FIG. 2, the product tape 2 includes, for example, a polyimide tape 5 having a width of 35 mm and a thickness of 125 μm;
It consists of a conductor pattern 7 formed on the main surface of this polyimide tape 5 and consisting of a plurality of leads 6. Further, this polyimide tape 5 is provided with rectangular chip corresponding holes 8 at regular intervals along its center. Each lead 6 of the conductive pattern 7 has a pattern such that its inner end projects into the chip corresponding hole 8. On the other hand, as shown in FIG. 3, a semiconductor element (chip) 9 is located within the chip corresponding hole 8. This chip 9 is connected to the lead 6 through a bump electrode 10 provided on its main surface.
is connected to the inner end of Further, the inner ends of the chip 9 and the leads 6 are protected by being covered with a coating layer l1 made of insulating resin. Therefore, it includes the polyamide tape 5 and the lead 6.
and portions of the chip 9 and the coating layer l1 form a single semiconductor device l2. The part surrounded by the two-dot chain line frame in FIG. 2 is the semiconductor device l2. Further, the polyimide tape 5 has subrocket holes l5 provided at regular intervals on both sides thereof. This subrocket hole 15 is used for winding and winding the product tape 2.
When released, it engages a sprocket wheel whose rotation is controlled. Therefore, the product tape 2 is moved by driving the sprocket wheel. On the other hand, the spacer tape 3 is a plate-shaped tape having subrocket holes 16 on both sides, as shown in FIG. This smooth tape 3 is, for example,
It is made of a conductive tape made by kneading carbon into acrylic resin and having a resistance value (surface specific resistance) of 10-6 Ωcm or less. The width of the spacer table 3 is approximately the same as the width of the product table 2, and the width of the spacer table 3 is approximately the same as that of the product table 2.
6 corresponds to the sprocket hole 15 of the crystal making table 2. Further, the spacer tape 3 is embossed, and protrusions 17 are provided at regular intervals on both sides. As a result, when the spacer tape 3 is stacked on the product tape 2, as shown in FIG.
The chip 9 and the coating layer 11 face a gap l8 formed between the product tape 2 and the spacer tape 3 due to embossing. When using the TAB type package 20, in which the product tape 2 and the spacer tape 3 are wrapped around the reel 1, as shown in FIG. The film is then wound onto the take-up reel 21. The product tape 2 unwound from the TAB package 20 is guided to a work area 23 by a plurality of main guide rolls 22. Although not specifically shown in this figure, for example, an outer border is provided in the work area 23, and the semiconductor device 12, which is a product of the product tape 2, is mounted on a desired wiring board or the like. Further, the spacer tab 3 is moved away from the working area 23 and detoured by the auxiliary guide roll 24. According to such an embodiment, the following effects can be obtained. (1) The TAB type package of the present invention has the effect that electrostatic damage is less likely to occur because the spacer tape that protects the semiconductor element is made of conductive tape. (2) The TAB type package of the present invention has a structure in which conductive tape is layered on the product tape to protect the semiconductor elements, but since the spacer tape is made of conductive tape, the number of tapes is limited. As before, there are only two tapes, and the effect is that the conventional tape unwinding and winding device can be used. (3) According to (2) above, the TA of the present invention
B-type packaging includes reel and product tape. Since there are only three spacer tapes and a small number of parts, it is possible to reduce costs, and since there are only two pieces of tape, it is easy to use and has good workability, which can improve productivity. You can get the effect. (4) (1) to (3) above
Therefore, according to the present invention, a synergistic effect can be obtained in that it is possible to provide a TAB type package that is difficult to cause electrostatic damage and is easy to use. Although the invention made by the present inventor has been specifically explained above based on Examples, it goes without saying that the present invention is not limited to the above Examples and can be modified in various ways without departing from the gist thereof. For example, in the above embodiment, the spacer tape 3 was made by kneading carbon to form a conductive tape, but a conductive substance other than carbon may be kneaded. Also, the 71st! As shown in FIG. 1, an antistatic agent 30 may be applied to the surface of the spacer tape 3 to form a conductive tape, and as shown in FIG. The conductive spacer tape 3 may be formed by pasting the . In addition,
In order to prevent electrostatic damage to the semiconductor device 12, in the case of the latter bonding tape, it is necessary to use the conductive tape 32 in contact with the semiconductor device 12. FIG. 9 shows a TAB-shaped package 20 according to another embodiment of the present invention. In this example, a spacer tape 3 as a conventional reinforcing material is arranged on one side of the product tape 2, and a conductive tape 33 is arranged on the other side of the product tape 2. The tape 33 is placed over the semiconductor device l2 to prevent electrostatic damage to the semiconductor device 12. The above explanation has mainly been about the case where the invention made by the present inventor is applied to the TAB type package technology, which is the field of application that forms the background of the invention, but the invention is not limited thereto. [Effects of the Invention] The effects obtained by typical inventions disclosed in this application are briefly explained below. Since the TAB type package of the present invention has a conductive tape overlaid on the product tape, it is possible to prevent electrostatic damage to semiconductor devices formed on the product tape.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing a TAB type package according to an embodiment of the present invention, FIG. 2 is a plan view showing a part of the product tape, FIG. A plan view showing a part of the package, FIG. 5 is a cross-sectional view showing the substrate tape overlapping the product tape, FIG. 6 is a schematic diagram showing the use of the same <TAB type package, and FIG. 7 is another embodiment of the present invention. FIG. 8 is a cross-sectional view showing a spacer tape in a TAB-type package according to another embodiment of the present invention; FIG. 9 is a cross-sectional view showing a spacer tape in a TAB-type package according to another embodiment of the present invention. T.A.
It is a sectional view showing a B-shaped package. ! ...Reel, 2...Product tape, 3...Spacer tape, 4...Mounting hole, 5...Polyimide tape, 6...Lead, 7...Conductor pattern, 8...・
Chip corresponding hole, 9... Chip, lO... Bump electrode, 1l... Coating layer, l2... Semiconductor device, 15.16... Sprocket hole, 17...
Projection, 18...Gap, 20...TAB type packaging body, 2
1... Take-up reel, 22... Main guide roll, 2
3... Working area, 24... Sub guide roll, 30...
・Antistatic agent, 3L...Insulating tape, 32.33・
...Conductive tape.

Claims (4)

[Claims] 1. A package comprising a reel and a flexible product tape wound around the reel and having a product formed on its surface, comprising a conductive tape overlaid on the product tape and wound around the reel. Characteristic packaging. 2. 2. The package according to claim 1, wherein the conductive tape constitutes a spacer tape that protects the product. 3. A reel, a flexible product tape wound on the reel and having a product formed on its surface, a spacer tape overlaid on one side of the product tape and wound around the reel, and a spacer tape overlaid on the other side of the product tape. and a conductive tape wound around the reel. 4. The product tape is made of an insulating tape, and
4. The package according to claim 1, wherein the package has a conductive pattern on at least one surface, and a semiconductor element is attached to a part of the conductive pattern.