JP2737301B2 - Method of forming superconducting ceramic wiring - Google Patents
Method of forming superconducting ceramic wiringInfo
- Publication number
- JP2737301B2 JP2737301B2 JP1240719A JP24071989A JP2737301B2 JP 2737301 B2 JP2737301 B2 JP 2737301B2 JP 1240719 A JP1240719 A JP 1240719A JP 24071989 A JP24071989 A JP 24071989A JP 2737301 B2 JP2737301 B2 JP 2737301B2
- Authority
- JP
- Japan
- Prior art keywords
- superconducting ceramic
- wiring
- pattern
- superconducting
- paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Description
【発明の詳細な説明】 〔概 要〕 超伝導セラミックス配線の形成方法に関し、 焼成時に超伝導セラミックスペーストが収縮して断線
をするのを防止することを目的とし、 超伝導セラミックスペースト配線層を逆台形状の横断
面に塗布して焼成するように構成する。DETAILED DESCRIPTION OF THE INVENTION [Summary] The present invention relates to a method of forming a superconducting ceramic wiring, in order to prevent the superconducting ceramic paste from shrinking and breaking during firing. It is configured to be applied to a trapezoidal cross section and fired.
本発明は超伝導セラミックス配線の形成方法に係る。
すなわち本発明は液体窒素温度近傍で電気抵抗が零とな
る超伝導セラミックスを用いた配線材料に係るものであ
る。コンピュータの高速化の要求に伴い、配線の高密度
化が要求されている。このため、従来の金属を用いた配
線に代わって、超伝導体を用いることが考えられる。The present invention relates to a method for forming a superconducting ceramic wiring.
That is, the present invention relates to a wiring material using superconducting ceramics whose electric resistance becomes zero near the temperature of liquid nitrogen. With the demand for faster computers, higher density wiring is required. Therefore, it is conceivable to use a superconductor instead of the conventional wiring using a metal.
超伝導セラミックスを用い、回路配線を形成する方法
としては、超伝導セラミックスを粉末とし、有機バイン
ダと溶剤を加えてペースト状にし、スクリーン印刷法で
基板上にパターンを形成する方法がある。As a method of forming circuit wiring using superconducting ceramics, there is a method in which superconducting ceramics is powdered, an organic binder and a solvent are added to form a paste, and a pattern is formed on a substrate by screen printing.
この方法は、簡単で量産性に優れているため、いろい
ろな方面で使われている。This method is used in various fields because of its simplicity and excellent mass productivity.
スクリーン印刷法は簡単で量産性に優れているが、超
伝導セラミックスペーストを単に印刷し、焼成するだけ
では配線が分断される。これは、ペースト12を印刷した
際、配線の端部が第７図に示すように拡がり、焼成時に
は得られる超伝導体は面方向５％、厚さ方向40％ほども
収縮するが、超伝導パターンの上部に比べて下部が基板
との接触により収縮が妨げられるため、いうなればあた
かも上部だけが収縮するような形になり、第２図（イ）
の如く、変形し、分断が起きるのが原因である。The screen printing method is simple and excellent in mass productivity, but simply printing and firing a superconducting ceramic paste can cut the wiring. This is because when the paste 12 is printed, the ends of the wirings expand as shown in FIG. 7, and the resulting superconductor shrinks by about 5% in the plane direction and 40% in the thickness direction during firing. Since the lower part is prevented from contracting by contact with the substrate as compared with the upper part of the pattern, it is as if only the upper part contracts.
It is caused by deformation and fragmentation.
そこで、本発明は、ペースト印刷法で超伝導セラミッ
クス配線を形成し、かつ焼成時の配線の分断を防ぐこと
を目的とする。Therefore, an object of the present invention is to form a superconducting ceramic wiring by a paste printing method and to prevent the wiring from being disconnected during firing.
本発明は、上記目的を達成するために、基板上に超伝
導セラミックスペースト配線層を塗布し、焼成して超伝
導セラミックス配線を形成する方法において、上記超伝
導セラミックスペースト配線層を横断面が逆台形状に塗
布することを特徴とする超伝導セラミックス配線の形成
方法を提供する。In order to achieve the above object, the present invention provides a method for forming a superconducting ceramic wiring by applying a superconducting ceramic paste wiring layer on a substrate and firing the superconducting ceramic paste wiring layer. Provided is a method for forming a superconducting ceramic wiring, which is characterized by being applied in a trapezoidal shape.
基板上に超伝導セラミックスペースト層を横断面が逆
台形状になるように塗布する方法としては、基板上に予
め熱分解性に優れた樹脂で逆台形状の溝を形成し、この
溝に超伝導セラミックスペーストを印刷する方法が望ま
しい。この方法によれば、逆台形状の塗布が容易であ
り、かつその後の焼成時に熱分解性樹脂も消失するから
である。このような熱分解性樹脂としてはPMMA、アクリ
ル樹脂、ポリビニルブチラール、エチルセルロースなど
を用いることができる。As a method of applying a superconducting ceramic paste layer on a substrate so that the cross section becomes an inverted trapezoidal shape, an inverted trapezoidal groove is previously formed on the substrate with a resin having excellent thermal decomposability, and the A method of printing a conductive ceramic paste is desirable. This is because according to this method, the application of the inverted trapezoidal shape is easy, and the thermally decomposable resin is also lost during the subsequent baking. As such a thermally decomposable resin, PMMA, acrylic resin, polyvinyl butyral, ethyl cellulose, and the like can be used.
超伝導セラミックスペースト層の逆台形の形状は、超
伝導セラミックスペーストの種類、配線の幅や厚さに応
じて決められるが、実施例にも示されるようにかなりの
内側角度（135゜以上）を持つことが望ましい。The inverted trapezoidal shape of the superconducting ceramic paste layer is determined according to the type of superconducting ceramic paste and the width and thickness of the wiring, but as shown in the examples, a considerable inner angle (135 ° or more) is required. It is desirable to have.
超伝導セラミックスとしてはＹ−Ba−Cu−Ｏ系のほか
Bi−Sr−Ca−Cu−Ｏ系なども用いることができる。超伝
導セラミックスペーストの組成は慣用のものでよい。Superconducting ceramics other than Y-Ba-Cu-O
A Bi-Sr-Ca-Cu-O system or the like can also be used. The composition of the superconducting ceramic paste may be a conventional one.
上述のような配線形状にすれば、下部（基板と接触す
る部分）に比べて上部の幅が広いため、下部が焼成時に
基板との接触のため収縮が妨げられても、配線が分断さ
れることが無い。With the above-described wiring shape, the width of the upper portion is wider than that of the lower portion (the portion in contact with the substrate). Therefore, even if the lower portion is prevented from contracting due to contact with the substrate during firing, the wiring is divided. There is nothing.
図面を参照して説明する。 This will be described with reference to the drawings.
粒子径１μｍのY2O31mol,BaCO32molおよびCuO3molに
なるように調合し、ボールミルで48h混合したものを原
料粉末とした。この原料粉末100g、PMMA（アクリル樹
脂）5g、テルピネオール20g、さらにメチルエチルケト
ン20gを加えてボールミルで72h混合した。この後、メノ
ウ乳鉢のらいかい機でメチルエチルケトンを飛散させた
後、さらに、三本ロールミルで混練した。これにより、
超伝導セラミックスペーストを作製した。Y 2 O 3 1 mol of particle size 1 [mu] m, were blended so that the BaCO 3 2 mol and CuO3mol, a material obtained by 48h mixed in a ball mill was used as a raw material powder. 100 g of this raw material powder, 5 g of PMMA (acrylic resin), 20 g of terpineol, and 20 g of methyl ethyl ketone were added and mixed by a ball mill for 72 hours. Thereafter, methyl ethyl ketone was scattered by a grinder in an agate mortar and then kneaded with a three-roll mill. This allows
A superconducting ceramic paste was prepared.
高純度アルミナ基板（FGA基板）１上にポリビニルブ
チラール樹脂（PVB）をテルピオネールに溶かしたペー
スト（メチルエチルケトンに溶解した後テルピネオール
で置換したもの）を用いて第１図（ア）に示したよう
に、スクリーン印刷2,3,4を繰り返して階段状とし、逆
台形型の樹脂パターン５を形成した。このパターン５
に、先に作製した超伝導セラミックスペーストをスクリ
ーン印刷し、第１図（イ）のような配線６を得た。この
パターンは厚さ40μｍ、底部の幅100μｍ、頂部の幅500
μｍである。As shown in FIG. 1 (a), a paste in which polyvinyl butyral resin (PVB) was dissolved in terpionel (dissolved in methyl ethyl ketone and replaced with terpineol) on a high-purity alumina substrate (FGA substrate) 1 was used. Then, screen printing 2, 3, and 4 were repeated to form a stepped shape, and an inverted trapezoidal resin pattern 5 was formed. This pattern 5
Then, the superconducting ceramic paste prepared above was screen-printed to obtain the wiring 6 as shown in FIG. This pattern has a thickness of 40 μm, a bottom width of 100 μm, and a top width of 500 μm.
μm.
これを大気中120℃で10min乾燥し、大気中500℃で樹
脂パターンを飛散させた後、1010℃,1minで焼成し、炉
冷した。これにより、超伝導体のパターンを形成した。This was dried in the air at 120 ° C. for 10 minutes, and after the resin pattern was scattered in the air at 500 ° C., it was fired at 1010 ° C. for 1 minute and cooled in a furnace. Thus, a superconductor pattern was formed.
得られた超伝導セラミックス配線７は第２図（ア）に
示す如く分断のないキレイなパターンであった。The obtained superconducting ceramic wiring 7 had a beautiful pattern without division as shown in FIG.
このパターンを四端子法で温度−抵抗の関係を測定し
た。結果を第３図に示す。臨界温度（Tc）は77Kであ
る。The temperature-resistance relationship of this pattern was measured by a four-terminal method. The results are shown in FIG. The critical temperature (Tc) is 77K.
さらに、このパターンについてＸ線回折を行なった。
結果を第５図に示す。同図中、Ａはアルミニウムのピー
クを示す。超伝導体セラミックスパターン中に、アルミ
ナ基板からのAlの拡散が少ない（パターン頂部にAl相が
少ない）ことがわかる（比較例の第６図と対称）。これ
がTcの向上に寄与しているものと考えられる。Further, X-ray diffraction was performed on this pattern.
The results are shown in FIG. In the figure, A indicates the peak of aluminum. It can be seen that the diffusion of Al from the alumina substrate is small in the superconductor ceramic pattern (the Al phase is small at the top of the pattern) (symmetric with FIG. 6 of the comparative example). This is considered to contribute to the improvement of Tc.
比較のために、常法に従い、上部と同じ超伝導セラミ
ックスペースト配線パターンを基板上にスクリーン印刷
した。パターンの幅は300μｍ、厚さは40μｍである。
その結果、第７図に示す如く下部が末広りのパターンに
なった。For comparison, the same superconducting ceramic paste wiring pattern as that on the upper portion was screen-printed on the substrate according to a conventional method. The pattern has a width of 300 μm and a thickness of 40 μm.
As a result, the lower portion became a divergent pattern as shown in FIG.
このパターンを実施例と同じ条件で焼成した。得られ
た超伝導セラミックス配線パターン７は第２図（イ）に
示す如く、分断されたパターンであった。This pattern was fired under the same conditions as in the example. The obtained superconducting ceramic wiring pattern 7 was a divided pattern as shown in FIG.
このパターンについても温度−抵抗の関係の測定及び
Ｘ線回折分析を行なった。結果を第４図及び第６図に示
す。臨界温度（Tc）は55Kであり、実施例よりかなり低
い。また、超伝導セラミックス中にAlの拡散が多いこと
が認められる。This pattern was also subjected to measurement of the temperature-resistance relationship and X-ray diffraction analysis. The results are shown in FIGS. 4 and 6. The critical temperature (Tc) is 55K, which is considerably lower than in the example. In addition, it is recognized that there is much diffusion of Al in the superconducting ceramics.
本発明によれば、簡単で量産性の高いペースト印刷法
を用いて超伝導セラミックス配線を形成し、配線の分断
がなく、しかも臨界温度を向上させることができる効果
がある。ADVANTAGE OF THE INVENTION According to this invention, the superconducting ceramic wiring is formed using the paste printing method which is simple and has high productivity, and there is an effect that the wiring is not divided and the critical temperature can be improved.
第１図（ア）（イ）は本発明の実施例の工程を示す図、
第２図（ア）（イ）は実施例及び比較例で得られた超伝
導セラミックス配線パターンの様子を示す図、第３図及
び第４図は実施例及び比較例の超伝導配線の温度−抵抗
の関係を示す図、第５図及び第６図は実施例及び比較例
のＸ線回折チャート、第７図は従来の配線ペースト印刷
の模式断面図である。 １……基板、２〜４……樹脂層、 ５……逆台形溝、 ６……超伝導セラミックスペーストパターン、 ７……超伝導セラミックス配線、 11……基板、 12……超伝導セラミックスペースト。FIGS. 1 (a) and 1 (a) are diagrams showing steps of an embodiment of the present invention.
2 (a) and 2 (a) are diagrams showing the state of the superconducting ceramic wiring pattern obtained in the example and the comparative example, and FIGS. 3 and 4 are diagrams showing the temperature of the superconducting wiring in the example and the comparative example. FIGS. 5 and 6 are X-ray diffraction charts of an example and a comparative example, and FIG. 7 is a schematic cross-sectional view of conventional wiring paste printing. DESCRIPTION OF SYMBOLS 1 ... board | substrate, 2-4 ... resin layer, 5 ... inverted trapezoid groove, 6 ... superconducting ceramic paste pattern, 7 ... superconducting ceramic wiring, 11 ... board | substrate, 12 ... superconducting ceramic paste.
Claims (1)
層を塗布し、焼成して超伝導セラミックス配線を形成す
るに当り、上記超伝導セラミックスペースト配線層を横
断面が逆台形状に塗布することを特徴とする超伝導セラ
ミックス配線の形成方法。In forming a superconducting ceramic wiring by applying a superconducting ceramic paste wiring layer on a substrate and firing it, applying the superconducting ceramic paste wiring layer in an inverted trapezoidal cross section. Characteristic method of forming superconducting ceramic wiring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1240719A JP2737301B2 (en) | 1989-09-19 | 1989-09-19 | Method of forming superconducting ceramic wiring |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1240719A JP2737301B2 (en) | 1989-09-19 | 1989-09-19 | Method of forming superconducting ceramic wiring |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03104178A JPH03104178A (en) | 1991-05-01 |
| JP2737301B2 true JP2737301B2 (en) | 1998-04-08 |
Family
ID=17063685
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1240719A Expired - Fee Related JP2737301B2 (en) | 1989-09-19 | 1989-09-19 | Method of forming superconducting ceramic wiring |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2737301B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4994727B2 (en) * | 2005-09-08 | 2012-08-08 | 株式会社リコー | Organic transistor active substrate, manufacturing method thereof, and electrophoretic display using the organic transistor active substrate |
-
1989
- 1989-09-19 JP JP1240719A patent/JP2737301B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03104178A (en) | 1991-05-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |