JPH029556Y2 - - Google Patents
Info
- Publication number
- JPH029556Y2 JPH029556Y2 JP19936484U JP19936484U JPH029556Y2 JP H029556 Y2 JPH029556 Y2 JP H029556Y2 JP 19936484 U JP19936484 U JP 19936484U JP 19936484 U JP19936484 U JP 19936484U JP H029556 Y2 JPH029556 Y2 JP H029556Y2
- Authority
- JP
- Japan
- Prior art keywords
- frame
- presser
- lead frame
- bonding
- coil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 description 15
- 238000001514 detection method Methods 0.000 description 7
- 239000000758 substrate Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011295 pitch Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78343—Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
- H01L2224/78344—Eccentric cams
Landscapes
- Wire Bonding (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19936484U JPH029556Y2 (enrdf_load_html_response) | 1984-12-28 | 1984-12-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19936484U JPH029556Y2 (enrdf_load_html_response) | 1984-12-28 | 1984-12-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61114832U JPS61114832U (enrdf_load_html_response) | 1986-07-19 |
| JPH029556Y2 true JPH029556Y2 (enrdf_load_html_response) | 1990-03-09 |
Family
ID=30759218
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19936484U Expired JPH029556Y2 (enrdf_load_html_response) | 1984-12-28 | 1984-12-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH029556Y2 (enrdf_load_html_response) |
-
1984
- 1984-12-28 JP JP19936484U patent/JPH029556Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61114832U (enrdf_load_html_response) | 1986-07-19 |