JPH0292934U - - Google Patents
Info
- Publication number
- JPH0292934U JPH0292934U JP1989001052U JP105289U JPH0292934U JP H0292934 U JPH0292934 U JP H0292934U JP 1989001052 U JP1989001052 U JP 1989001052U JP 105289 U JP105289 U JP 105289U JP H0292934 U JPH0292934 U JP H0292934U
- Authority
- JP
- Japan
- Prior art keywords
- package
- chip
- attached
- solder bump
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/072—
-
- H10W72/07554—
-
- H10W72/241—
-
- H10W72/547—
-
- H10W72/877—
-
- H10W72/884—
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989001052U JPH0292934U (index.php) | 1989-01-09 | 1989-01-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989001052U JPH0292934U (index.php) | 1989-01-09 | 1989-01-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0292934U true JPH0292934U (index.php) | 1990-07-24 |
Family
ID=31200605
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989001052U Pending JPH0292934U (index.php) | 1989-01-09 | 1989-01-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0292934U (index.php) |
-
1989
- 1989-01-09 JP JP1989001052U patent/JPH0292934U/ja active Pending
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