JPH1174316A - Tab tape spacer - Google Patents
Tab tape spacerInfo
- Publication number
- JPH1174316A JPH1174316A JP9234854A JP23485497A JPH1174316A JP H1174316 A JPH1174316 A JP H1174316A JP 9234854 A JP9234854 A JP 9234854A JP 23485497 A JP23485497 A JP 23485497A JP H1174316 A JPH1174316 A JP H1174316A
- Authority
- JP
- Japan
- Prior art keywords
- spacer
- tab tape
- face
- carbon black
- coating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、TABテープ用ス
ペーサに関し、特に、カーボンブラックを練り込んで静
電気の帯電防止を図ったTABテープ用スペーサに関す
る。The present invention relates to a TAB tape spacer, and more particularly to a TAB tape spacer in which carbon black is kneaded to prevent static electricity from being charged.
【0002】[0002]
【従来の技術】従来のTABテープ用スペーサとして、
例えば、実開平4−25237号公報に示されるものが
ある。このTABテープ用スペーサはリールにTABテ
ープ等の銅箔パターン付きフレキシブルテープを巻き取
るとき、それと重ね合わせて一緒に巻き取られることに
より、銅箔パターン付きフレキシブルテープのスペーサ
として機能するものであり、スペーサ機能を向上させる
ために両面にエンボス加工に基づく膨出部が形成されて
おり、かつ、静電気による帯電を防止するために表面に
静電防止処理が施されている。2. Description of the Related Art As a conventional TAB tape spacer,
For example, there is one disclosed in Japanese Utility Model Laid-Open No. 4-25237. When this TAB tape spacer is wound around a reel with a copper foil pattern-equipped flexible tape such as a TAB tape, the TAB tape spacer functions as a spacer of the copper foil pattern-equipped flexible tape by being wound together with the tape. A bulge based on embossing is formed on both sides to improve the spacer function, and an antistatic treatment is performed on the surface to prevent electrification due to static electricity.
【0003】図2および図3は従来の他のTABテープ
用スペーサ1を示し、PVCテープ3にカーボンブラッ
ク4を練り込んで構成され、両面の両エッヂに沿ってエ
ンボス加工に基づく膨出部2が所定の間隔で形成されて
いる。このTABテープ用スペーサ1は、図2では、有
限の長さで示されているが、リールに巻回されるのに十
分な長さを有し、スリット切断加工によってTABテー
プとほぼ等しい幅Wに切断される。FIGS. 2 and 3 show another conventional TAB tape spacer 1, which is formed by kneading carbon black 4 into a PVC tape 3 and which is formed by embossing along both edges on both sides. Are formed at predetermined intervals. Although the TAB tape spacer 1 is shown in FIG. 2 as having a finite length, it has a length sufficient to be wound on a reel, and has a width W substantially equal to that of the TAB tape by slit cutting. Is cut off.
【0004】このTABテープ用スペーサ1によると、
カーボンブラック4の練り込みによって導電性にされて
いるので、静電気によるゴミの付着を防止し、半導体チ
ップを搭載したTCP(Tape Carrier P
ackage)のスペーサとして使用されるときは、ゴ
ミの付着防止に加えて半導体チップの静電破壊を防止す
る。According to this TAB tape spacer 1,
Since the carbon black 4 is made conductive by kneading, dust is prevented from adhering due to static electricity, and a TCP (Tape Carrier P) mounted with a semiconductor chip is mounted.
When it is used as a spacer for the package, the semiconductor chip is prevented from being electrostatically damaged in addition to preventing dust from adhering.
【0005】[0005]
【発明が解決しようとする課題】しかし、従来のTAB
テープ用スペーサによると、PVCテープの端面がスリ
ットによって切断されているため、カーボンブラック4
が端面に露出し、導電性異物となって半導体チップ内に
入り込んだり、銅箔パターンの配線間をショートさせる
恐れがある。However, the conventional TAB
According to the tape spacer, since the end face of the PVC tape is cut by the slit, the carbon black 4
May be exposed on the end face, become conductive foreign substances, enter the semiconductor chip, or short-circuit between the wirings of the copper foil pattern.
【0006】従って、本発明の目的はカーボンブラック
の練り込みによって導電性にされていても端面からカー
ボンブラックを導電性異物として発生しないTABテー
プ用スペーサを提供することにある。Accordingly, an object of the present invention is to provide a TAB tape spacer which does not generate carbon black as a conductive foreign matter from the end face even if it is made conductive by kneading carbon black.
【0007】[0007]
【課題を解決するための手段】本発明は上記の目的を実
現するため、カーボンブラックを練り込んで導電性にさ
れたTABテープ用スペーサにおいて、端面に形成され
た所定の厚さのコーティング層を有することを特徴とす
るTABテープ用スペーサを提供する。According to the present invention, in order to achieve the above object, a TAB tape spacer made of carbon black kneaded and made conductive is provided with a coating layer having a predetermined thickness formed on an end face. A spacer for a TAB tape is provided.
【0008】[0008]
【発明の実施の形態】図1は本発明のTABテープ用ス
ペーサの実施の形態を示し、カーボンブラック4を練り
込んだPVCテープ3によってTABテープ用スペーサ
1が形成されており、端面5にPVCあるいはPET等
の絶縁物を吹き付けて10μm〜500μmの厚さにし
たコーティング層6が形成されている。TABテープ用
スペーサ1の両面の両エッヂに沿ってスペーサ緩衝機能
を向上するため,エンボス加工によって形成された膨出
部2が長さ方向に所定の間隔で形成されている。FIG. 1 shows a TAB tape spacer according to an embodiment of the present invention. A TAB tape spacer 1 is formed by a PVC tape 3 into which carbon black 4 has been kneaded. Alternatively, a coating layer 6 having a thickness of 10 μm to 500 μm is formed by spraying an insulator such as PET. In order to improve the spacer cushioning function along both edges of both sides of the TAB tape spacer 1, bulging portions 2 formed by embossing are formed at predetermined intervals in the length direction.
【0009】次に、以下の構成を有する本発明のTAB
テープ用スペーサを実施例として準備した。 (イ)幅:35mm (ロ)長さ:10m (ハ)コーティング層6の厚さ:100μmNext, the TAB of the present invention having the following structure
A tape spacer was prepared as an example. (A) Width: 35 mm (b) Length: 10 m (c) Thickness of the coating layer 6: 100 μm
【0010】また、コーティング層を有しないTABテ
ープ用スペーサを比較例として準備した。A TAB tape spacer having no coating layer was prepared as a comparative example.
【0011】実施例と比較例をプラスチックトレーに入
れ、周波数5Hz,振幅4〜6mmの正弦波の振動を与
えたところ、比較例は5分でカーボンブラックが導電性
異物として発生したが、実施例は60分経過しても導電
性異物の発生が見られなかった。コーティング層6の厚
さは、10μm以下では局部的にカーボンブラック4を
通す部分が発生し、また、500μm以上ではリール7
の巻回特性が低下する恐れがある。When the Example and the Comparative Example were placed in a plastic tray and subjected to a sine wave vibration having a frequency of 5 Hz and an amplitude of 4 to 6 mm, the Comparative Example produced carbon black as conductive foreign matter in 5 minutes. No generation of conductive foreign matter was observed even after 60 minutes. When the thickness of the coating layer 6 is 10 μm or less, a portion through which the carbon black 4 passes is generated locally.
May deteriorate the winding characteristics.
【0012】[0012]
【発明の効果】以上説明した通り、本発明のTABテー
プ用スペーサによると、端面にコーティング層を設けた
ため、端面よりカーボンブラックが導電性異物として発
生するのを抑えることができ、銅箔パターンの配線のシ
ョート、半導体チップ内への導電性異物の入り込み等を
防止することができる。As described above, according to the TAB tape spacer of the present invention, since the coating layer is provided on the end face, the generation of carbon black as conductive foreign matter from the end face can be suppressed, and the copper foil pattern can be prevented. It is possible to prevent short-circuiting of wiring, entry of conductive foreign matter into the semiconductor chip, and the like.
【図1】本発明のTABテープ用スペーサの実施の形態
を示す断面図。FIG. 1 is a sectional view showing an embodiment of a TAB tape spacer according to the present invention.
【図2】従来のTABテープ用スペーサを示す斜視図。FIG. 2 is a perspective view showing a conventional TAB tape spacer.
【図3】従来のTABテープ用スペーサを示す断面図。FIG. 3 is a sectional view showing a conventional TAB tape spacer.
1 TABテープ用スペーサ 2 膨出部 3 PVCテープ 4 カーボンブラック 5 端面 6 コーティング層 REFERENCE SIGNS LIST 1 spacer for TAB tape 2 bulge 3 PVC tape 4 carbon black 5 end face 6 coating layer
Claims (3)
されたTABテープ用スペーサにおいて、 端面に形成された所定の厚さのコーティング層を有する
ことを特徴とするTABテープ用スペーサ1. A TAB tape spacer, which is made conductive by kneading carbon black, comprising a coating layer having a predetermined thickness formed on an end face thereof.
等の絶縁物を前記端面に吹き付けて形成された構成の請
求項1記載のTABテープ用スペーサ。2. The coating layer is made of PVC or PET.
2. The TAB tape spacer according to claim 1, wherein said spacer is formed by spraying an insulator such as said material onto said end face.
0μmの厚さを有する構成の請求項1記載のTABテー
プ用スペーサ。3. The coating layer has a thickness of 10 μm to 50 μm.
The TAB tape spacer according to claim 1, wherein the spacer has a thickness of 0 µm.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9234854A JPH1174316A (en) | 1997-08-29 | 1997-08-29 | Tab tape spacer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9234854A JPH1174316A (en) | 1997-08-29 | 1997-08-29 | Tab tape spacer |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH1174316A true JPH1174316A (en) | 1999-03-16 |
Family
ID=16977399
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9234854A Pending JPH1174316A (en) | 1997-08-29 | 1997-08-29 | Tab tape spacer |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH1174316A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002076064A (en) * | 2000-08-31 | 2002-03-15 | Dainichi Kasei Kogyo Kk | Spacer tape for tab |
KR100775125B1 (en) | 2006-08-25 | 2007-11-08 | (주)케미닉스 | Antistatic spacer for automatated bonding tape |
KR100869392B1 (en) * | 2002-01-24 | 2008-11-21 | 골드코교 가부시기가이샤 | Spacer for use with tape automated bonding tab tape |
-
1997
- 1997-08-29 JP JP9234854A patent/JPH1174316A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002076064A (en) * | 2000-08-31 | 2002-03-15 | Dainichi Kasei Kogyo Kk | Spacer tape for tab |
JP4588181B2 (en) * | 2000-08-31 | 2010-11-24 | 株式会社アテクト | TAB spacer tape |
KR100869392B1 (en) * | 2002-01-24 | 2008-11-21 | 골드코교 가부시기가이샤 | Spacer for use with tape automated bonding tab tape |
KR100775125B1 (en) | 2006-08-25 | 2007-11-08 | (주)케미닉스 | Antistatic spacer for automatated bonding tape |
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