JPH029198A - 基板上に金属層を付着する方法 - Google Patents

基板上に金属層を付着する方法

Info

Publication number
JPH029198A
JPH029198A JP63316580A JP31658088A JPH029198A JP H029198 A JPH029198 A JP H029198A JP 63316580 A JP63316580 A JP 63316580A JP 31658088 A JP31658088 A JP 31658088A JP H029198 A JPH029198 A JP H029198A
Authority
JP
Japan
Prior art keywords
metal
layer
etch
etching
resistant layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP63316580A
Other languages
English (en)
Japanese (ja)
Other versions
JPH053159B2 (cg-RX-API-DMAC10.html
Inventor
Ingrid E Magdo
イングリツド・エミイズ・マグド
Jr Douglas W Ormond
ダグラス・ウイリアム・オルモンド、ジユニア
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPH029198A publication Critical patent/JPH029198A/ja
Publication of JPH053159B2 publication Critical patent/JPH053159B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/05—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H05K3/143—Masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/942—Masking
    • Y10S438/948—Radiation resist
    • Y10S438/951—Lift-off

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • ing And Chemical Polishing (AREA)
JP63316580A 1988-03-04 1988-12-16 基板上に金属層を付着する方法 Granted JPH029198A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/164,363 US4805683A (en) 1988-03-04 1988-03-04 Method for producing a plurality of layers of metallurgy
US164363 1988-03-04

Publications (2)

Publication Number Publication Date
JPH029198A true JPH029198A (ja) 1990-01-12
JPH053159B2 JPH053159B2 (cg-RX-API-DMAC10.html) 1993-01-14

Family

ID=22594145

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63316580A Granted JPH029198A (ja) 1988-03-04 1988-12-16 基板上に金属層を付着する方法

Country Status (3)

Country Link
US (1) US4805683A (cg-RX-API-DMAC10.html)
EP (1) EP0331598A3 (cg-RX-API-DMAC10.html)
JP (1) JPH029198A (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6149190A (ja) * 1984-08-16 1986-03-11 Toyoda Autom Loom Works Ltd 可変容量型ベーン圧縮機

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4880684A (en) * 1988-03-11 1989-11-14 International Business Machines Corporation Sealing and stress relief layers and use thereof
DE4009225A1 (de) * 1990-03-22 1991-09-26 Bosch Gmbh Robert Verfahren zum herstellen von streifenleitern, insbesondere fuer elektronische hybrid-schaltungen im hochfrequenzbereich
US5116460A (en) * 1991-04-12 1992-05-26 Motorola, Inc. Method for selectively etching a feature
JPH05129760A (ja) * 1991-11-06 1993-05-25 Fujitsu Ltd 導体パターンの形成方法
US5712192A (en) * 1994-04-26 1998-01-27 International Business Machines Corporation Process for connecting an electrical device to a circuit substrate
US6429113B1 (en) 1994-04-26 2002-08-06 International Business Machines Corporation Method for connecting an electrical device to a circuit substrate
US5976974A (en) * 1997-04-22 1999-11-02 W. L. Gore & Associates, Inc. Method of forming redundant signal traces and corresponding electronic components
US6169664B1 (en) * 1998-01-05 2001-01-02 Texas Instruments Incorporated Selective performance enhancements for interconnect conducting paths
US6274292B1 (en) 1998-02-25 2001-08-14 Micron Technology, Inc. Semiconductor processing methods
US7804115B2 (en) * 1998-02-25 2010-09-28 Micron Technology, Inc. Semiconductor constructions having antireflective portions
US6268282B1 (en) * 1998-09-03 2001-07-31 Micron Technology, Inc. Semiconductor processing methods of forming and utilizing antireflective material layers, and methods of forming transistor gate stacks
US6281100B1 (en) 1998-09-03 2001-08-28 Micron Technology, Inc. Semiconductor processing methods
US6828683B2 (en) * 1998-12-23 2004-12-07 Micron Technology, Inc. Semiconductor devices, and semiconductor processing methods
US7235499B1 (en) * 1999-01-20 2007-06-26 Micron Technology, Inc. Semiconductor processing methods
US7067414B1 (en) 1999-09-01 2006-06-27 Micron Technology, Inc. Low k interlevel dielectric layer fabrication methods
US6440860B1 (en) 2000-01-18 2002-08-27 Micron Technology, Inc. Semiconductor processing methods of transferring patterns from patterned photoresists to materials, and structures comprising silicon nitride
JP3691780B2 (ja) * 2001-11-01 2005-09-07 Ｔｄｋ株式会社 パターン化薄膜形成方法およびマイクロデバイスの製造方法
US7129590B2 (en) * 2003-05-14 2006-10-31 Intel Corporation Stencil and method for depositing material onto a substrate
US20050072834A1 (en) * 2003-10-06 2005-04-07 Kejun Zeng Connection site coating method and solder joints
KR100770541B1 (ko) * 2005-12-29 2007-10-25 동부일렉트로닉스 주식회사 반도체 소자 및 그 제조 방법
US8341588B2 (en) 2010-10-04 2012-12-25 International Business Machines Corporation Semiconductor layer forming method and structure
TW201301548A (zh) * 2011-06-30 2013-01-01 Inst Nuclear Energy Res Atomic Energy Council 電池晶片元件及其封裝方法
CN115085682A (zh) * 2021-03-15 2022-09-20 诺思(天津)微系统有限责任公司 焊盘结构的制造方法、体声波谐振器、滤波器及电子设备

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4092442A (en) * 1976-12-30 1978-05-30 International Business Machines Corporation Method of depositing thin films utilizing a polyimide mask
US4413061A (en) * 1978-02-06 1983-11-01 International Business Machines Corporation Glass-ceramic structures and sintered multilayer substrates thereof with circuit patterns of gold, silver or copper
US4301324A (en) * 1978-02-06 1981-11-17 International Business Machines Corporation Glass-ceramic structures and sintered multilayer substrates thereof with circuit patterns of gold, silver or copper
US4206254A (en) * 1979-02-28 1980-06-03 International Business Machines Corporation Method of selectively depositing metal on a ceramic substrate with a metallurgy pattern
US4221047A (en) * 1979-03-23 1980-09-09 International Business Machines Corporation Multilayered glass-ceramic substrate for mounting of semiconductor device
US4526859A (en) * 1983-12-12 1985-07-02 International Business Machines Corporation Metallization of a ceramic substrate
GB2194386B (en) * 1986-08-20 1990-07-18 Plessey Co Plc Solder bonded integrated circuit devices

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6149190A (ja) * 1984-08-16 1986-03-11 Toyoda Autom Loom Works Ltd 可変容量型ベーン圧縮機

Also Published As

Publication number Publication date
EP0331598A3 (en) 1991-04-10
US4805683A (en) 1989-02-21
EP0331598A2 (en) 1989-09-06
JPH053159B2 (cg-RX-API-DMAC10.html) 1993-01-14

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