JPH0290508A - シリコンの接合方法 - Google Patents

シリコンの接合方法

Info

Publication number
JPH0290508A
JPH0290508A JP24347788A JP24347788A JPH0290508A JP H0290508 A JPH0290508 A JP H0290508A JP 24347788 A JP24347788 A JP 24347788A JP 24347788 A JP24347788 A JP 24347788A JP H0290508 A JPH0290508 A JP H0290508A
Authority
JP
Japan
Prior art keywords
bonding
silicon
melting point
thin film
low melting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP24347788A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0581167B2 (OSRAM
Inventor
Masaki Esashi
正喜 江刺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Science and Technology Agency
Original Assignee
Research Development Corp of Japan
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Research Development Corp of Japan filed Critical Research Development Corp of Japan
Priority to JP24347788A priority Critical patent/JPH0290508A/ja
Publication of JPH0290508A publication Critical patent/JPH0290508A/ja
Publication of JPH0581167B2 publication Critical patent/JPH0581167B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10158—Shape being other than a cuboid at the passive surface

Landscapes

  • Measuring Fluid Pressure (AREA)
  • Micromachines (AREA)
  • Pressure Sensors (AREA)
  • Die Bonding (AREA)
JP24347788A 1988-09-27 1988-09-27 シリコンの接合方法 Granted JPH0290508A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24347788A JPH0290508A (ja) 1988-09-27 1988-09-27 シリコンの接合方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24347788A JPH0290508A (ja) 1988-09-27 1988-09-27 シリコンの接合方法

Publications (2)

Publication Number Publication Date
JPH0290508A true JPH0290508A (ja) 1990-03-30
JPH0581167B2 JPH0581167B2 (OSRAM) 1993-11-11

Family

ID=17104471

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24347788A Granted JPH0290508A (ja) 1988-09-27 1988-09-27 シリコンの接合方法

Country Status (1)

Country Link
JP (1) JPH0290508A (OSRAM)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5496199A (en) * 1993-01-25 1996-03-05 Nec Corporation Electron beam radiator with cold cathode integral with focusing grid member and process of fabrication thereof
WO2015098324A1 (ja) * 2013-12-25 2015-07-02 日立オートモティブシステムズ株式会社 圧力測定装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5496199A (en) * 1993-01-25 1996-03-05 Nec Corporation Electron beam radiator with cold cathode integral with focusing grid member and process of fabrication thereof
US5514847A (en) * 1993-01-25 1996-05-07 Nec Corporation Electron beam radiator with cold cathode integral with focusing grid member and process of fabrication thereof
WO2015098324A1 (ja) * 2013-12-25 2015-07-02 日立オートモティブシステムズ株式会社 圧力測定装置
JPWO2015098324A1 (ja) * 2013-12-25 2017-03-23 日立オートモティブシステムズ株式会社 圧力測定装置
US10139300B2 (en) 2013-12-25 2018-11-27 Hitachi Automotive Systems, Ltd. High pressure strain detection device with a base made of a first brittle material and a strain detection element bonded to the base via a second brittle material

Also Published As

Publication number Publication date
JPH0581167B2 (OSRAM) 1993-11-11

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