JPH0310036A - 半導体機器用リード材 - Google Patents

半導体機器用リード材

Info

Publication number
JPH0310036A
JPH0310036A JP25070589A JP25070589A JPH0310036A JP H0310036 A JPH0310036 A JP H0310036A JP 25070589 A JP25070589 A JP 25070589A JP 25070589 A JP25070589 A JP 25070589A JP H0310036 A JPH0310036 A JP H0310036A
Authority
JP
Japan
Prior art keywords
weight
lead material
alloy
lead
semiconductor apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP25070589A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0437151B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Michiharu Yamamoto
山本　道晴
Susumu Kawauchi
川内　進
Masahiro Tsuji
正博 辻
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eneos Corp
Original Assignee
Nippon Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining Co Ltd filed Critical Nippon Mining Co Ltd
Priority to JP25070589A priority Critical patent/JPH0310036A/ja
Publication of JPH0310036A publication Critical patent/JPH0310036A/ja
Publication of JPH0437151B2 publication Critical patent/JPH0437151B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Conductive Materials (AREA)
JP25070589A 1989-09-28 1989-09-28 半導体機器用リード材 Granted JPH0310036A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP25070589A JPH0310036A (ja) 1989-09-28 1989-09-28 半導体機器用リード材

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25070589A JPH0310036A (ja) 1989-09-28 1989-09-28 半導体機器用リード材

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP57006063A Division JPS6045698B2 (ja) 1982-01-20 1982-01-20 半導体機器用リ−ド材

Publications (2)

Publication Number Publication Date
JPH0310036A true JPH0310036A (ja) 1991-01-17
JPH0437151B2 JPH0437151B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-06-18

Family

ID=17211820

Family Applications (1)

Application Number Title Priority Date Filing Date
JP25070589A Granted JPH0310036A (ja) 1989-09-28 1989-09-28 半導体機器用リード材

Country Status (1)

Country Link
JP (1) JPH0310036A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5178493A (en) * 1989-11-16 1993-01-12 Societe Civile Des Brevets De Henri Vidal Counterfort wall
US7413619B2 (en) 2005-03-11 2008-08-19 Mitsubishi Denki Kabushiki Kaisha Copper alloy
JP2010242154A (ja) * 2009-04-03 2010-10-28 Mitsubishi Electric Corp 銅合金及びその製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US307250A (en) * 1884-10-28 Safe-lock for toy banks
US2137282A (en) * 1938-08-12 1938-11-22 Mallory & Co Inc P R Copper alloys
GB522482A (en) * 1938-11-28 1940-06-19 Mallory & Co Inc P R Improvements in and relating to the production of copper base alloys
JPS572851A (en) * 1980-06-06 1982-01-08 Nippon Mining Co Ltd Copper alloy for lead material of semiconductor device
JPS5895850A (ja) * 1981-12-02 1983-06-07 Kobe Steel Ltd 集積回路のリ−ドフレ−ム用銅合金

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US307250A (en) * 1884-10-28 Safe-lock for toy banks
US2137282A (en) * 1938-08-12 1938-11-22 Mallory & Co Inc P R Copper alloys
GB522482A (en) * 1938-11-28 1940-06-19 Mallory & Co Inc P R Improvements in and relating to the production of copper base alloys
JPS572851A (en) * 1980-06-06 1982-01-08 Nippon Mining Co Ltd Copper alloy for lead material of semiconductor device
JPS5895850A (ja) * 1981-12-02 1983-06-07 Kobe Steel Ltd 集積回路のリ−ドフレ−ム用銅合金

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5178493A (en) * 1989-11-16 1993-01-12 Societe Civile Des Brevets De Henri Vidal Counterfort wall
US7413619B2 (en) 2005-03-11 2008-08-19 Mitsubishi Denki Kabushiki Kaisha Copper alloy
US7727345B2 (en) 2005-03-11 2010-06-01 Mitsubishi Denki Kabushiki Kaisha Copper alloy and method of manufacturing the same
DE102006010760B4 (de) * 2005-03-11 2014-03-27 Mitsubishi Denki K.K. Kupferlegierung und Verfahren zur Herstellung derselben
JP2010242154A (ja) * 2009-04-03 2010-10-28 Mitsubishi Electric Corp 銅合金及びその製造方法

Also Published As

Publication number Publication date
JPH0437151B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-06-18

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