JPH02146450U - - Google Patents
Info
- Publication number
- JPH02146450U JPH02146450U JP1989055274U JP5527489U JPH02146450U JP H02146450 U JPH02146450 U JP H02146450U JP 1989055274 U JP1989055274 U JP 1989055274U JP 5527489 U JP5527489 U JP 5527489U JP H02146450 U JPH02146450 U JP H02146450U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- bonded
- central region
- heat spreader
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/07351—
-
- H10W72/30—
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989055274U JPH02146450U (enExample) | 1989-05-16 | 1989-05-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989055274U JPH02146450U (enExample) | 1989-05-16 | 1989-05-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02146450U true JPH02146450U (enExample) | 1990-12-12 |
Family
ID=31578077
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989055274U Pending JPH02146450U (enExample) | 1989-05-16 | 1989-05-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02146450U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018510499A (ja) * | 2015-02-05 | 2018-04-12 | トゥー‐シックス・インコーポレイテッド | ダイヤモンドと金属又は金属合金との交互パターンを有する複合基板 |
-
1989
- 1989-05-16 JP JP1989055274U patent/JPH02146450U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018510499A (ja) * | 2015-02-05 | 2018-04-12 | トゥー‐シックス・インコーポレイテッド | ダイヤモンドと金属又は金属合金との交互パターンを有する複合基板 |