JPH03102721U - - Google Patents
Info
- Publication number
- JPH03102721U JPH03102721U JP1118790U JP1118790U JPH03102721U JP H03102721 U JPH03102721 U JP H03102721U JP 1118790 U JP1118790 U JP 1118790U JP 1118790 U JP1118790 U JP 1118790U JP H03102721 U JPH03102721 U JP H03102721U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- metal frame
- chip
- component element
- type electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000000605 extraction Methods 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
Description
第１図は本考案の一実施例における電子部品の
斜視図、第２図は金属フレームの平面図、第３図
は金属フレームと電子部品素子の接合部を拡大し
た断面図、第４図は従来の電子部品の斜視図であ
る。
１……リード引出し用金属フレーム、２……電
子部品素子、３……接合材、４……絶縁性樹脂、
５……他方のリード引出し用金属フレーム、６…
…切り欠け部、７……銀ペースト。
Fig. 1 is a perspective view of an electronic component according to an embodiment of the present invention, Fig. 2 is a plan view of a metal frame, Fig. 3 is an enlarged cross-sectional view of the joint between the metal frame and an electronic component element, and Fig. 4 is a perspective view of an electronic component according to an embodiment of the present invention. FIG. 2 is a perspective view of a conventional electronic component. 1... Metal frame for lead drawer, 2... Electronic component element, 3... Bonding material, 4... Insulating resin,
5... Metal frame for the other lead drawer, 6...
...Cut portion, 7...Silver paste.
Claims (1)
フレームに接続し、絶縁性樹脂で外装してなるチ
ツプ型電子部品において、前記電子部品素子と対
向する面の前記金属フレームの一部に切り欠け部
を設けていることを特徴とするチツプ型電子部品
。 In a chip-type electronic component in which an electronic component element is connected to a metal frame for lead extraction using a bonding material and is exteriorized with an insulating resin, a notch is provided in a part of the metal frame on a surface facing the electronic component element. A chip-type electronic component characterized by being provided with.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1118790U JPH03102721U (en) | 1990-02-07 | 1990-02-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1118790U JPH03102721U (en) | 1990-02-07 | 1990-02-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03102721U true JPH03102721U (en) | 1991-10-25 |
Family
ID=31514722
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1118790U Pending JPH03102721U (en) | 1990-02-07 | 1990-02-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03102721U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6018539B2 (en) * | 1977-03-31 | 1985-05-10 | 三井化学株式会社 | Skin material |
-
1990
- 1990-02-07 JP JP1118790U patent/JPH03102721U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6018539B2 (en) * | 1977-03-31 | 1985-05-10 | 三井化学株式会社 | Skin material |