JPH03104748U - - Google Patents
Info
- Publication number
- JPH03104748U JPH03104748U JP1990014163U JP1416390U JPH03104748U JP H03104748 U JPH03104748 U JP H03104748U JP 1990014163 U JP1990014163 U JP 1990014163U JP 1416390 U JP1416390 U JP 1416390U JP H03104748 U JPH03104748 U JP H03104748U
- Authority
- JP
- Japan
- Prior art keywords
- chips
- package
- composite
- secures
- cladding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990014163U JPH03104748U (enExample) | 1990-02-15 | 1990-02-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990014163U JPH03104748U (enExample) | 1990-02-15 | 1990-02-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03104748U true JPH03104748U (enExample) | 1991-10-30 |
Family
ID=31517540
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990014163U Pending JPH03104748U (enExample) | 1990-02-15 | 1990-02-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03104748U (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004273570A (ja) * | 2003-03-05 | 2004-09-30 | Sanyo Electric Co Ltd | 樹脂封止型半導体装置およびその製造方法 |
| JP2018018952A (ja) * | 2016-07-28 | 2018-02-01 | 三菱電機株式会社 | 半導体装置 |
-
1990
- 1990-02-15 JP JP1990014163U patent/JPH03104748U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004273570A (ja) * | 2003-03-05 | 2004-09-30 | Sanyo Electric Co Ltd | 樹脂封止型半導体装置およびその製造方法 |
| JP2018018952A (ja) * | 2016-07-28 | 2018-02-01 | 三菱電機株式会社 | 半導体装置 |