JPH03103260U - - Google Patents
Info
- Publication number
- JPH03103260U JPH03103260U JP1038790U JP1038790U JPH03103260U JP H03103260 U JPH03103260 U JP H03103260U JP 1038790 U JP1038790 U JP 1038790U JP 1038790 U JP1038790 U JP 1038790U JP H03103260 U JPH03103260 U JP H03103260U
- Authority
- JP
- Japan
- Prior art keywords
- jig
- main body
- wafer
- plating
- inlet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 claims description 6
- 238000009713 electroplating Methods 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 4
- 239000012535 impurity Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1038790U JPH03103260U (cs) | 1990-02-05 | 1990-02-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1038790U JPH03103260U (cs) | 1990-02-05 | 1990-02-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03103260U true JPH03103260U (cs) | 1991-10-28 |
Family
ID=31513957
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1038790U Pending JPH03103260U (cs) | 1990-02-05 | 1990-02-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03103260U (cs) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001316887A (ja) * | 2000-05-08 | 2001-11-16 | Tokyo Electron Ltd | メッキ処理装置 |
| US6391168B1 (en) | 1999-04-06 | 2002-05-21 | Nec Corporation | Plating apparatus utilizing an auxiliary electrode |
-
1990
- 1990-02-05 JP JP1038790U patent/JPH03103260U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6391168B1 (en) | 1999-04-06 | 2002-05-21 | Nec Corporation | Plating apparatus utilizing an auxiliary electrode |
| JP2001316887A (ja) * | 2000-05-08 | 2001-11-16 | Tokyo Electron Ltd | メッキ処理装置 |
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