JP3229786B2 - Tape carrier package and storage method thereof - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to high functionality, small size and light weight of electronic devices such as information communication devices and audiovisual devices, and liquid crystal display devices. The present invention relates to a widely used tape carrier package and a method for storing the tape carrier package. 2. Description of the Related Art Conventionally, for example, a driver IC of a liquid crystal display device has been commonly referred to as a TAB (Tape Automated Bonding).
r Package, sometimes abbreviated as “TCP”). As prior art,
For example, there is JP-A-63-106628. [0003] FIG. 10 shows that the applicant of the present invention is a Japanese Utility Model.
46 shows a configuration of a tape carrier package disclosed as No. 46. In a tape carrier package 1, a semiconductor chip 3 is bonded to a carrier tape 2 made of an electrically insulating resin film by wireless bonding, and is coated with a synthetic resin for protection. A conductor pattern 4 is provided to prevent the semiconductor chip 3 from being damaged by electrostatic discharge. The semiconductor chip 3 is mounted in a hole 5 formed in the carrier tape 2 in advance, and a lead conductor pattern 6 formed on the carrier tape 2 and a bump on the semiconductor chip are directly bonded. FIG. 11 shows a typical reel system as a method of storing the tape carrier package 1 as shown in FIG. The reel 7 is made of a synthetic resin formed by bonding two side plates and a fixing core. The side plate is formed by injection molding a relatively soft synthetic resin, and the core is formed by injection molding a relatively hard synthetic resin. In the reel type, the rectangular semiconductor chip 3 is mounted so that the short side of the semiconductor chip 3 is less than about 2.5 mm and is parallel to the long side of the carrier tape 2. Further, when the semiconductor chip 3 is arranged on the carrier tape 2 and wound around the reel 7, a polyester spacer 8 for impact and a conductive spacer 9 for preventing electrostatic destruction are simultaneously wound around the carrier tape 2. The wound reel 7 is stored in an antistatic bag, and further stored in a cardboard box for packing. FIG. 12 shows a method of storing a reel-type tape carrier package disclosed in JP-A-63-313187. The reel 10 has a wide core width, and the tape carrier package 11 has a wide carrier tape 12 at a portion where the semiconductor chip 13 is mounted. The output terminal 14 is provided in the wide portion.
As another prior art, Japanese Patent Publication No. 7-54813 discloses a concept in which a slit is provided in a carrier tape to facilitate bending and winding is performed. FIG. 13 shows a method of storing a tape carrier package by a tray method. Trays 16 and 17
The frame is formed of a conductive synthetic resin such as conductive polystyrene and has a plurality of frames corresponding to the shape of the tape carrier package. Cover the top tray 16
The tape carrier package is stored in the frame of the tray 17 at the lower stage. Such trays 17 are stacked in several stages, tied with rubber bands 18, covered entirely with an aluminum (Al) laminator 19, and sandwiched from above and below with a cardboard pad 20, stored in a packing case 21, and packed. [0007] In recent years, for example, a driver IC mounted on a tape carrier package 1 used as a driver of a liquid crystal display device has a tendency to increase the number of pins. In a multi-pin tape carrier package, since the area as a semiconductor chip becomes large, the short side direction of the driver IC is about 2.5 mm or more, and if it is arranged so as to coincide with the long side direction of the carrier tape, the reel type is used. When stored, there is a possibility that the resin around the driver IC is peeled off or the driver IC body is cracked. For this reason, a reel type tape carrier package cannot be adopted when a driver IC having a short side of about 2.5 mm or more is mounted. Further, in the tray system, the number that can be stored is reduced with respect to a tape carrier package having a driver IC whose short side direction is about 2.5 mm or more,
There is a problem that workability in the punching and crimping steps of the tape carrier package is deteriorated, and it takes time and effort to pack the tape carrier package. For example, FIG.
While packing trays 16 and 17 as shown in
When performing a series of operations of stacking the pieces 6 and 17, tying them with a rubber band 18, covering them with an Al laminator 19, and putting the cardboard pads 20 in the packing case 21,
If the height of the tape carrier 17 is increased, the number of tape carrier packages to be stored is reduced, and in terms of automation of the manufacturing process line, the inconvenience of removing the trays 16 and 17 one by one or dropping the trays 16 and 17 may occur. The workability is poor because the tape carrier package may be scattered. An object of the present invention is to prevent semiconductor chips from cracking or peeling of synthetic resin as in a reel system,
An object of the present invention is to provide a tape carrier package and a method of storing the tape carrier package, which can avoid a decrease in the number of storages as in the tray system and a reduction in workability in a tape carrier package punching and pressure bonding process. [0010] The present invention is a tape carrier package in which a semiconductor chip is mounted on a tape-shaped flexible substrate, wherein the length of the flexible substrate is determined by a predetermined length. And a plurality of semiconductor chips mounted on each of the easily bendable portions, and the easily bendable portions are mounted on a flexible substrate in an adjacent section when bent. The tape carrier package is characterized in that the positions of the tape carrier packages are set so as to be alternately shifted. According to the present invention, the tape carrier package is provided with easily bendable portions at predetermined lengths in the longitudinal direction of the flexible substrate, so that one or more semiconductor chips are mounted between the easily bendable portions. And can be easily bent and folded in a bellows shape. Since no external force is applied to the semiconductor chip and its vicinity at the time of bending, there is no risk of cracking of the semiconductor chip or peeling of the resin.
In addition, since a large number of semiconductor chips are mounted on a flexible substrate and can be folded in a bellows shape, workability in the punching and crimping steps as a tape carrier package can be kept good. Further, when the flexible substrate is bent at the easily bendable portion, the positions of the semiconductor chips mounted between the easily bendable positions are alternately shifted. Therefore, when the flexible substrate is bent, the positions of the semiconductor chips are shifted. Without overlapping, the other semiconductor chip is disposed in the gap between the one semiconductor chip, and the overall thickness can be reduced. [0011] The semiconductor chip of the present invention is generally rectangular, and is mounted so that its longitudinal direction forms an angle smaller than a right angle with respect to the longitudinal direction of the flexible substrate. According to the present invention, a semiconductor chip having a substantially rectangular shape is mounted so that its longitudinal direction forms an angle smaller than a right angle with respect to the longitudinal direction of the flexible substrate, for example, in parallel. The width of the flexible substrate can be reduced, and the cost of the carrier tape can be reduced. Since the tape carrier package is bent at an easy bending point,
Cracking of the semiconductor chip and peeling of the synthetic resin can be prevented. Further, according to the present invention, a longitudinal direction of a tape carrier package in which a semiconductor chip is mounted on a tape-shaped flexible substrate is alternately bent at intervals of a predetermined length and folded in a bellows shape. One or more semiconductor chips are stored in the storage case and each section of the bent flexible substrate is
A method for storing a tape carrier package, characterized in that the tape carrier package is mounted at a position where it is shifted alternately when adjacent sections are folded. According to the present invention, in a state where the semiconductor chip is mounted on the flexible substrate, the flexible substrate is alternately bent and folded in a bellows shape and stored in the storage case, so that a state in which many semiconductor chips are mounted Thus, the flexible substrate in a continuous state can be stored in a small size while being continuous. In each of the sections that are bent alternately, the position of the semiconductor chip is shifted, so that cracking of the semiconductor chip can be prevented. Since the flexible substrate is continuous, it is possible to store a tape carrier package in which many semiconductor chips are mounted in a small volume. Since semiconductor chips can be continuously supplied from the tape carrier package even during operations such as punching and pressure bonding of the tape carrier, workability can be easily improved. FIG. 1 shows a configuration of a tape carrier package according to an embodiment of the present invention. The tape carrier package 31 is made of a carrier tape 32 made of a heat-resistant flexible synthetic resin film such as polyimide.
The semiconductor chip 33 is directly bonded on the upper side without a bonding wire, and is mounted, for example, in parallel with the longitudinal direction of the carrier tape 32 so as to form an angle smaller than a right angle with the longitudinal direction. When the semiconductor chip 33 is mounted on the carrier tape 32 by the conductor pattern 34, electrostatic breakdown is prevented. The carrier tape 32 has an I that slightly exceeds the outer shape of the semiconductor chip 33.
A C-fixing resin portion 35 is provided to secure the mounting of the semiconductor chip 33. The bending holes 36 are punched out at regular intervals along the longitudinal direction of the carrier tape 32, and are easily bent. On both sides of the carrier tape 32 in the width direction, sprocket holes 37 are punched at a constant pitch along the longitudinal direction, thereby facilitating handling such as transport of the tape carrier package 31. FIG. 2 shows a method of storing the tape carrier package 31 according to the embodiment of FIG. The long carrier tape 32 is bent at a portion where the bending hole 36 is provided,
In a state where the section between the adjacent bending holes 36 is straightened, the whole can be folded in a bellows shape. The storage case 40 has a flat rectangular parallelepiped shape, and can efficiently store the folded tape carrier package 31. If conductive polypropylene is used as the material of the storage case 40, it is lightweight and easy to transport, so that portability is good. In a state where the tape carrier package 31 is bent, an excessive force is applied to the semiconductor chip 33,
The cushioning material 41 is provided so that the semiconductor chips 33 do not come into contact with each other and be damaged by mechanical shock. FIGS. 3 and 4 show the mounting state of the semiconductor chip 33 on the carrier tape 32 and the arrangement of the cushioning material 41. FIG. FIG. 3 shows a state in which a cushioning material 41 is provided on the bottom surface of the storage case 40 and a bent portion of the carrier tape 32. FIG. 4 is an enlarged view of a portion A in FIG. 33 shows the relationship between the height and the height. When the carrier tape 32 is bent, the pitch of the semiconductor chips 33 mounted on the opposing surface is shifted for each adjacent bending section. Thus, when folded in a bellows shape, the semiconductor chips 33 do not overlap with each other, and the other semiconductor chip 33 is disposed in the gap between the one semiconductor chip 33, so that the overall thickness can be reduced. Further, the bent portion 42 provided with the bending hole 36 is bent at two places in order to obtain a height corresponding to the thickness of the semiconductor chip 33. FIG. 5 shows the configuration of a carrier tape distortion preventer 43 for putting the tape carrier package 31 according to the embodiment of FIG. 1 into a production process. Since the tape carrier package 31 housed in the storage case 40 in a folded state has the carrier tape 32 in a continuous state, the semiconductor chip 33 is used while the tape 44 is stretched by the rollers 44 to eliminate distortion due to bending. In the manufacturing process. The roller 44 is provided with, for example, a projection that fits into a space between the sprocket holes 37 on both sides of the semiconductor chip 33, so that the semiconductor chip 33 is not directly subjected to stress while the carrier tape 3 is being pressed.
Stretch 2 to remove distortion. In order to facilitate the storage and removal of the folded tape carrier package 31 in the storage case 40, the distance between the upper, lower, left and right inner surfaces of the storage case 40 and the tape carrier package 31 is 1 m.
It is preferable to leave at least m. FIG. 6 shows a storage case 40 and its upper cover 4.
5 shows the shape of FIG. The storage case 40 uses conductive polypropylene as described above. More preferably, black plastic cardboard made of polypropylene coated with carbon is used. Further, the conductive sponge-shaped upper lid 45 is mounted in a state where the tape carrier package 31 is folded and stored. The upper lid 45 is also made black so that external light is blocked, and a driver IC for a liquid crystal display element is formed.
The photoelectric effect on the semiconductor chip 33 is prevented. FIG. 7 shows a configuration of a tape carrier package 51 according to another embodiment of the present invention. In the present embodiment, the semiconductor chip 33 is mounted in a state in which two rows of the embodiment of FIG. 1 are vertically arranged. FIG. 8 shows a state of storage in the storage case 60. As in the storage state of FIG. 2, the storage in the folded state can be performed efficiently using the cushioning material 41 as appropriate. FIG. 9 shows a state where the tape carrier package 51 is stored in the storage case 60. Storage case 60
The distance d between the inner peripheral surface of the tape carrier package 51 and the folded tape carrier package 51 is set to 1 mm or more so that storage and extraction can be performed smoothly. To prevent distortion when the carrier tape 32 is bent, a flexible and thermally low-expansion material such as polyimide or polyamide is used as a film material of the carrier tape 32. Further improvements can be achieved by using replaced materials. As described above, according to the present invention, a tape-shaped flexible substrate can be bent from an easy bending point and folded in a bellows shape, so that a semiconductor chip and its vicinity cannot be imposed. Productivity can be improved without applying force to cause cracking or resin peeling. Further, the position of the semiconductor chip mounted on the flexible substrate is adjusted so as to be alternately shifted when the flexible substrate is bent. Can be smaller. According to the present invention, the semiconductor chip having a substantially rectangular shape is mounted so that its longitudinal direction forms an angle smaller than a right angle from the longitudinal direction of the flexible substrate. The width can be reduced, and the cost can be reduced. Further, according to the present invention, since the flexible substrate is bent and folded in a bellows shape and stored in the storage case,
A large number of tape carrier packages can be handled stably for a long period of time in a connected state, so that productivity and storage efficiency can be improved. When the semiconductor chip is bent and folded, the positions of the semiconductor chips are alternately shifted in each of the adjacent sections, so that cracks and the like can be suppressed.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a plan view of a tape carrier package according to one embodiment of the present invention. FIG. 2 is a perspective view showing a state in which the tape carrier package according to the embodiment of FIG. 1 is folded and stored in a bellows shape. FIG. 3 is a simplified sectional view showing a state in which the tape carrier package according to the embodiment of FIG. 1 is folded and stored in a bellows shape. FIG. 4 is a partially enlarged view of FIG. 3; FIG. 5 is a simplified cross-sectional view schematically showing a configuration related to a tape carrier distortion preventing machine for stretching a folded tape carrier package and putting it into a production process. 6 is a perspective view of a storage case 40 for storing the tape carrier package according to the embodiment of FIG. 1 in a folded state and an upper lid 45 thereof. FIG. 7 is a plan view of a tape carrier package according to another embodiment of the present invention. 8 is a perspective view showing a state in which the tape carrier package according to the embodiment of FIG. 7 is folded and stored. 9 is a plan view showing a state where the tape carrier package according to the embodiment of FIG. 7 is stored in a storage case. FIG. 10 is a plan view of a conventional tape carrier package. FIG. 11 is a simplified perspective view showing a conventional tape carrier package stored in a reel system. FIG. 12 is a simplified perspective view showing another configuration of a conventional tape carrier package using a reel system. FIG. 13 is a perspective view showing a conventional storage state of a tape carrier package in a tray system. DESCRIPTION OF SYMBOLS 31, 51 Tape carrier package 32 Carrier tape 33 Semiconductor chip 34 Conductor pattern 35 IC fixing resin portion 36 Bending hole 40, 60 Storage case 41 Buffer material 42 Bending portion 43 Carrier tape distortion preventing device 44 Roller 45 Top cover

Claims (1)

(57) [Claims] [Claim 1] A tape carrier package in which a semiconductor chip is mounted on a tape-shaped flexible substrate, wherein the tape carrier package is bent at predetermined lengths in a longitudinal direction of the flexible substrate. An easy location is provided, and one or a plurality of semiconductor chips are mounted between each easily bendable location, and the easily bendable location is a position of the semiconductor chip mounted on the flexible substrate in an adjacent section when bent. Wherein the tape carrier package is set at a position where the tape carrier packages are alternately shifted. 2. The semiconductor chip according to claim 1, wherein the semiconductor chip has a substantially rectangular shape, and is mounted so that a longitudinal direction thereof is smaller than a right angle with respect to a longitudinal direction of the flexible substrate. Item 7. A tape carrier package according to Item 1. 3. A tape carrier package on which a semiconductor chip is mounted on a tape-shaped flexible substrate is alternately bent at intervals of a predetermined length, folded in a bellows shape, and stored in a storage case. A tape carrier package accommodating, wherein one or a plurality of semiconductor chips are mounted on each section of the bent flexible substrate so as to be alternately shifted when an adjacent section is folded. Method.