JPH02304987A - Forming method for superconductive circuit wirings - Google Patents
Forming method for superconductive circuit wiringsInfo
- Publication number
- JPH02304987A JPH02304987A JP1124185A JP12418589A JPH02304987A JP H02304987 A JPH02304987 A JP H02304987A JP 1124185 A JP1124185 A JP 1124185A JP 12418589 A JP12418589 A JP 12418589A JP H02304987 A JPH02304987 A JP H02304987A
- Authority
- JP
- Japan
- Prior art keywords
- powder
- paste
- superconducting
- added
- strontium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 16
- 239000000843 powder Substances 0.000 claims abstract description 47
- 239000011575 calcium Substances 0.000 claims abstract description 15
- 239000010949 copper Substances 0.000 claims abstract description 14
- 229910052797 bismuth Inorganic materials 0.000 claims abstract description 10
- 229910052712 strontium Inorganic materials 0.000 claims abstract description 10
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229910052791 calcium Inorganic materials 0.000 claims abstract description 9
- 239000000470 constituent Substances 0.000 claims abstract description 9
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229910052802 copper Inorganic materials 0.000 claims abstract description 7
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 claims abstract description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000011230 binding agent Substances 0.000 claims abstract description 5
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 5
- 239000001301 oxygen Substances 0.000 claims abstract description 5
- 239000002904 solvent Substances 0.000 claims abstract description 5
- 239000000758 substrate Substances 0.000 claims description 8
- 239000002994 raw material Substances 0.000 claims description 7
- 239000000654 additive Substances 0.000 claims description 6
- 230000000996 additive effect Effects 0.000 claims description 6
- 238000007650 screen-printing Methods 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 230000003647 oxidation Effects 0.000 claims 1
- 238000007254 oxidation reaction Methods 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 8
- 230000001747 exhibiting effect Effects 0.000 abstract description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 3
- 239000011812 mixed powder Substances 0.000 abstract description 3
- 238000000151 deposition Methods 0.000 abstract 1
- 239000000203 mixture Substances 0.000 description 21
- 238000010304 firing Methods 0.000 description 18
- 238000010586 diagram Methods 0.000 description 11
- 239000002887 superconductor Substances 0.000 description 6
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 4
- WMWLMWRWZQELOS-UHFFFAOYSA-N bismuth(iii) oxide Chemical compound O=[Bi]O[Bi]=O WMWLMWRWZQELOS-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 241000195493 Cryptophyta Species 0.000 description 1
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Superconductor Devices And Manufacturing Methods Thereof (AREA)
Abstract
Description
【発明の詳細な説明】
〔概要］
超伝導回路配線の形成方法、すなわち従来のプリント基
板にみられる回路配線材料に代わり、高密度実装の可能
な超伝導回路配線を形成する方法に関し、
超伝導ペーストの成分のうち、粉末成分が超伝導を示す
超伝導粉末だけからなる超伝導ペーストの高温の焼成に
おいても、組成比の変化を制御する方法を提供すること
を目的とし、
ビスマス（Ｂｉ）、鉛（Ｐｂ）、ストロンチウム（Ｓｒ
）、カルシウム（、Ｃａ）、ｍ（Ｃｕ）、酸素（Ｏ）を
構成元素とする超伝導粉末に、該超伝導粉末の構成元素
の一部であるビスマス、鉛、ストロンチウムのすべてま
たは一部の酸化物粉末からなる添加粉末を加えて原料粉
末とし、該原料粉末に有機バインダおよび溶剤を加えて
ペーストとし、該ペーストを基板上にスクリーン印刷し
、焼成することを特徴とする超伝導回路配線の形成方法
を含み構成する。[Detailed Description of the Invention] [Summary] This invention relates to a method for forming superconducting circuit wiring, that is, a method for forming superconducting circuit wiring that can be mounted at high density in place of circuit wiring materials found in conventional printed circuit boards. The purpose of the present invention is to provide a method for controlling changes in the composition ratio even during high-temperature firing of a superconducting paste consisting only of superconducting powder that exhibits superconductivity among the powder components of the paste.Bismuth (Bi), Lead (Pb), strontium (Sr)
), calcium (,Ca), m(Cu), and oxygen (O) as constituent elements, all or part of bismuth, lead, and strontium, which are some of the constituent elements of the superconducting powder, are added A superconducting circuit wiring method characterized by adding an additive powder made of oxide powder to obtain a raw material powder, adding an organic binder and a solvent to the raw material powder to make a paste, screen printing the paste on a substrate, and baking it. Contains and constitutes a forming method.
本発明は、超伝導回路配線の形成方法、すなわち従来の
プリント基板にみられる回路配線材料に代わり、高密度
実装の可能な超伝導回路配線を形成する方法に関する。The present invention relates to a method of forming superconducting circuit wiring, that is, a method of forming superconducting circuit wiring that can be mounted at high density in place of circuit wiring materials found in conventional printed circuit boards.
〔従来の技術］
近年のコンピュータシステムの高速化の要求に伴い、配
線の高密度化が要求されている。[Prior Art] With the recent demand for higher speed computer systems, higher density wiring is required.
このため、従来の金属を用いた配線材料に代わって、超
伝導体を用いることが考えられている。For this reason, it is being considered to use superconductors instead of conventional wiring materials using metals.
従来は、プリント基板に所定の配線を例えば銅（Ｃｕ）
で形成し、かつ、プリント基板の所定の位置に電子部品
を実装していたが、配線の高密度化を実現するためにＣ
ｕ配線に代えて超伝導体で配線を形成する方法が研究さ
れている。Conventionally, predetermined wiring on a printed circuit board was made of copper (Cu), for example.
The electronic components were mounted on the printed circuit board at predetermined positions, but in order to achieve higher wiring density
A method of forming wiring using a superconductor in place of the u-wiring is being researched.
超伝導体（酸化物系高温超伝導セラミックス）を用い、
回路配線を形成する方法の一つとして、超伝導体を粉砕
し、有機バインダ、溶剤を添加し、ペースト状にしてス
クリーンを介し、基板上にスクリーン印刷し、焼成する
方法が開発されつつあり、この方法では、線幅５０μｍ
程度の配線を形成することが可能である。Using superconductors (oxide-based high-temperature superconducting ceramics),
As one method for forming circuit wiring, a method is being developed in which a superconductor is crushed, an organic binder and a solvent are added, the paste is formed, the material is screen printed onto a substrate through a screen, and then fired. In this method, the line width is 50 μm.
It is possible to form wiring of approximately
〔発明が解決しようとする課題〕
上述のようなスクリーン印刷は、量産性に優れているが
、超伝導ペーストの成分のうち、粉末成分がすでに超伝
導を示す超伝導粉末だけからなる超伝導ペーストをその
まま基板上に印刷、焼成すると、焼成の際、その成分が
一部藻発し、もとの超伝導体の組成が崩れもはや原料の
超伝導特性を得ることはできない。[Problems to be Solved by the Invention] Screen printing as described above is excellent in mass production, but the superconducting paste consists only of superconducting powder in which the powder component already exhibits superconductivity. If it is printed on a substrate as it is and fired, some of its components will emit algae during firing, and the original composition of the superconductor will collapse, making it no longer possible to obtain the superconducting properties of the raw material.
第２図は、超伝導を示す銅（Ｃｕ）、カルシウム（Ｃａ
）、ストロンチウム（Ｓｒ）、ビスマス（旧）、鉛（Ｐ
ｂ）、酸素（Ｏ）の超伝導組成の粉末だけからなる超伝
導ペーストを２０分（１／３ｈ）焼成したときの焼成温
度と超伝導ペーストの組成比の変化との関係を示す線図
で、横軸に焼成温度を〔°Ｃ〕でとり、縦軸に組成比を
〔％］でとる。Ｃｕ、 Ｃａ・・・などの符号を付した
線はそれぞれの物質Ｃｕ、 Ｃａ・・・などの組成比を
示す。第２図の線図は温度が８４０°Ｃを超えると、Ｃ
ｕ、 Ｃａ・・・などの組成比が著しく変化すること、
例えばＣ，ｕとＣａはその組成比が大になる傾向をもち
、Ｓｒ、 Ｂｉ、 Ｐｂは逆にそれぞれの組成比が減少
する傾向にあることを示し、このような組成比の変化が
あると、当該ペーストの焼成によって形成した配線は超
伝導性を示さない。Figure 2 shows copper (Cu) and calcium (Ca) exhibiting superconductivity.
), strontium (Sr), bismuth (old), lead (P
b) is a diagram showing the relationship between the firing temperature and the change in the composition ratio of the superconducting paste when a superconducting paste consisting only of powder with a superconducting composition of oxygen (O) is fired for 20 minutes (1/3 h). , the horizontal axis shows the firing temperature in [°C], and the vertical axis shows the composition ratio in [%]. Lines with symbols such as Cu, Ca, etc. indicate the composition ratios of the respective substances, Cu, Ca, etc. The diagram in Figure 2 shows that when the temperature exceeds 840°C,
A significant change in the composition ratio of u, Ca..., etc.
For example, the composition ratios of C, u, and Ca tend to increase, while the composition ratios of Sr, Bi, and Pb tend to decrease. , the wiring formed by firing the paste does not exhibit superconductivity.
第３図は、超伝導を示す第２図の例と同じ超伝導ペース
トを、温度８４０°Ｃで焼成したときの焼成時間と組成
比の変化との関係を示す線図で、横軸に時間を時（ｈ）
でとり、縦軸に組成比を〔％〕でとった。この線図は、
温度８４０°Ｃでの焼成では、焼成が始まってから１０
分台の僅かの時間の経過で組成比の変化が認められ、３
時間経過したころから組成比の変化が大になり、６時間
経過すると組成比の変化はかなり顕著になることを示す
。Figure 3 is a diagram showing the relationship between the firing time and the change in composition ratio when the same superconducting paste as in Figure 2, which shows superconductivity, is fired at a temperature of 840°C. hour (h)
The vertical axis shows the composition ratio in [%]. This diagram is
When firing at a temperature of 840°C, 10
Changes in the composition ratio were observed over a short period of time, and 3
It is shown that the change in the composition ratio becomes large as time elapses, and the change in the composition ratio becomes quite remarkable after 6 hours.
上記した組成比の変化を抑えて焼成するためには、低温
（８４０°Ｃ以下）で短時間（約６時間以内）の焼成が
望ましいと考えられるが、このような焼成では、焼結が
不十分であり粒子間の接触が十分にとれないために低温
にしても抵抗が残ってしまう。In order to perform firing while suppressing the change in the composition ratio described above, it is considered desirable to perform firing at a low temperature (below 840°C) and for a short period of time (within approximately 6 hours). Because there is insufficient contact between the particles, resistance remains even at low temperatures.
そのことは第４図の線図に示され、同図で、横軸には温
度を（Ｋ）で、また縦軸には比抵抗（Ｒｅｓｉｓｔ−ｉ
ｖｉｔｙ）を任意単位でとる。この線図は、上記した例
が１００Ｋで超伝導性を示さないことを表わす。This is shown in the diagram of Figure 4, where the horizontal axis represents temperature (K) and the vertical axis represents resistivity (Resist-i).
vity) in arbitrary units. This diagram shows that the example described above does not exhibit superconductivity at 100K.
そこで本発明は、超伝導を示す超伝導粉末だけからなる
超伝導ペーストの高温の焼成においても、組成比の変化
を制御する方法を提供することを目的とする。Therefore, an object of the present invention is to provide a method for controlling changes in the composition ratio even during high-temperature firing of a superconducting paste made only of superconducting powder exhibiting superconductivity.
上記課題は、ビスマス（Ｂｉ） 、鉛（Ｐｂ）、ストロ
ンチウム（Ｓｒ）、カルシウム（Ｃａ）、銅（Ｃｕ）、
酸素（Ｏ）を構成元素とする超伝導粉末に、該超伝導粉
末の構成元素の一部であるビスマス、鉛、ストロンチウ
ムのすべてまたは一部の酸化物粉末からなる添加粉末を
加えて原料粉末とし、該原料粉末に有機バインダおよび
溶剤を加えてペーストとし、該ペーストを基板上にスク
リーン印刷し、焼成することを特徴とする超伝導回路配
線の形成方法によって解決される。すなわち、簡単で、
量産性に優れたペースト印刷の手法を利用し、アルミナ
基板上に、超伝導粉末へ蒸発し易い成分の粉末を添加し
てペースト化してスクリーン印刷して焼成することによ
って、超伝導性を示す配線が得られたのである。The above issues include bismuth (Bi), lead (Pb), strontium (Sr), calcium (Ca), copper (Cu),
Additive powder consisting of oxide powder of all or part of bismuth, lead, and strontium, which are some of the constituent elements of the superconducting powder, is added to a superconducting powder containing oxygen (O) as a constituent element to obtain a raw material powder. This problem is solved by a method for forming superconducting circuit wiring, which is characterized by adding an organic binder and a solvent to the raw material powder to form a paste, screen printing the paste on a substrate, and baking it. That is, it is easy,
Utilizing the paste printing method, which is excellent in mass production, wiring that exhibits superconductivity is created on an alumina substrate by adding powder of components that easily evaporate to superconducting powder, making it into a paste, screen printing, and baking. was obtained.
すなわち本発明によれば、もともと超伝導性をもってい
た粉末からなるペーストの焼成時の蒸発による組成分の
不足を前取て補っておくことによって良好な超伝導特性
（Ｔｃｅｎｄ＝ １００Ｋ）を得るものである。That is, according to the present invention, good superconducting properties (Tcend = 100K) can be obtained by making up for the lack of composition in advance due to evaporation during firing of a paste made of powder that originally had superconductivity. be.
〔実施例］ 以下、本発明を図示の実施例により具体的に説明する。〔Example] Hereinafter, the present invention will be specifically explained with reference to illustrated embodiments.
Ｂｉ ：Ｐｂ：Ｓｒ：Ｃａ：Ｃｕ ＝ ０．７ ： ０
．３： １ ： １ ：１．８（モル比）に調合した混
合粉末を８４０″Ｃ１１５０ｈ熱処理して超伝導体（Ｔ
ｃｅｎｄ ＝ １０７Ｋ）を得た。これを粉砕し、超伝
導粉末とした。Bi:Pb:Sr:Ca:Cu=0.7:0
．． A mixed powder prepared at a molar ratio of 3:1:1:1.8 was heat-treated at 840"C1150h to form a superconductor (T
send = 107K) was obtained. This was crushed to obtain superconducting powder.
Ｂｉ ： Ｐｂ ： ５ｒ＝０．８ ： ０．２ ：
０．８ （モル比）になるようにＢｉ２Ｏ３、ＰｂＯ，
５ｒＣＯ，、を調合して添加粉末を得た。この添加粉末
と超伝導粉末とを１：４（重量比）で混合して、ペース
ト原料粉末とした。Bi: Pb: 5r=0.8: 0.2:
Bi2O3, PbO,
An additive powder was obtained by blending 5rCO. This additive powder and superconducting powder were mixed at a ratio of 1:4 (weight ratio) to obtain a paste raw powder.
これに樹脂、およびテルピネオールをそれぞれ２ｗｔ％
、３０ｔｍｔ％添加し、メチル・エチル・ケトン（ＭＥ
Ｋ）を加えて、４８ｈ混練した後、ＭＥＫを飛散させて
、ペーストを得た。Add 2wt% each of resin and terpineol to this.
, 30tmt% and methyl ethyl ketone (ME
After adding K) and kneading for 48 hours, MEK was scattered to obtain a paste.
このペーストをスクリーンを介し、焼結アルミナ基板（
純度９９．７％）上にスクリーン印刷した。This paste is passed through a screen to a sintered alumina substrate (
(purity 99.7%) was screen printed on.
このスクリーン印刷した基板を８４０°Ｃ１６ｈ大気中
で焼成し、印刷配線基板を得た。本発明実施例、すなわ
ちこの基板上の印刷配線の比抵抗は第１図に示され、同
図で、横軸には温度を（Ｋ）でとり、縦軸には比抵抗（
Ｒｅｓｉｓｔｉｖｉｔｙ）を任意単位でとるが、焼成中
に超伝導粉末から失われる物質を添加粉末中の物質によ
って補ったこの印刷配線は、Ｔｃｅｎｄ ＝１００にで
超伝導性を示した。This screen-printed board was baked at 840° C. for 16 hours in the atmosphere to obtain a printed wiring board. The specific resistance of the printed wiring on this substrate according to the present invention is shown in FIG. 1, in which the horizontal axis shows temperature (K) and the vertical axis shows specific resistance
This printed wiring, in which the material lost from the superconducting powder during firing was compensated for by the material in the added powder, exhibited superconductivity at Tcend = 100, with resistance (resistivity) taken in arbitrary units.
以上のように本発明によれば、超伝導を示す超伝導粉末
に、それのみから成るペーストを焼成したときに失われ
る組成分からなる添加粉末を加え、これら混成粉末のペ
ーストを焼成することにより超伝導性を示す配線を得る
ことができた。As described above, according to the present invention, a superconducting powder exhibiting superconductivity is added with an additive powder having a composition that is lost when a paste consisting only of the superconducting powder is fired, and a paste of these mixed powders is fired. We were able to obtain conductive wiring.
第１図は本発明実施例の比抵抗を示す線図、第２図は超
伝導ペーストの焼成における焼成温度と組成の変化との
関係を示す線図、
第３図は超伝導ペーストの焼成における焼成時間と組成
の変化との関係を示す線図、
第４図は超伝導ペーストを８４０”Ｃ以下の温度で短時
間焼成して得た配線の比抵抗を示す線図である。Fig. 1 is a diagram showing the specific resistance of the example of the present invention, Fig. 2 is a diagram showing the relationship between firing temperature and composition change in the firing of superconducting paste, and Fig. 3 is a diagram showing the relationship between firing temperature and composition change in firing of superconducting paste. A diagram showing the relationship between firing time and composition change. FIG. 4 is a diagram showing the specific resistance of a wiring obtained by firing a superconducting paste for a short time at a temperature of 840''C or less.
Claims (1)
）、カルシウム（Ｃａ）、銅（Ｃｕ）、酸素（Ｏ）を構
成元素とする超伝導粉末に、該超伝導粉末の構成元素の
一部であるビスマス、鉛、ストロンチウムのすべてまた
は一部の酸化物粉末からなる添加粉末を加えて原料粉末
とし、 該原料粉末に有機バインダおよび溶剤を加えてペースト
とし、 該ペーストを基板上にスクリーン印刷し、焼成すること
を特徴とする超伝導回路配線の形成方法。[Claims] Bismuth (Bi), lead (Pb), strontium (Sr)
), calcium (Ca), copper (Cu), and oxygen (O) as constituent elements, oxidation of all or part of bismuth, lead, and strontium, which are some of the constituent elements of the superconducting powder. Formation of superconducting circuit wiring characterized by: adding an additive powder consisting of a substance powder to obtain a raw material powder, adding an organic binder and a solvent to the raw material powder to make a paste, screen printing the paste on a substrate, and baking it. Method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1124185A JPH02304987A (en) | 1989-05-19 | 1989-05-19 | Forming method for superconductive circuit wirings |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1124185A JPH02304987A (en) | 1989-05-19 | 1989-05-19 | Forming method for superconductive circuit wirings |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02304987A true JPH02304987A (en) | 1990-12-18 |
Family
ID=14879087
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1124185A Pending JPH02304987A (en) | 1989-05-19 | 1989-05-19 | Forming method for superconductive circuit wirings |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02304987A (en) |
-
1989
- 1989-05-19 JP JP1124185A patent/JPH02304987A/en active Pending
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