JPH0296738U - - Google Patents
Info
- Publication number
- JPH0296738U JPH0296738U JP592389U JP592389U JPH0296738U JP H0296738 U JPH0296738 U JP H0296738U JP 592389 U JP592389 U JP 592389U JP 592389 U JP592389 U JP 592389U JP H0296738 U JPH0296738 U JP H0296738U
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- dummy
- insulating film
- island
- wirings
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Description
第１図は、この考案の多層配線構造に係る実施
例１及び実施例２を説明するため、半導体装置の
概略的断面により示す説明図、第２図は、実施例
１を説明するため、第１図に示す半導体装置の要
部平面を概略的に示す説明図、第３図は、実施例
２を説明するため、第２図と同様に示す説明図、
第４図及び第５図は、従来技術を説明するため、
第１図と同様に示す説明図、第６図は、従来技術
を説明するため、第５図に示される半導体装置の
要部平面を、第２図及び第３図と同様に示す説明
図である。
１１……基板、１３……下地用絶縁膜、１５…
…下地、１７ａ〜１７ｅ……下層配線、１９……
絶縁膜、２１ａ〜２１ｃ，２５ａ，２５ｂ……上
層配線、２３ａ，２３ｂ……ダミー配線、２７ａ
〜２７ｄ，２９ａ〜２９ｄ，３１ａ〜３１ｄ……
島状ダミー配線、ｄ１……（平坦化し得る）間隔
、ｄ２，ｄ３……（下層配線同士の）間隔、ｓ１
〜ｓ８……（短絡し得る）領域。
FIG. 1 is an explanatory diagram showing a schematic cross section of a semiconductor device in order to explain Embodiments 1 and 2 according to the multilayer wiring structure of this invention, and FIG. FIG. 3 is an explanatory diagram schematically showing the main part plane of the semiconductor device shown in FIG. 1; FIG. 3 is an explanatory diagram similar to FIG.
FIG. 4 and FIG. 5 are for explaining the prior art.
FIG. 6 is an explanatory diagram similar to FIG. 1, and FIG. 6 is an explanatory diagram showing the main part plane of the semiconductor device shown in FIG. 5, similar to FIGS. 2 and 3, for explaining the prior art. be. 11...Substrate, 13...Insulating film for base, 15...
...Front layer, 17a-17e...Lower layer wiring, 19...
Insulating film, 21a to 21c, 25a, 25b... Upper layer wiring, 23a, 23b... Dummy wiring, 27a
~27d, 29a~29d, 31a~31d...
Island-shaped dummy wiring, d 1 ... spacing (that can be flattened), d 2 , d 3 ... spacing (between lower layer wiring), s 1
~ s8 ...(Possible short circuit) area.
Claims (1)
を具え、かつ前記下層配線及び前記ダミー配線の
上側に絶縁膜を具えて成る多層配線構造において
、 前記ダミー配線が複数の島状ダミー配線から成
り、かつ前記下層配線と島状ダミー配線との間隔
及び該島状ダミー配線同士の間隔を、前記絶縁膜
を被着した時、該絶縁膜が実質的に平坦となる間
隔として成る ことを特徴とする多層配線構造。[Claims for Utility Model Registration] In a multilayer wiring structure comprising a dummy wiring between lower wirings formed on a base, and an insulating film above the lower wiring and the dummy wiring, the dummy wiring comprises: It consists of a plurality of island-like dummy wirings, and the distance between the lower layer wiring and the island-like dummy wirings and the distance between the island-like dummy wirings are such that when the insulating film is deposited, the insulating film is substantially flat. A multilayer wiring structure characterized by having a spacing of .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP592389U JPH0296738U (en) | 1989-01-21 | 1989-01-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP592389U JPH0296738U (en) | 1989-01-21 | 1989-01-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0296738U true JPH0296738U (en) | 1990-08-01 |
Family
ID=31209721
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP592389U Pending JPH0296738U (en) | 1989-01-21 | 1989-01-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0296738U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006066505A (en) * | 2004-08-25 | 2006-03-09 | Fujikura Ltd | Semiconductor device and electronic device equipped with it |
-
1989
- 1989-01-21 JP JP592389U patent/JPH0296738U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006066505A (en) * | 2004-08-25 | 2006-03-09 | Fujikura Ltd | Semiconductor device and electronic device equipped with it |
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