JPH0291186U - - Google Patents
Info
- Publication number
- JPH0291186U JPH0291186U JP24889U JP24889U JPH0291186U JP H0291186 U JPH0291186 U JP H0291186U JP 24889 U JP24889 U JP 24889U JP 24889 U JP24889 U JP 24889U JP H0291186 U JPH0291186 U JP H0291186U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- contacts
- type semiconductor
- socket
- plane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Connecting Device With Holders (AREA)
Description
第１図は本考案の一実施例ソケツトの断面図、
第２図は該一実施例のソケツトの接触部分の断面
図、第３図は本考案の他の実施例の接触子の側面
図である。
１……ソケツト外被、２……接触子、３……半
導体装置、４……ソケツト外被、５……接触子、
６……半導体装置リード、７……ガイド部、８…
…接触子。
FIG. 1 is a sectional view of a socket according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view of the contact portion of the socket of this embodiment, and FIG. 3 is a side view of the contact of another embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Socket jacket, 2... Contact, 3... Semiconductor device, 4... Socket jacket, 5... Contact,
6... Semiconductor device lead, 7... Guide portion, 8...
...Contact child.
Claims (1)
子と、該平面上で間隔を隔てて前記第１の接触子
と相対向し、前記一方向に前記所定間隔で並んだ
第２の接触子とを有するＤＩＰ型半導体装置用ソ
ケツトにおいて、前記第１及び第２の接触子がＤ
ＩＰ型半導体装置の各ミルサイズに合致するよう
に前記一方向と直交する方向に長く設けられてい
ることを特徴とするＤＩＰ型半導体装置用ソケツ
ト。 first contacts arranged at a predetermined interval in one direction on a plane; and second contacts arranged at a predetermined interval in the one direction, facing the first contacts at intervals on the plane. In the DIP type semiconductor device socket having a contactor, the first and second contacts are D.
A socket for a DIP type semiconductor device, characterized in that it is long in a direction perpendicular to the one direction so as to match each mil size of the IP type semiconductor device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24889U JPH0291186U (en) | 1989-01-04 | 1989-01-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24889U JPH0291186U (en) | 1989-01-04 | 1989-01-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0291186U true JPH0291186U (en) | 1990-07-19 |
Family
ID=31199106
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24889U Pending JPH0291186U (en) | 1989-01-04 | 1989-01-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0291186U (en) |
-
1989
- 1989-01-04 JP JP24889U patent/JPH0291186U/ja active Pending
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