JPH0299268A - 自動半田付け方法及び装置 - Google Patents
自動半田付け方法及び装置Info
- Publication number
- JPH0299268A JPH0299268A JP24840888A JP24840888A JPH0299268A JP H0299268 A JPH0299268 A JP H0299268A JP 24840888 A JP24840888 A JP 24840888A JP 24840888 A JP24840888 A JP 24840888A JP H0299268 A JPH0299268 A JP H0299268A
- Authority
- JP
- Japan
- Prior art keywords
- board
- soldering
- circuit board
- nozzle
- molten solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005476 soldering Methods 0.000 title claims abstract description 57
- 238000000034 method Methods 0.000 title claims description 10
- 229910000679 solder Inorganic materials 0.000 claims abstract description 58
- 239000000758 substrate Substances 0.000 claims description 30
- 230000032258 transport Effects 0.000 claims description 11
- 230000000694 effects Effects 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
Landscapes
- Molten Solder (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24840888A JPH0299268A (ja) | 1988-09-30 | 1988-09-30 | 自動半田付け方法及び装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24840888A JPH0299268A (ja) | 1988-09-30 | 1988-09-30 | 自動半田付け方法及び装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0299268A true JPH0299268A (ja) | 1990-04-11 |
JPH0459070B2 JPH0459070B2 (enrdf_load_stackoverflow) | 1992-09-21 |
Family
ID=17177670
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP24840888A Granted JPH0299268A (ja) | 1988-09-30 | 1988-09-30 | 自動半田付け方法及び装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0299268A (enrdf_load_stackoverflow) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6113157U (ja) * | 1984-06-26 | 1986-01-25 | 株式会社日立ホームテック | 熱交換器 |
-
1988
- 1988-09-30 JP JP24840888A patent/JPH0299268A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6113157U (ja) * | 1984-06-26 | 1986-01-25 | 株式会社日立ホームテック | 熱交換器 |
Also Published As
Publication number | Publication date |
---|---|
JPH0459070B2 (enrdf_load_stackoverflow) | 1992-09-21 |
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