JPH0310529U - - Google Patents
Info
- Publication number
- JPH0310529U JPH0310529U JP7209189U JP7209189U JPH0310529U JP H0310529 U JPH0310529 U JP H0310529U JP 7209189 U JP7209189 U JP 7209189U JP 7209189 U JP7209189 U JP 7209189U JP H0310529 U JPH0310529 U JP H0310529U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor manufacturing
- manufacturing jig
- heat treatment
- core material
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 4
- 239000011162 core material Substances 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims 1
- 239000010453 quartz Substances 0.000 claims 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 claims 1
Description
第１は本考案の一実施例に係る半導体製造治具
の分解斜視図、第２図は第１図の−線に沿つ
た拡大断面図、第３図は他の実施例に係る半導体
製造治具の要部拡大断面図である。第４図は従来
の熱処理装置の縦断面図、第５図は従来のマザー
ボートの斜視図、第６図は第５図Ｊ−Ｊ線に沿つ
た拡大断面図である。
１……半導体ウエハ、１０……熱処理用ボート
（マザーボート）、１３……芯材、１４……カバ
ー。
1 is an exploded perspective view of a semiconductor manufacturing jig according to an embodiment of the present invention, FIG. 2 is an enlarged sectional view taken along the - line in FIG. 1, and FIG. 3 is an exploded perspective view of a semiconductor manufacturing jig according to another embodiment of the present invention. It is an enlarged cross-sectional view of the main part of the tool. FIG. 4 is a longitudinal sectional view of a conventional heat treatment apparatus, FIG. 5 is a perspective view of a conventional motherboard, and FIG. 6 is an enlarged sectional view taken along line J--J in FIG. 1... Semiconductor wafer, 10... Heat treatment boat (mother boat), 13... Core material, 14... Cover.
補正 平１．１０．１９
図面の簡単な説明を次のように補正する。
明細書第８頁第１６〜１７行目に「第１は本考
案の実施例に係る半導体製造治具の分解斜視図、
」とあるのを「第１図は本考案の一実施例に係る
半導体製造治具の分解斜視図、」と補正します。Amendment October 19, 1999 The brief description of the drawings is amended as follows. On page 8 of the specification, lines 16 and 17, it says, ``First is an exploded perspective view of a semiconductor manufacturing jig according to an embodiment of the present invention;
'' has been corrected to read ``Figure 1 is an exploded perspective view of a semiconductor manufacturing jig according to an embodiment of the present invention.''
Claims (1)
材をセラミツクで枠状に一体成形し、該芯材表面
に石英製のカバーを取着したことを特徴とする半
導体製造治具。[Scope of Claim for Utility Model Registration] A semiconductor manufacturing jig for heat treatment equipment, in which the core material of the heat treatment boat on which semiconductor wafers are mounted is integrally molded into a frame shape from ceramic, and the surface of the core material is made of quartz. A semiconductor manufacturing jig characterized by having a cover attached.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7209189U JPH0310529U (en) | 1989-06-20 | 1989-06-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7209189U JPH0310529U (en) | 1989-06-20 | 1989-06-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0310529U true JPH0310529U (en) | 1991-01-31 |
Family
ID=31609715
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7209189U Pending JPH0310529U (en) | 1989-06-20 | 1989-06-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0310529U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61202803U (en) * | 1985-06-10 | 1986-12-19 | ||
| JPS62192502U (en) * | 1986-05-29 | 1987-12-07 | ||
| JPS6419203U (en) * | 1987-07-24 | 1989-01-31 |
-
1989
- 1989-06-20 JP JP7209189U patent/JPH0310529U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61202803U (en) * | 1985-06-10 | 1986-12-19 | ||
| JPS62192502U (en) * | 1986-05-29 | 1987-12-07 | ||
| JPS6419203U (en) * | 1987-07-24 | 1989-01-31 | ||
| JPH0414802Y2 (en) * | 1987-07-24 | 1992-04-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0310529U (en) | ||
| JPS6349242U (en) | ||
| JPS6188233U (en) | ||
| JPH0193736U (en) | ||
| JPH01161334U (en) | ||
| JPH0366929U (en) | ||
| JPS6028991U (en) | Laser processing equipment | |
| JPS61112844U (en) | ||
| JPS59111040U (en) | Jig for semiconductor manufacturing | |
| JPS6333624U (en) | ||
| JPS59146941U (en) | Semiconductor cleaning jig | |
| JPS6444638U (en) | ||
| JPS6379646U (en) | ||
| JPH01154628U (en) | ||
| JPH0189741U (en) | ||
| JPH0377447U (en) | ||
| JPH0349U (en) | ||
| JPS632589U (en) | ||
| JPS6393632U (en) | ||
| JPS5991730U (en) | Semiconductor wafer processing boat | |
| JPS6280337U (en) | ||
| JPH0265342U (en) | ||
| JPH0483563U (en) | ||
| JPS6280338U (en) | ||
| JPS6312854U (en) |