JPH03104178A - Forming method of superconducting ceramics wiring - Google Patents
Forming method of superconducting ceramics wiringInfo
- Publication number
- JPH03104178A JPH03104178A JP1240719A JP24071989A JPH03104178A JP H03104178 A JPH03104178 A JP H03104178A JP 1240719 A JP1240719 A JP 1240719A JP 24071989 A JP24071989 A JP 24071989A JP H03104178 A JPH03104178 A JP H03104178A
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- superconducting ceramic
- pattern
- substrate
- superconducting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 37
- 238000000034 method Methods 0.000 title description 14
- 239000000758 substrate Substances 0.000 claims abstract description 14
- 239000002887 superconductor Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 abstract description 8
- 239000011347 resin Substances 0.000 abstract description 8
- 238000007650 screen-printing Methods 0.000 abstract description 4
- 238000005979 thermal decomposition reaction Methods 0.000 abstract description 2
- 230000008602 contraction Effects 0.000 abstract 1
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 4
- 238000010304 firing Methods 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 229940116411 terpineol Drugs 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000002441 X-ray diffraction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000002050 diffraction method Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000004570 mortar (masonry) Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔概 要〕
超伝導セラミックス配線の形成方法に関し、焼成時に超
伝導セラミックスペーストが収縮して断線をするのを防
止することを目的とし、超伝導セラミ・ノクスペースト
配線層を逆台形状の横断面に塗布して焼或するように構
成する。[Detailed Description of the Invention] [Summary] Regarding the method for forming superconducting ceramic wiring, the purpose is to prevent the superconducting ceramic paste from shrinking and breaking during firing. is applied to an inverted trapezoidal cross section and then baked.
本発明は超伝導セラミックス配線の形戒方法に係る。す
なわち本発明は液体窒素温度近傍で電気抵抗が零となる
超伝導セラミックスを用いた配線材料に係るものである
。コンピュータの高速化の要求に伴い、配線の高密度化
が要求されている。The present invention relates to a method for forming superconducting ceramic wiring. That is, the present invention relates to a wiring material using superconducting ceramics whose electrical resistance becomes zero near liquid nitrogen temperature. With the demand for higher speed computers, there is a demand for higher density wiring.
このため、従来の金属を用いた配線に代わって、超伝導
体を用いることが考えられる。For this reason, it is conceivable to use superconductors instead of conventional metal interconnects.
［従来の技術］
超伝導セラミックスを用い、回路配線を形成する方法と
しては、超伝導セラミックスを粉末とし、有機バインダ
と溶剤を加えてペースト状にし、スクリーン印刷法で基
板上にパターンを形成する方法がある。[Prior art] A method for forming circuit wiring using superconducting ceramics is to powder the superconducting ceramics, add an organic binder and a solvent to form a paste, and then form a pattern on a substrate using screen printing. There is.
この方法は、簡単で量産性に優れているため、いろいろ
な方面で使われている。This method is easy and suitable for mass production, so it is used in various fields.
スクリーン印刷法は簡単で量産性に優れているが、超伝
導セラξツクスペーストを単に印刷し、焼成するだけで
は配線が分断される。これは、ペースト１２を印刷した
際、配線の端部が第７図に示すように拡がり、焼戒時に
は得られる超伝導体は面方向５％、厚さ方向４０％ほど
も収縮するが、超伝導パターンの上部に比べて下部が基
板との接触により収縮が妨げられるため、いうなればあ
たかも上部だけが収縮するような形になり、第２図（イ
）の如く、変形し、分断が起きるのが原因である。The screen printing method is simple and has excellent mass productivity, but if the superconducting ceramic paste is simply printed and fired, the wiring will be separated. This is because when the paste 12 is printed, the ends of the wiring expand as shown in Figure 7, and when the superconductor is burned, the resulting superconductor shrinks by about 5% in the plane direction and 40% in the thickness direction. Compared to the upper part of the conductive pattern, the lower part is prevented from contracting due to contact with the substrate, so it becomes as if only the upper part is contracting, causing deformation and separation as shown in Figure 2 (a). Responsible.
そこで、本発明は、ペースト印刷法で超伝導セラミック
ス配線を形成し、かつ焼或時の配線の分断を防ぐことを
目的とする。Therefore, an object of the present invention is to form a superconducting ceramic wiring by a paste printing method and to prevent the wiring from breaking during firing.
本発明は、上記目的を達戒するために、基板上に超伝導
セラミックスペースト配線層を塗布し、焼成して超伝導
セラミックス配線を形成する方法において、上記超伝導
セラミックスペースト配線層を横断面が逆台形状に塗布
することを特徴とする超伝導セラミックス配線の形成方
法を提供する。In order to achieve the above object, the present invention provides a method for forming superconducting ceramic wiring by applying a superconducting ceramic paste wiring layer on a substrate and firing the superconducting ceramic wiring layer. A method for forming superconducting ceramic wiring is provided, which is characterized by coating in an inverted trapezoidal shape.
基板上に超伝導セラ旦ツタスペースト層を横断面が逆台
形状になるように塗布する方法としては、基板上に予め
熱分解性に優れた樹脂で逆台形状の溝を形戒し、この溝
に超伝導セラミックスペーストを印刷する方法が望まし
い。この方法によれば、逆台形状の塗布が容易であり、
かつその後の焼成時に熱分解性樹脂も消失するからであ
る。このような熱分解性樹脂としてはＰＭＭＡ、アクリ
ル樹脂、ポリビニルブチラール、エチルセルロースなど
を用いることができる。The method of applying the superconducting Ceramic paste layer on the substrate so that the cross section is inverted trapezoidal is to form grooves in the shape of an inverted trapezoid on the substrate in advance with a resin having excellent thermal decomposition properties. A method of printing superconducting ceramic paste in these grooves is desirable. According to this method, it is easy to apply an inverted trapezoidal shape,
Moreover, the thermally decomposable resin also disappears during the subsequent firing. As such a thermally decomposable resin, PMMA, acrylic resin, polyvinyl butyral, ethyl cellulose, etc. can be used.
超伝導セラミックスペースト層の逆台形の形状は、超伝
導セラξツクスペーストの種類、配線の幅や厚さに応じ
て決められるが、実施例にも示されるようにかなりの内
側角度（ｌ３５゜以上）を持つことが望ましい。The shape of the inverted trapezoid of the superconducting ceramic paste layer is determined depending on the type of superconducting ceramic paste and the width and thickness of the wiring. ) is desirable.
超伝導セラミックスとしてはＹ−Ｂａ −ＣｕＯ系のほ
かＢｉ −Ｓｒ −Ｃａ−Ｃｕ−○系なども用いること
ができる。超伝導セラミンクスペーストの組或は慣用の
ものでよい。As superconducting ceramics, in addition to Y--Ba--CuO-based materials, Bi--Sr--Ca--Cu-- and the like can be used. It may be a superconducting ceramic paste or a conventional one.
？作 用］
上述のような配線形状にすれば、下部（基板■と接触す
る部分）に比べて上部の幅が広いため、下部が焼戒時に
基板との接触のため収縮が妨げられても、配線が分断さ
れることが無い。? Effect] If the wiring shape is made as described above, the width of the upper part is wider than the lower part (the part that contacts the board ■), so even if the lower part is prevented from shrinking due to contact with the board during the burning command, Wiring will not be separated.
（実施例〕 図面を参照して説明する。(Example〕 This will be explained with reference to the drawings.
粒子径１１ＭｌのＹ２０３ １ ｍｏ１． ＢａＣＯｘ
２ ｍｏｌおよびＣｕ０３ｍｏｌになるように調合し
、ボールミルで４８ｈ混合したものを原料粉末とした。1 mo1 of Y203 with a particle size of 11 Ml. BaCOx
2 mol of Cu0 and 3 mol of Cu0 were mixed in a ball mill for 48 hours to obtain a raw material powder.
この原料粉末１００ｇ ， ＰＭＭＡ （アクリル樹脂
）５ｇ１テルピネオール２０ｇ、さらにメチルエチルケ
トン２０ｇを加えてボールミルで７２ｈ混合した。この
後、メノウ乳鉢のらいかい機でメチルエチルケトンを飛
散させた後、さらに、三本ロールミルで混練した。これ
により、超伝導セラミックスペーストを作製した。100 g of this raw material powder, 5 g of PMMA (acrylic resin), 20 g of terpineol, and 20 g of methyl ethyl ketone were added and mixed in a ball mill for 72 hours. Thereafter, methyl ethyl ketone was scattered in an agate mortar mill, and then kneaded in a three-roll mill. In this way, a superconducting ceramic paste was produced.
高純度アルミナ基板（ＰＧＡ基板）１上にポリビニルプ
チラール樹脂（ＰＶＢ）をテルピネオールに溶かしたペ
ースト（メチルエチルケトンに溶解した後テルピ不オー
ルで置換したもの）を用いて第１図（ア）に示したよう
に、スクリーン印刷２．３４を繰り返して階段上とし、
逆台形型の樹脂パターン５を形成した。このパターン５
に、先に作製した超伝導セラミックスペーストをスクリ
ーン印刷し、第１図（イ）のような配線６を得た。この
パターンは厚さ４０ハ、底部の幅ｌ００Ｉｍ、頂部の幅
５００ハである。A paste of polyvinyl butyral resin (PVB) dissolved in terpineol (dissolved in methyl ethyl ketone and then substituted with terpineol) was used on a high-purity alumina substrate (PGA substrate) 1 as shown in Figure 1 (a). Repeat screen printing 2.34 to print on the stairs,
An inverted trapezoidal resin pattern 5 was formed. This pattern 5
Then, the previously produced superconducting ceramic paste was screen printed to obtain the wiring 6 as shown in FIG. 1(a). This pattern has a thickness of 40 mm, a width of 100 mm at the bottom, and a width of 500 mm at the top.
これを大気中１２０゜Ｃで１０ｍｉｎ乾燥し、大気中５
００゜Ｃで樹脂パターンを飛散させた後、１０１０゜Ｃ
，Ｉｍｉｎで焼成し、炉冷した。これにより、超伝導体
のパターンを形成した。This was dried in the air at 120°C for 10 min.
After scattering the resin pattern at 00°C, it was heated to 1010°C.
, Imin and cooled in the furnace. This formed a superconductor pattern.
得られた超伝導セラミックス配線７は第２図（ア）に示
す如く分断のないキレイなパターンであった。The obtained superconducting ceramic wiring 7 had a clean pattern with no divisions as shown in FIG. 2(A).
このパターンを四端子法で温度一抵抗の関係を測定した
。結果を第３図に示す。臨界温度（Ｔｃ）は７７Ｋであ
る。The relationship between temperature and resistance of this pattern was measured using the four-terminal method. The results are shown in Figure 3. The critical temperature (Tc) is 77K.
さらに、このパターンについてＸ線回折を行なった。結
果を第５図に示す。同図中、Ａはアルミニウムのピーク
を示す。超伝導体セラミックスパターン中に、アルミナ
基板からのＡｅの拡散が少ない（パターン頂部にＡｆｆ
相が少ない）ことがわかる（比較例の第６図と対照）。Furthermore, this pattern was subjected to X-ray diffraction. The results are shown in Figure 5. In the figure, A indicates the peak of aluminum. In the superconductor ceramic pattern, there is little Ae diffusion from the alumina substrate (Aff at the top of the pattern).
(Contrast with FIG. 6 of the comparative example).
これがＴｃの向上に寄与しているものと考えられる。It is thought that this contributes to the improvement of Tc.
比較のために、常法に従い、上部と同し超伝導セラミッ
クスペースト配線パターンを基板上にスクリーン印刷し
た。パターンの幅は３００ハ、厚さは４０ｔＩｍである
。その結果、第７図に示す如く下部が末広りのパターン
になった。For comparison, the same superconducting ceramic paste wiring pattern as above was screen printed on the substrate according to a conventional method. The width of the pattern is 300 mm and the thickness is 40 tIm. As a result, as shown in FIG. 7, a pattern was formed in which the lower part widened at the end.
このパターンを実施例と同じ条件で焼或した。This pattern was fired under the same conditions as in the example.
得られた超伝導セラミックス配線パターン７は第２図（
イ）に示す如く、分断されたパターンであった。The obtained superconducting ceramic wiring pattern 7 is shown in Figure 2 (
As shown in b), it was a divided pattern.
このパターンについても温度一抵抗の関係の測定及びＸ
線回折分析を行なった。結果を第４図及び第６図に示す
。臨界温度（Ｔｃ）は５５Ｋであり、実施例よりかなり
低い。また、超伝導セラミックス中にＡｌの拡散が多い
ことが認められる。Regarding this pattern as well, we measured the temperature-resistance relationship and
Linear diffraction analysis was performed. The results are shown in FIGS. 4 and 6. The critical temperature (Tc) is 55K, which is considerably lower than the example. Furthermore, it is recognized that there is a large amount of Al diffused into the superconducting ceramic.
本発明によれば、簡単で量産性の高いペースト印刷法を
用いて超伝導セラミックス配線を形威し、配線の分断が
なく、しかも臨界温度を向上させることができる効果が
ある。According to the present invention, a superconducting ceramic wiring is formed using a paste printing method that is simple and highly suitable for mass production, and there is no disconnection of the wiring, and the critical temperature can be improved.
第１図（ア）（イ）は本発明の実施例の工程を示す図、
第２図（ア）（イ）は実施例及び比較例で得られた超伝
導セラミックス配線パターンの様子を示す図、第３図及
び第４図は実施例及び比較例の超伝導配線の温度一抵抗
の関係を示す図、第５図及び第６図は実施例及び比較例
のＸ線回折チャート、第７図は従来の配線ペースト印刷
の模式断面図である。
１・・・基板、 ２〜４・・・樹脂層、５・・
・逆台形溝、
６・・・超伝導セラミックスペーストパターン、７・・
・超伝導セラミックス配線、
１１・・・基板、
１２・・・超伝導セラミックスペースト。
（ア）
（ア）
６
第１図
第２図
温度
第
３
図
Ａ：アルミナのピーク
Ｓ：超伝導体のピーク
２ｅ （’ ）
実施例
タざFIGS. 1(A) and 1(B) are diagrams showing the steps of an embodiment of the present invention,
Figures 2 (A) and (B) are diagrams showing the appearance of superconducting ceramic wiring patterns obtained in Examples and Comparative Examples, and Figures 3 and 4 are diagrams showing temperature variations of superconducting wiring patterns in Examples and Comparative Examples. 5 and 6 are X-ray diffraction charts of Examples and Comparative Examples, and FIG. 7 is a schematic cross-sectional view of conventional wiring paste printing. DESCRIPTION OF SYMBOLS 1...Substrate, 2-4...Resin layer, 5...
・Inverted trapezoidal groove, 6... Superconducting ceramic paste pattern, 7...
・Superconducting ceramic wiring, 11...Substrate, 12...Superconducting ceramic paste. (A) (A) 6 Figure 1 Figure 2 Temperature 3 Figure A: Alumina peak S: Superconductor peak 2e (') Example tag
Claims (1)
布し、焼成して超伝導セラミックス配線を形成するに当
り、上記超伝導セラミックスペースト配線層を横断面が
逆台形状に塗布することを特徴とする超伝導セラミック
ス配線の形成方法。1. A superconductor characterized in that when a superconducting ceramic paste wiring layer is applied on a substrate and fired to form a superconducting ceramic wiring, the superconducting ceramic paste wiring layer is applied with a cross section having an inverted trapezoidal shape. How to form ceramic wiring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1240719A JP2737301B2 (en) | 1989-09-19 | 1989-09-19 | Method of forming superconducting ceramic wiring |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1240719A JP2737301B2 (en) | 1989-09-19 | 1989-09-19 | Method of forming superconducting ceramic wiring |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03104178A true JPH03104178A (en) | 1991-05-01 |
| JP2737301B2 JP2737301B2 (en) | 1998-04-08 |
Family
ID=17063685
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1240719A Expired - Fee Related JP2737301B2 (en) | 1989-09-19 | 1989-09-19 | Method of forming superconducting ceramic wiring |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2737301B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007103913A (en) * | 2005-09-08 | 2007-04-19 | Ricoh Co Ltd | Organic transistor active substrate, method of manufacturing the same, and electrophoretic display using the same |
-
1989
- 1989-09-19 JP JP1240719A patent/JP2737301B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007103913A (en) * | 2005-09-08 | 2007-04-19 | Ricoh Co Ltd | Organic transistor active substrate, method of manufacturing the same, and electrophoretic display using the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2737301B2 (en) | 1998-04-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |