JPH029445U - - Google Patents

Info

Publication number
JPH029445U
JPH029445U JP8699088U JP8699088U JPH029445U JP H029445 U JPH029445 U JP H029445U JP 8699088 U JP8699088 U JP 8699088U JP 8699088 U JP8699088 U JP 8699088U JP H029445 U JPH029445 U JP H029445U
Authority
JP
Japan
Prior art keywords
electronic component
holding member
heat
heat radiator
soldered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8699088U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8699088U priority Critical patent/JPH029445U/ja
Publication of JPH029445U publication Critical patent/JPH029445U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】
第１図はこの考案の一実施例を示す斜視図、第
２図は第１図の断面図、第３図は第１図の要部の
斜視図、第４図は本考案の他の実施例を示す斜視
図、第５図は従来の斜視図である。 １０……パワートランジスタ、１１……放熱器
、１３……押え部材、１４……弾性支持片、１５
……プリント基板。

Claims (1)

    【実用新案登録請求の範囲】
  1. 発熱性の半導体電子部品と、この電子部品が発
    生した熱を放熱する放熱器と、この放熱器に圧接
    して前記電子部品を取着した押え部材と、この押
    え部材に形成し、前記放熱器を弾性的に支持する
    弾性部材とを備え、前記電子部品および押え部材
    は予めプリント基板に半田付けしてなることを特
    徴とする放熱装置。
JP8699088U 1988-06-30 1988-06-30 Pending JPH029445U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8699088U JPH029445U (ja) 1988-06-30 1988-06-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8699088U JPH029445U (ja) 1988-06-30 1988-06-30

Publications (1)

Publication Number Publication Date
JPH029445U true JPH029445U (ja) 1990-01-22

Family

ID=31311627

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8699088U Pending JPH029445U (ja) 1988-06-30 1988-06-30

Country Status (1)

Country Link
JP (1) JPH029445U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010079337A (ko) * 2001-07-07 2001-08-22 유동수 전력용 반도체소자를 히트씽크에 고정시키는 고정구
JP2012160646A (ja) * 2011-02-02 2012-08-23 Shindengen Electric Mfg Co Ltd 電子回路装置及びその製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010079337A (ko) * 2001-07-07 2001-08-22 유동수 전력용 반도체소자를 히트씽크에 고정시키는 고정구
JP2012160646A (ja) * 2011-02-02 2012-08-23 Shindengen Electric Mfg Co Ltd 電子回路装置及びその製造方法

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