JPH0215732U - - Google Patents
Info
- Publication number
- JPH0215732U JPH0215732U JP9397188U JP9397188U JPH0215732U JP H0215732 U JPH0215732 U JP H0215732U JP 9397188 U JP9397188 U JP 9397188U JP 9397188 U JP9397188 U JP 9397188U JP H0215732 U JPH0215732 U JP H0215732U
- Authority
- JP
- Japan
- Prior art keywords
- heating element
- bonding tool
- model registration
- utility
- semiconductor devices
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010438 heat treatment Methods 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000000034 method Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Wire Bonding (AREA)
Description
第１図は本考案になる半導体装置用ボンデイン
グツールの一実施例を示す斜視図、第２図は第１
図における―矢視断面図、第３図は第２図に
対応する本考案の他の実施例を示す図、第４図は
従来のボンデイングツールの斜視図である。１０
……ボンデイングツール、１１……発熱体、１２
，１３……側壁、１４，１５……通電用脚部、１
６……底部、１７，１８……取付け部。
FIG. 1 is a perspective view showing an embodiment of the bonding tool for semiconductor devices according to the present invention, and FIG.
3 is a cross-sectional view taken along the arrow in FIG. 3, FIG. 3 is a diagram showing another embodiment of the present invention corresponding to FIG. 2, and FIG. 4 is a perspective view of a conventional bonding tool. 10
... Bonding tool, 11 ... Heating element, 12
, 13... side wall, 14, 15... energizing leg, 1
6... Bottom, 17, 18... Mounting part.
Claims (1)
向きにして受動回路の接続点に重ね合わせ、該半
導体素子背面を押圧加熱して両者を圧着するため
のボンデイングツールにおいて、有底枠状に形成
した発熱体の任意の対向する２側壁に該各側壁の
幅よりも狭く形成した通電用脚部をそれぞれ一体
に設けると共に、前記発熱体の底部を他の部分の
肉厚よりも薄く形成してなることを特徴とする半
導体装置用ボンデイングツール。 (2) 前記発熱体は、前記底部の４辺部をそれぞ
れ切り欠いて底部との接続部の断面積を減少させ
たことを特徴とする実用新案登録請求の範囲第１
項記載の半導体装置用ボンデイングツール。[Claims for Utility Model Registration] (1) A bonding tool for placing a semiconductor element with electrode terminals on its surface facing downward on a connection point of a passive circuit, pressing and heating the back surface of the semiconductor element to press and bond the two together. In this method, energizing legs formed narrower than the width of each side wall are integrally provided on any two opposing side walls of the heating element formed in the shape of a bottomed frame, and the bottom of the heating element is connected to the other parts of the heating element. A bonding tool for semiconductor devices characterized by being formed thinner than the wall thickness. (2) Utility model registration claim 1, characterized in that the heating element has four sides of the bottom portion cut out to reduce the cross-sectional area of the connection portion with the bottom portion.
A bonding tool for semiconductor devices as described in .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9397188U JPH0521882Y2 (en) | 1988-07-18 | 1988-07-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9397188U JPH0521882Y2 (en) | 1988-07-18 | 1988-07-18 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0215732U true JPH0215732U (en) | 1990-01-31 |
| JPH0521882Y2 JPH0521882Y2 (en) | 1993-06-04 |
Family
ID=31318457
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9397188U Expired - Lifetime JPH0521882Y2 (en) | 1988-07-18 | 1988-07-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0521882Y2 (en) |
-
1988
- 1988-07-18 JP JP9397188U patent/JPH0521882Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0521882Y2 (en) | 1993-06-04 |