JPS6280337U - - Google Patents
Info
- Publication number
- JPS6280337U JPS6280337U JP17219885U JP17219885U JPS6280337U JP S6280337 U JPS6280337 U JP S6280337U JP 17219885 U JP17219885 U JP 17219885U JP 17219885 U JP17219885 U JP 17219885U JP S6280337 U JPS6280337 U JP S6280337U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- heat treatment
- semiconductor wafer
- treatment jig
- quarter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- 235000012431 wafers Nutrition 0.000 claims 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 1
Description
第１図イは本考案の半導体ウエーハ熱処理用治
具の斜視図、ロは第１図イのＡ―Ａ′線を通る断
面図を、第２図イは従来の２点支持半導体ウエー
ハ熱処理用治具の断面図を、ロは第２図イのＢ―
Ｂ′線を通る断面の拡大図を、第３図は４点支持
半導体ウエーハ熱処理用治具の断面図を示す。
１，１′……支持棒、２……ウエーハ、３……
溝、４，４′……底部支持棒、５，５′……側部
支持棒、１１……樋状体、１２……溝、１３……
取手、Ｈ……高さ。
Figure 1A is a perspective view of the semiconductor wafer heat treatment jig of the present invention, B is a sectional view taken along the line A-A' in Figure 1A, and Figure 2A is a conventional two-point support semiconductor wafer heat treatment jig. The cross-sectional view of the jig is B- in Figure 2 A.
FIG. 3 shows an enlarged cross-sectional view taken along line B', and FIG. 3 shows a cross-sectional view of a four-point supported semiconductor wafer heat treatment jig. 1, 1'...Support rod, 2...Wafer, 3...
Groove, 4, 4'...Bottom support rod, 5, 5'...Side support rod, 11...Gutter-shaped body, 12...Groove, 13...
Handle, H...height.
Claims (1)
ーハを載置するための多数の溝を形成し、この溝
幅Ｗを式１．２５≦Ｗ≦２ｄ（ただしｄはウエー
ハの厚さ）で示される範囲とし、かつ溝の深さを
１〜２mmとしてなる半導体ウエーハ熱処理用治具
。 (2) 樋状体の内面円弧長が載置されるべきウエ
ーハ円周の４分の１ないし２分の１の範囲である
実用新案登録請求の範囲第１項記載の半導体ウエ
ーハ熱処理用治具。[Claims for Utility Model Registration] (1) A number of grooves for placing wafers are formed on the arcuate inner surface of the quartz glass gutter-like body, and the groove width W is defined by the formula 1.25≦W≦2d. (where d is the thickness of the wafer), and the groove depth is 1 to 2 mm. (2) The semiconductor wafer heat treatment jig according to claim 1, wherein the inner arc length of the trough-like body is in the range of one-quarter to one-half of the circumference of the wafer on which it is placed. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17219885U JPS6280337U (en) | 1985-11-08 | 1985-11-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17219885U JPS6280337U (en) | 1985-11-08 | 1985-11-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6280337U true JPS6280337U (en) | 1987-05-22 |
Family
ID=31108521
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17219885U Pending JPS6280337U (en) | 1985-11-08 | 1985-11-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6280337U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5720151B2 (en) * | 1974-03-25 | 1982-04-27 | ||
| JPS6045428B2 (en) * | 1977-02-23 | 1985-10-09 | 株式会社リコー | Copy paper feeding device of double-sided copying machine |
-
1985
- 1985-11-08 JP JP17219885U patent/JPS6280337U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5720151B2 (en) * | 1974-03-25 | 1982-04-27 | ||
| JPS6045428B2 (en) * | 1977-02-23 | 1985-10-09 | 株式会社リコー | Copy paper feeding device of double-sided copying machine |