JPH0295246U - - Google Patents
Info
- Publication number
- JPH0295246U JPH0295246U JP1989003055U JP305589U JPH0295246U JP H0295246 U JPH0295246 U JP H0295246U JP 1989003055 U JP1989003055 U JP 1989003055U JP 305589 U JP305589 U JP 305589U JP H0295246 U JPH0295246 U JP H0295246U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- semiconductor chip
- insulating container
- semiconductor
- side wall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
Landscapes
- Die Bonding (AREA)
- Semiconductor Memories (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989003055U JPH0295246U (enExample) | 1989-01-13 | 1989-01-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989003055U JPH0295246U (enExample) | 1989-01-13 | 1989-01-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0295246U true JPH0295246U (enExample) | 1990-07-30 |
Family
ID=31204353
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989003055U Pending JPH0295246U (enExample) | 1989-01-13 | 1989-01-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0295246U (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998049726A1 (en) * | 1997-04-30 | 1998-11-05 | Hitachi Chemical Company, Ltd. | Board for mounting semiconductor element, method for manufacturing the same, and semiconductor device |
| US6617193B1 (en) | 1997-04-30 | 2003-09-09 | Hitachi Chemical Company, Ltd. | Semiconductor device, semiconductor device substrate, and methods of fabricating the same |
| JP2017059757A (ja) * | 2015-09-18 | 2017-03-23 | 日本電気株式会社 | 半導体装置および半導体装置の製造方法 |
-
1989
- 1989-01-13 JP JP1989003055U patent/JPH0295246U/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998049726A1 (en) * | 1997-04-30 | 1998-11-05 | Hitachi Chemical Company, Ltd. | Board for mounting semiconductor element, method for manufacturing the same, and semiconductor device |
| US6268648B1 (en) | 1997-04-30 | 2001-07-31 | Hitachi Chemical Co., Ltd. | Board for mounting semiconductor element, method for manufacturing the same, and semiconductor device |
| US6617193B1 (en) | 1997-04-30 | 2003-09-09 | Hitachi Chemical Company, Ltd. | Semiconductor device, semiconductor device substrate, and methods of fabricating the same |
| CN100370602C (zh) * | 1997-04-30 | 2008-02-20 | 日立化成工业株式会社 | 半导体元件装配用基板及其制造方法和半导体器件 |
| JP2017059757A (ja) * | 2015-09-18 | 2017-03-23 | 日本電気株式会社 | 半導体装置および半導体装置の製造方法 |